AU2003235748A1 - Method for cleaning an article - Google Patents
Method for cleaning an articleInfo
- Publication number
- AU2003235748A1 AU2003235748A1 AU2003235748A AU2003235748A AU2003235748A1 AU 2003235748 A1 AU2003235748 A1 AU 2003235748A1 AU 2003235748 A AU2003235748 A AU 2003235748A AU 2003235748 A AU2003235748 A AU 2003235748A AU 2003235748 A1 AU2003235748 A1 AU 2003235748A1
- Authority
- AU
- Australia
- Prior art keywords
- article
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004140 cleaning Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/06—Hydroxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/28—Organic compounds containing halogen
- C11D7/30—Halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34650702P | 2002-01-07 | 2002-01-07 | |
| US60/346,507 | 2002-01-07 | ||
| PCT/US2003/000529 WO2003057377A1 (en) | 2002-01-07 | 2003-01-07 | Method for cleaning an article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003235748A1 true AU2003235748A1 (en) | 2003-07-24 |
Family
ID=23359727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003235748A Abandoned AU2003235748A1 (en) | 2002-01-07 | 2003-01-07 | Method for cleaning an article |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP1472017A4 (en) |
| JP (1) | JP2005515619A (en) |
| KR (1) | KR20040073548A (en) |
| CN (1) | CN1741863A (en) |
| AU (1) | AU2003235748A1 (en) |
| CA (1) | CA2472478A1 (en) |
| TW (1) | TWI291200B (en) |
| WO (1) | WO2003057377A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6905555B2 (en) * | 2001-02-15 | 2005-06-14 | Micell Technologies, Inc. | Methods for transferring supercritical fluids in microelectronic and other industrial processes |
| JP2004363404A (en) * | 2003-06-05 | 2004-12-24 | Nippon Telegr & Teleph Corp <Ntt> | Supercritical drying method |
| DE102004029077B4 (en) * | 2003-06-26 | 2010-07-22 | Samsung Electronics Co., Ltd., Suwon | Apparatus and method for removing a photoresist from a substrate |
| US20050288485A1 (en) * | 2004-06-24 | 2005-12-29 | Mahl Jerry M | Method and apparatus for pretreatment of polymeric materials utilized in carbon dioxide purification, delivery and storage systems |
| JP5521193B2 (en) * | 2010-01-20 | 2014-06-11 | 学校法人千葉工業大学 | Method for extracting hydrogen from gas fossil fuel |
| CN103068496B (en) * | 2010-08-06 | 2016-04-13 | 英派尔科技开发有限公司 | Overcritical inert gas and cleaning method |
| KR101395225B1 (en) * | 2010-11-25 | 2014-05-15 | 세메스 주식회사 | Method for treating substrate |
| KR101187375B1 (en) | 2011-01-27 | 2012-10-05 | 부경대학교 산학협력단 | Apparatus for etching silicon oxide layer of semiconductor substrate |
| US10525416B2 (en) * | 2017-05-16 | 2020-01-07 | Tokyo Electron Limited | Method of liquid filter wetting |
| CN108598019A (en) * | 2018-04-17 | 2018-09-28 | 德淮半导体有限公司 | Wafer cleaning equipment and its cleaning method |
| CN111744870A (en) * | 2020-06-24 | 2020-10-09 | 中国科学院苏州纳米技术与纳米仿生研究所广东(佛山)研究院 | A kind of cleaning method after gold-tin soldering of semiconductor device |
| CN114078692B (en) * | 2022-01-07 | 2024-02-20 | 浙江大学杭州国际科创中心 | Wafer cleaning method and wafer cleaning equipment |
| CN114798602B (en) * | 2022-04-26 | 2024-01-23 | 四川博腾创达智能科技有限公司 | Method for cleaning particle pollutants |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4911761A (en) * | 1984-05-21 | 1990-03-27 | Cfm Technologies Research Associates | Process and apparatus for drying surfaces |
| US5370742A (en) * | 1992-07-13 | 1994-12-06 | The Clorox Company | Liquid/supercritical cleaning with decreased polymer damage |
| US5267455A (en) * | 1992-07-13 | 1993-12-07 | The Clorox Company | Liquid/supercritical carbon dioxide dry cleaning system |
| US5556479A (en) * | 1994-07-15 | 1996-09-17 | Verteq, Inc. | Method and apparatus for drying semiconductor wafers |
| DE69610652T2 (en) * | 1995-01-26 | 2001-05-10 | Texas Instruments Inc., Dallas | Process for removing surface contamination |
| US5783082A (en) * | 1995-11-03 | 1998-07-21 | University Of North Carolina | Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants |
| US5868862A (en) * | 1996-08-01 | 1999-02-09 | Texas Instruments Incorporated | Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media |
| US6306564B1 (en) * | 1997-05-27 | 2001-10-23 | Tokyo Electron Limited | Removal of resist or residue from semiconductors using supercritical carbon dioxide |
| AU742586B2 (en) * | 1997-05-30 | 2002-01-10 | Micell Technologies | Surface treatment |
| US6454869B1 (en) * | 2001-06-27 | 2002-09-24 | International Business Machines Corporation | Process of cleaning semiconductor processing, handling and manufacturing equipment |
-
2003
- 2003-01-07 KR KR10-2004-7010594A patent/KR20040073548A/en not_active Ceased
- 2003-01-07 WO PCT/US2003/000529 patent/WO2003057377A1/en not_active Ceased
- 2003-01-07 EP EP03729378A patent/EP1472017A4/en not_active Withdrawn
- 2003-01-07 CA CA002472478A patent/CA2472478A1/en not_active Abandoned
- 2003-01-07 CN CNA038054426A patent/CN1741863A/en active Pending
- 2003-01-07 AU AU2003235748A patent/AU2003235748A1/en not_active Abandoned
- 2003-01-07 JP JP2003557723A patent/JP2005515619A/en active Pending
- 2003-01-08 TW TW092100342A patent/TWI291200B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1741863A (en) | 2006-03-01 |
| JP2005515619A (en) | 2005-05-26 |
| CA2472478A1 (en) | 2003-07-17 |
| EP1472017A4 (en) | 2007-03-21 |
| TW200412631A (en) | 2004-07-16 |
| EP1472017A1 (en) | 2004-11-03 |
| TWI291200B (en) | 2007-12-11 |
| KR20040073548A (en) | 2004-08-19 |
| WO2003057377A1 (en) | 2003-07-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |