AU2003282852A1 - A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces - Google Patents
A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfacesInfo
- Publication number
- AU2003282852A1 AU2003282852A1 AU2003282852A AU2003282852A AU2003282852A1 AU 2003282852 A1 AU2003282852 A1 AU 2003282852A1 AU 2003282852 A AU2003282852 A AU 2003282852A AU 2003282852 A AU2003282852 A AU 2003282852A AU 2003282852 A1 AU2003282852 A1 AU 2003282852A1
- Authority
- AU
- Australia
- Prior art keywords
- polishing
- chemical mechanical
- copper surfaces
- mechanical polishing
- corrosion retarding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005498 polishing Methods 0.000 title 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 230000007797 corrosion Effects 0.000 title 1
- 238000005260 corrosion Methods 0.000 title 1
- 230000000979 retarding effect Effects 0.000 title 1
- 239000002002 slurry Substances 0.000 title 1
- 239000000126 substance Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42037102P | 2002-10-22 | 2002-10-22 | |
| US60/420,371 | 2002-10-22 | ||
| PCT/US2003/032691 WO2004037937A1 (en) | 2002-10-22 | 2003-10-14 | A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003282852A1 true AU2003282852A1 (en) | 2004-05-13 |
Family
ID=32176559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003282852A Abandoned AU2003282852A1 (en) | 2002-10-22 | 2003-10-14 | A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1567606A1 (en) |
| JP (1) | JP2006504270A (en) |
| CN (1) | CN1705725A (en) |
| AU (1) | AU2003282852A1 (en) |
| WO (1) | WO2004037937A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050266226A1 (en) * | 2000-11-29 | 2005-12-01 | Psiloquest | Chemical mechanical polishing pad and method for selective metal and barrier polishing |
| US20050279733A1 (en) * | 2004-06-18 | 2005-12-22 | Cabot Microelectronics Corporation | CMP composition for improved oxide removal rate |
| US20060084271A1 (en) * | 2004-10-20 | 2006-04-20 | Yang Andy C | Systems, methods and slurries for chemical mechanical polishing |
| JP5234916B2 (en) * | 2007-01-30 | 2013-07-10 | 東レ株式会社 | Laminated polishing pad |
| US8865013B2 (en) * | 2011-08-15 | 2014-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing tungsten |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5340370A (en) * | 1993-11-03 | 1994-08-23 | Intel Corporation | Slurries for chemical mechanical polishing |
| JPH09132661A (en) * | 1995-11-08 | 1997-05-20 | Hitachi Chem Co Ltd | Production of foam for cmp pad |
| US6039891A (en) * | 1996-09-24 | 2000-03-21 | Cabot Corporation | Multi-oxidizer precursor for chemical mechanical polishing |
| US5993685A (en) * | 1997-04-02 | 1999-11-30 | Advanced Technology Materials | Planarization composition for removing metal films |
| FR2792643B1 (en) * | 1999-04-22 | 2001-07-27 | Clariant France Sa | MECHANICAL AND CHEMICAL POLISHING COMPOSITION OF INSULATING MATERIAL BASED ON LOW DIELECTRIC POLYMER |
| US6740591B1 (en) * | 2000-11-16 | 2004-05-25 | Intel Corporation | Slurry and method for chemical mechanical polishing of copper |
| DE10164262A1 (en) * | 2001-12-27 | 2003-07-17 | Bayer Ag | Composition for the chemical mechanical polishing of metal and metal / dielectric structures |
-
2003
- 2003-10-14 AU AU2003282852A patent/AU2003282852A1/en not_active Abandoned
- 2003-10-14 EP EP03774847A patent/EP1567606A1/en not_active Withdrawn
- 2003-10-14 JP JP2004546879A patent/JP2006504270A/en not_active Withdrawn
- 2003-10-14 WO PCT/US2003/032691 patent/WO2004037937A1/en not_active Ceased
- 2003-10-14 CN CN 200380101871 patent/CN1705725A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006504270A (en) | 2006-02-02 |
| WO2004037937A1 (en) | 2004-05-06 |
| EP1567606A1 (en) | 2005-08-31 |
| CN1705725A (en) | 2005-12-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |