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AU2003227042A1 - Method for producing micro-mechanical components and components produced according to said method - Google Patents

Method for producing micro-mechanical components and components produced according to said method

Info

Publication number
AU2003227042A1
AU2003227042A1 AU2003227042A AU2003227042A AU2003227042A1 AU 2003227042 A1 AU2003227042 A1 AU 2003227042A1 AU 2003227042 A AU2003227042 A AU 2003227042A AU 2003227042 A AU2003227042 A AU 2003227042A AU 2003227042 A1 AU2003227042 A1 AU 2003227042A1
Authority
AU
Australia
Prior art keywords
components
produced according
producing micro
mechanical components
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003227042A
Other versions
AU2003227042A8 (en
Inventor
Mike Becker
Wolfgang Benecke
Josef Binder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universitaet Bremen
Original Assignee
Universitaet Bremen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universitaet Bremen filed Critical Universitaet Bremen
Publication of AU2003227042A1 publication Critical patent/AU2003227042A1/en
Publication of AU2003227042A8 publication Critical patent/AU2003227042A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0003—Constructional types of microvalves; Details of the cutting-off member
    • F16K99/0005—Lift valves
    • F16K99/0007—Lift valves of cantilever type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0034—Operating means specially adapted for microvalves
    • F16K99/0042—Electric operating means therefor
    • F16K99/0051—Electric operating means therefor using electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/031—Thermal actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/054—Microvalves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161—Controlling physical properties of the material
    • B81C2201/0163—Controlling internal stress of deposited layers
    • B81C2201/0169—Controlling internal stress of deposited layers by post-annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0181—Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K2099/0073—Fabrication methods specifically adapted for microvalves
    • F16K2099/0074—Fabrication methods specifically adapted for microvalves using photolithography, e.g. etching
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K2099/0073—Fabrication methods specifically adapted for microvalves
    • F16K2099/008—Multi-layer fabrications

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Micromachines (AREA)
  • Springs (AREA)
  • ing And Chemical Polishing (AREA)
AU2003227042A 2002-03-08 2003-03-10 Method for producing micro-mechanical components and components produced according to said method Abandoned AU2003227042A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE2002110344 DE10210344A1 (en) 2002-03-08 2002-03-08 Method for producing micromechanical components and components produced using the method
DE10210344.5 2002-03-08
PCT/EP2003/002435 WO2003076331A2 (en) 2002-03-08 2003-03-10 Method for producing micro-mechanical components and components produced according to said method

Publications (2)

Publication Number Publication Date
AU2003227042A1 true AU2003227042A1 (en) 2003-09-22
AU2003227042A8 AU2003227042A8 (en) 2003-09-22

Family

ID=27797622

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003227042A Abandoned AU2003227042A1 (en) 2002-03-08 2003-03-10 Method for producing micro-mechanical components and components produced according to said method

Country Status (3)

Country Link
AU (1) AU2003227042A1 (en)
DE (1) DE10210344A1 (en)
WO (1) WO2003076331A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004008009A1 (en) 2003-12-23 2005-07-28 Robert Bosch Gmbh Integrated microvalve and method of making a microvalve
DE102008014707B3 (en) * 2008-03-18 2009-07-23 Hugo Kern Und Liebers Gmbh & Co. Kg Spring plate manufacturing method, involves transmitting plate with positioned tongue into working container for slide grinding front surfaces of tongue, removing spring plate from container, and leading back tongue into initial position
US20110073788A1 (en) * 2009-09-30 2011-03-31 Marcus Michael A Microvalve for control of compressed fluids
US20110073188A1 (en) * 2009-09-30 2011-03-31 Marcus Michael A Microvalve for control of compressed fluids
MY155726A (en) * 2011-11-01 2015-11-17 Mimos Berhad A microfluidic system and method thereof
BE1021436B1 (en) * 2012-10-26 2015-11-20 Francis Henry De Frahan MECHANICAL DEVICE THAT ADJUSTS THE FLOW OF FLUIDS.
DE102016203024A1 (en) * 2016-02-26 2017-08-31 Zf Friedrichshafen Ag Electromagnetic valve with spring tongues
DE102023202097A1 (en) * 2023-03-09 2024-09-12 Robert Bosch Gesellschaft mit beschränkter Haftung Method and device for producing a MEMS component
DE102023207523A1 (en) * 2023-08-04 2025-02-06 Robert Bosch Gesellschaft mit beschränkter Haftung MEMS component with a diaphragm spring and method for producing a diaphragm spring
DE102023208537A1 (en) * 2023-09-05 2025-03-06 Robert Bosch Gesellschaft mit beschränkter Haftung Microelectromechanical spring structure, microelectromechanical device, microelectromechanical inertial sensor and method for producing a microelectromechanical spring structure

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3235714A1 (en) * 1982-09-27 1984-03-29 Siemens AG, 1000 Berlin und 8000 München METHOD AND DEVICE FOR ADJUSTING CONTACT SPRINGS IN A RELAY
JP2623817B2 (en) * 1989-02-20 1997-06-25 富士通株式会社 Bending method and bending apparatus using laser beam
JP2878810B2 (en) * 1990-09-07 1999-04-05 富士通株式会社 Spring pressure control method and apparatus for leaf spring
US5176358A (en) * 1991-08-08 1993-01-05 Honeywell Inc. Microstructure gas valve control
US5325880A (en) * 1993-04-19 1994-07-05 Tini Alloy Company Shape memory alloy film actuated microvalve
WO1996010833A1 (en) * 1994-10-04 1996-04-11 Philips Electronics N.V. Method of adjusting the switch-gap in a reed switch
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
JP2796622B2 (en) * 1996-03-07 1998-09-10 セイコーインスツルメンツ株式会社 Fine processing method and fine processing structure
DE19736674C1 (en) * 1997-08-22 1998-11-26 Siemens Ag Micromechanical electrostatic relay
US6908770B1 (en) * 1998-07-16 2005-06-21 Board Of Regents, The University Of Texas System Fluid based analysis of multiple analytes by a sensor array
JP4042244B2 (en) * 1999-02-23 2008-02-06 松下電工株式会社 Semiconductor microactuator, semiconductor microvalve, and semiconductor microrelay

Also Published As

Publication number Publication date
WO2003076331A2 (en) 2003-09-18
WO2003076331A3 (en) 2004-08-05
DE10210344A1 (en) 2003-10-02
AU2003227042A8 (en) 2003-09-22

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase