AU2003217530A1 - Apparatus and method for depositing organic matter of vapor phase - Google Patents
Apparatus and method for depositing organic matter of vapor phaseInfo
- Publication number
- AU2003217530A1 AU2003217530A1 AU2003217530A AU2003217530A AU2003217530A1 AU 2003217530 A1 AU2003217530 A1 AU 2003217530A1 AU 2003217530 A AU2003217530 A AU 2003217530A AU 2003217530 A AU2003217530 A AU 2003217530A AU 2003217530 A1 AU2003217530 A1 AU 2003217530A1
- Authority
- AU
- Australia
- Prior art keywords
- organic matter
- vapor phase
- depositing organic
- depositing
- vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000151 deposition Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000005416 organic matter Substances 0.000 title 1
- 239000012808 vapor phase Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45587—Mechanical means for changing the gas flow
- C23C16/45589—Movable means, e.g. fans
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4485—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020017755A KR100358727B1 (en) | 2002-04-01 | 2002-04-01 | Apparatus and method for depositing organic matter of vapor phase |
| KR10-2002-0017755 | 2002-04-01 | ||
| KR10-2002-0061629A KR100375076B1 (en) | 2002-10-10 | 2002-10-10 | Apparatus and method for manufacturing the organic semiconductor device with a large size of substrate |
| KR10-2002-0061629 | 2002-10-10 | ||
| PCT/KR2003/000605 WO2003083169A1 (en) | 2002-04-01 | 2003-03-27 | Apparatus and method for depositing organic matter of vapor phase |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003217530A1 true AU2003217530A1 (en) | 2003-10-13 |
Family
ID=28677688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003217530A Abandoned AU2003217530A1 (en) | 2002-04-01 | 2003-03-27 | Apparatus and method for depositing organic matter of vapor phase |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP3962349B2 (en) |
| CN (1) | CN1218372C (en) |
| AU (1) | AU2003217530A1 (en) |
| TW (1) | TW200304956A (en) |
| WO (1) | WO2003083169A1 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7238389B2 (en) * | 2004-03-22 | 2007-07-03 | Eastman Kodak Company | Vaporizing fluidized organic materials |
| US20060099344A1 (en) * | 2004-11-09 | 2006-05-11 | Eastman Kodak Company | Controlling the vaporization of organic material |
| US7989021B2 (en) * | 2005-07-27 | 2011-08-02 | Global Oled Technology Llc | Vaporizing material at a uniform rate |
| TWI386516B (en) * | 2005-10-28 | 2013-02-21 | Hon Hai Prec Ind Co Ltd | Apparatus for fabrication of carbon nanotubes |
| DE102006023046B4 (en) * | 2006-05-17 | 2009-02-05 | Qimonda Ag | Method and starting material for providing a gaseous precursor |
| KR101028044B1 (en) * | 2007-09-04 | 2011-04-08 | 주식회사 테라세미콘 | Source gas supply device |
| CN102575347B (en) * | 2009-10-05 | 2014-02-26 | 东京毅力科创株式会社 | Film forming device, film forming head and film forming method |
| JP5452178B2 (en) * | 2009-11-12 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | Vacuum deposition apparatus, vacuum deposition method, and organic EL display device manufacturing method |
| KR101479528B1 (en) * | 2010-09-03 | 2015-01-07 | 울박, 인크 | Protective film forming method, and surface flattening method |
| JP5570939B2 (en) * | 2010-10-21 | 2014-08-13 | 株式会社アルバック | Thin film forming apparatus and thin film forming method |
| CN104911565B (en) * | 2014-03-11 | 2017-12-22 | 中微半导体设备(上海)有限公司 | A kind of chemical vapor deposition unit |
| CN105339522B (en) * | 2014-06-12 | 2018-08-10 | 深圳市大富精工有限公司 | A vacuum coating device and a vacuum coating method |
| DE202014106226U1 (en) | 2014-09-30 | 2015-10-28 | Osram Oled Gmbh | Organic electronic component |
| WO2016070941A1 (en) * | 2014-11-07 | 2016-05-12 | Applied Materials, Inc. | Material source arrangment and nozzle for vacuum deposition |
| CN114016129B (en) * | 2021-10-09 | 2023-03-24 | 山东有研国晶辉新材料有限公司 | Novel zinc selenide growth method |
| CN114934265B (en) * | 2022-05-26 | 2023-03-07 | 中国科学院长春光学精密机械与物理研究所 | Film growth device and method and vanadium dioxide film growth method |
| CN114705789B (en) * | 2022-06-06 | 2022-09-02 | 中科阿斯迈(江苏)检验检测有限公司 | Gas chromatography device for laboratory detection |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61291965A (en) * | 1985-06-18 | 1986-12-22 | Fujitsu Ltd | Superhigh-vacuum chamber |
| JPH0774450B2 (en) * | 1987-12-22 | 1995-08-09 | 日電アネルバ株式会社 | Surface treatment equipment |
| JPH04236769A (en) * | 1991-01-17 | 1992-08-25 | Ulvac Japan Ltd | Film forming device |
| JPH07243025A (en) * | 1994-03-03 | 1995-09-19 | Kobe Steel Ltd | Surface treated material excellent in design characteristic and its production |
| JPH07321057A (en) * | 1994-05-23 | 1995-12-08 | Nippon Steel Corp | Deposition system for semiconductor devices |
| WO1997008356A2 (en) * | 1995-08-18 | 1997-03-06 | The Regents Of The University Of California | Modified metalorganic chemical vapor deposition of group iii-v thin layers |
| JPH1197433A (en) * | 1997-09-18 | 1999-04-09 | Nec Yamagata Ltd | Atmospheric-pressure cvd equipment |
| JPH11293461A (en) * | 1998-04-16 | 1999-10-26 | Matsushita Electric Ind Co Ltd | Oxide vapor deposition and deposited thin films |
| US6368665B1 (en) * | 1998-04-29 | 2002-04-09 | Microcoating Technologies, Inc. | Apparatus and process for controlled atmosphere chemical vapor deposition |
| JP2000216095A (en) * | 1999-01-20 | 2000-08-04 | Tokyo Electron Ltd | Single wafer processing type heat treating apparatus |
| JP4487338B2 (en) * | 1999-08-31 | 2010-06-23 | 東京エレクトロン株式会社 | Film forming apparatus and film forming method |
| EP1167566B1 (en) * | 2000-06-22 | 2011-01-26 | Panasonic Electric Works Co., Ltd. | Apparatus for and method of vacuum vapor deposition |
| JP4980204B2 (en) * | 2007-11-29 | 2012-07-18 | 日揮触媒化成株式会社 | Method for producing titanium oxide-based deodorant |
-
2003
- 2003-03-27 AU AU2003217530A patent/AU2003217530A1/en not_active Abandoned
- 2003-03-27 WO PCT/KR2003/000605 patent/WO2003083169A1/en not_active Ceased
- 2003-03-31 JP JP2003097183A patent/JP3962349B2/en not_active Expired - Fee Related
- 2003-03-31 TW TW92107266A patent/TW200304956A/en unknown
- 2003-03-31 CN CN 03121565 patent/CN1218372C/en not_active Expired - Fee Related
-
2006
- 2006-11-16 JP JP2006309862A patent/JP2007146292A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003293140A (en) | 2003-10-15 |
| CN1450610A (en) | 2003-10-22 |
| TW200304956A (en) | 2003-10-16 |
| JP2007146292A (en) | 2007-06-14 |
| CN1218372C (en) | 2005-09-07 |
| WO2003083169A1 (en) | 2003-10-09 |
| JP3962349B2 (en) | 2007-08-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |