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AU2003235919A1 - Lapping device and lapping work method - Google Patents

Lapping device and lapping work method

Info

Publication number
AU2003235919A1
AU2003235919A1 AU2003235919A AU2003235919A AU2003235919A1 AU 2003235919 A1 AU2003235919 A1 AU 2003235919A1 AU 2003235919 A AU2003235919 A AU 2003235919A AU 2003235919 A AU2003235919 A AU 2003235919A AU 2003235919 A1 AU2003235919 A1 AU 2003235919A1
Authority
AU
Australia
Prior art keywords
lapping
work method
lapping device
lapping work
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003235919A
Inventor
Kazumasa Ohnishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2003235919A1 publication Critical patent/AU2003235919A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2003235919A 2002-05-09 2003-05-09 Lapping device and lapping work method Abandoned AU2003235919A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002-170668 2002-05-09
JP2002170668 2002-05-09
JP2002199269 2002-06-05
JP2002-199269 2002-06-05
PCT/JP2003/005843 WO2003095144A1 (en) 2002-05-09 2003-05-09 Lapping device and lapping work method

Publications (1)

Publication Number Publication Date
AU2003235919A1 true AU2003235919A1 (en) 2003-11-11

Family

ID=29422480

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003235919A Abandoned AU2003235919A1 (en) 2002-05-09 2003-05-09 Lapping device and lapping work method

Country Status (3)

Country Link
JP (1) JPWO2003095144A1 (en)
AU (1) AU2003235919A1 (en)
WO (1) WO2003095144A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102211297B (en) * 2011-05-31 2013-12-25 北京航空航天大学 Method and device for composite vibration grinding based on ultrasonic high frequency and pneumatic low frequency
KR102116510B1 (en) * 2019-03-08 2020-05-28 에스케이실트론 주식회사 Wafer Lapping Apparatus
CN111482347B (en) * 2020-04-15 2021-08-10 南京航空航天大学 Ultrasonic vibration platform for machining large parts and operation process thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3112542B2 (en) * 1992-01-24 2000-11-27 オリンパス光学工業株式会社 Ultrasonic polishing equipment
JP3353510B2 (en) * 1994-04-21 2002-12-03 ソニー株式会社 Chemical mechanical polishing method, chemical mechanical polishing apparatus, and semiconductor device manufacturing method using the same
JPH10156706A (en) * 1996-11-27 1998-06-16 Speedfam Co Ltd Device and method for polishing
JPH11129155A (en) * 1997-10-30 1999-05-18 Nikon Corp CMP polishing equipment
JP2000218514A (en) * 1999-02-02 2000-08-08 Nikon Corp Polishing apparatus and polishing method

Also Published As

Publication number Publication date
WO2003095144A1 (en) 2003-11-20
JPWO2003095144A1 (en) 2005-09-08

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase
TH Corrigenda

Free format text: IN VOL 18, NO 2, PAGE(S) 563 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME OHNISHI, K., APPLICATION NO. 2003235919, UNDER INID (43) CORRECT THE PUBLICATION DATE TO READ 24.11.2003