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AU2003206246A1 - Cluster type asher equipment used for manufacture of semiconductor device - Google Patents

Cluster type asher equipment used for manufacture of semiconductor device

Info

Publication number
AU2003206246A1
AU2003206246A1 AU2003206246A AU2003206246A AU2003206246A1 AU 2003206246 A1 AU2003206246 A1 AU 2003206246A1 AU 2003206246 A AU2003206246 A AU 2003206246A AU 2003206246 A AU2003206246 A AU 2003206246A AU 2003206246 A1 AU2003206246 A1 AU 2003206246A1
Authority
AU
Australia
Prior art keywords
manufacture
semiconductor device
equipment used
cluster type
type asher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003206246A
Inventor
Kyoung-Soo Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PSK Inc
Original Assignee
PSK Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PSK Inc filed Critical PSK Inc
Publication of AU2003206246A1 publication Critical patent/AU2003206246A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/427Stripping or agents therefor using plasma means only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67294Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
AU2003206246A 2002-12-12 2003-02-10 Cluster type asher equipment used for manufacture of semiconductor device Abandoned AU2003206246A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020020078996A KR100382245B1 (en) 2002-12-12 2002-12-12 Asher equipment for semiconductor device manufacturing including cluster method
KR10-2002-0078996 2002-12-12
PCT/KR2003/000283 WO2004053969A1 (en) 2002-12-12 2003-02-10 Cluster type asher equipment used for manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
AU2003206246A1 true AU2003206246A1 (en) 2004-06-30

Family

ID=32501370

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003206246A Abandoned AU2003206246A1 (en) 2002-12-12 2003-02-10 Cluster type asher equipment used for manufacture of semiconductor device

Country Status (7)

Country Link
JP (1) JP2006502591A (en)
KR (1) KR100382245B1 (en)
CN (1) CN100350568C (en)
AU (1) AU2003206246A1 (en)
SG (1) SG127690A1 (en)
TW (1) TWI240349B (en)
WO (1) WO2004053969A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004036803A1 (en) 2004-07-29 2006-03-23 Robert Bosch Gmbh Method for etching a layer on a substrate
KR100896472B1 (en) * 2007-02-28 2009-05-14 세메스 주식회사 Multi-chamber system and substrate processing method for semiconductor device manufacturing
KR101330225B1 (en) * 2012-05-25 2013-11-18 피에스케이 주식회사 Method for bonding of substrate and substrate reflow treatment apparatus
CN113097047B (en) * 2021-03-10 2022-04-22 长江存储科技有限责任公司 Ashing apparatus and ashing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5286296A (en) * 1991-01-10 1994-02-15 Sony Corporation Multi-chamber wafer process equipment having plural, physically communicating transfer means
JP3136615B2 (en) * 1991-01-10 2001-02-19 ソニー株式会社 Multi-chamber process apparatus and semiconductor device manufacturing method
US6481956B1 (en) * 1995-10-27 2002-11-19 Brooks Automation Inc. Method of transferring substrates with two different substrate holding end effectors
JP3454034B2 (en) * 1996-09-13 2003-10-06 株式会社日立製作所 Vacuum processing equipment
US6478532B1 (en) * 1999-11-30 2002-11-12 Asyst Technologies, Inc. Wafer orienting and reading mechanism
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method

Also Published As

Publication number Publication date
KR100382245B1 (en) 2003-05-01
WO2004053969A1 (en) 2004-06-24
TW200410354A (en) 2004-06-16
CN100350568C (en) 2007-11-21
JP2006502591A (en) 2006-01-19
SG127690A1 (en) 2006-12-29
TWI240349B (en) 2005-09-21
CN1675748A (en) 2005-09-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase