AU2003206246A1 - Cluster type asher equipment used for manufacture of semiconductor device - Google Patents
Cluster type asher equipment used for manufacture of semiconductor deviceInfo
- Publication number
- AU2003206246A1 AU2003206246A1 AU2003206246A AU2003206246A AU2003206246A1 AU 2003206246 A1 AU2003206246 A1 AU 2003206246A1 AU 2003206246 A AU2003206246 A AU 2003206246A AU 2003206246 A AU2003206246 A AU 2003206246A AU 2003206246 A1 AU2003206246 A1 AU 2003206246A1
- Authority
- AU
- Australia
- Prior art keywords
- manufacture
- semiconductor device
- equipment used
- cluster type
- type asher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/427—Stripping or agents therefor using plasma means only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020078996A KR100382245B1 (en) | 2002-12-12 | 2002-12-12 | Asher equipment for semiconductor device manufacturing including cluster method |
| KR10-2002-0078996 | 2002-12-12 | ||
| PCT/KR2003/000283 WO2004053969A1 (en) | 2002-12-12 | 2003-02-10 | Cluster type asher equipment used for manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003206246A1 true AU2003206246A1 (en) | 2004-06-30 |
Family
ID=32501370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003206246A Abandoned AU2003206246A1 (en) | 2002-12-12 | 2003-02-10 | Cluster type asher equipment used for manufacture of semiconductor device |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP2006502591A (en) |
| KR (1) | KR100382245B1 (en) |
| CN (1) | CN100350568C (en) |
| AU (1) | AU2003206246A1 (en) |
| SG (1) | SG127690A1 (en) |
| TW (1) | TWI240349B (en) |
| WO (1) | WO2004053969A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004036803A1 (en) | 2004-07-29 | 2006-03-23 | Robert Bosch Gmbh | Method for etching a layer on a substrate |
| KR100896472B1 (en) * | 2007-02-28 | 2009-05-14 | 세메스 주식회사 | Multi-chamber system and substrate processing method for semiconductor device manufacturing |
| KR101330225B1 (en) * | 2012-05-25 | 2013-11-18 | 피에스케이 주식회사 | Method for bonding of substrate and substrate reflow treatment apparatus |
| CN113097047B (en) * | 2021-03-10 | 2022-04-22 | 长江存储科技有限责任公司 | Ashing apparatus and ashing method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5286296A (en) * | 1991-01-10 | 1994-02-15 | Sony Corporation | Multi-chamber wafer process equipment having plural, physically communicating transfer means |
| JP3136615B2 (en) * | 1991-01-10 | 2001-02-19 | ソニー株式会社 | Multi-chamber process apparatus and semiconductor device manufacturing method |
| US6481956B1 (en) * | 1995-10-27 | 2002-11-19 | Brooks Automation Inc. | Method of transferring substrates with two different substrate holding end effectors |
| JP3454034B2 (en) * | 1996-09-13 | 2003-10-06 | 株式会社日立製作所 | Vacuum processing equipment |
| US6478532B1 (en) * | 1999-11-30 | 2002-11-12 | Asyst Technologies, Inc. | Wafer orienting and reading mechanism |
| US6852194B2 (en) * | 2001-05-21 | 2005-02-08 | Tokyo Electron Limited | Processing apparatus, transferring apparatus and transferring method |
-
2002
- 2002-12-12 KR KR1020020078996A patent/KR100382245B1/en not_active Expired - Fee Related
-
2003
- 2003-02-10 CN CNB038186101A patent/CN100350568C/en not_active Expired - Fee Related
- 2003-02-10 WO PCT/KR2003/000283 patent/WO2004053969A1/en not_active Ceased
- 2003-02-10 AU AU2003206246A patent/AU2003206246A1/en not_active Abandoned
- 2003-02-10 JP JP2004558499A patent/JP2006502591A/en active Pending
- 2003-02-19 TW TW92103457A patent/TWI240349B/en not_active IP Right Cessation
- 2003-03-05 SG SG200301143A patent/SG127690A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR100382245B1 (en) | 2003-05-01 |
| WO2004053969A1 (en) | 2004-06-24 |
| TW200410354A (en) | 2004-06-16 |
| CN100350568C (en) | 2007-11-21 |
| JP2006502591A (en) | 2006-01-19 |
| SG127690A1 (en) | 2006-12-29 |
| TWI240349B (en) | 2005-09-21 |
| CN1675748A (en) | 2005-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2003300399A1 (en) | Well regions of semiconductor devices | |
| EP1416529B8 (en) | Manufacturing method of semiconductor device | |
| EP2175487B8 (en) | Semiconductor device | |
| AU2003226646A1 (en) | Semiconductor device | |
| EP1350588A3 (en) | Method of manufacturing semiconductor device | |
| AU2003246348A1 (en) | Method for dividing semiconductor wafer | |
| AU2003248339A1 (en) | Method for dividing semiconductor wafer | |
| AU2003234812A1 (en) | Semiconductor device | |
| AU2003303014A1 (en) | Manufacture of trench-gate semiconductor devices | |
| AU2002329197A1 (en) | Trench structure for semiconductor devices | |
| AU2003263727A1 (en) | Fabrication of semiconductor devices | |
| AU2003241057A1 (en) | Lateral semiconductor device | |
| AU2002330511A1 (en) | Semiconductor calculation device | |
| AU2002338003A1 (en) | Semiconductor Devices | |
| AU2003252371A1 (en) | Semiconductor device | |
| AU2002320060A1 (en) | Method for isolating semiconductor devices | |
| AU2003242347A1 (en) | Semiconductor device | |
| AU2003227213A1 (en) | Semiconductor device | |
| AUPS112202A0 (en) | Semiconductor manufacture | |
| AU2003212469A1 (en) | Method for processing multiple semiconductor devices for test | |
| AU2003292701A1 (en) | Semiconductor device | |
| AU2003248343A1 (en) | Process for producing semiconductor device | |
| AU2002355049A1 (en) | Semiconductor device | |
| AU2003301120A1 (en) | Method for passivating semiconductor devices | |
| AU2003261857A1 (en) | Semiconductor device manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |