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AU2003275653A1 - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
AU2003275653A1
AU2003275653A1 AU2003275653A AU2003275653A AU2003275653A1 AU 2003275653 A1 AU2003275653 A1 AU 2003275653A1 AU 2003275653 A AU2003275653 A AU 2003275653A AU 2003275653 A AU2003275653 A AU 2003275653A AU 2003275653 A1 AU2003275653 A1 AU 2003275653A1
Authority
AU
Australia
Prior art keywords
polishing apparatus
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003275653A
Inventor
Kazuto Hirokawa
Masayoshi Hirose
Ikutaro Noji
Hozumi Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of AU2003275653A1 publication Critical patent/AU2003275653A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material
    • B24D9/085—Devices for mounting sheets on a backing plate

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2003275653A 2002-11-11 2003-10-24 Polishing apparatus Abandoned AU2003275653A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002327416A JP2004160573A (en) 2002-11-11 2002-11-11 Polishing device
JP2002-327416 2002-11-11
PCT/JP2003/013628 WO2004043648A1 (en) 2002-11-11 2003-10-24 Polishing apparatus

Publications (1)

Publication Number Publication Date
AU2003275653A1 true AU2003275653A1 (en) 2004-06-03

Family

ID=32310518

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003275653A Abandoned AU2003275653A1 (en) 2002-11-11 2003-10-24 Polishing apparatus

Country Status (5)

Country Link
US (1) US20070004324A1 (en)
JP (1) JP2004160573A (en)
AU (1) AU2003275653A1 (en)
TW (1) TW200414966A (en)
WO (1) WO2004043648A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110143539A1 (en) * 2008-05-15 2011-06-16 Rajeev Bajaj Polishing pad with endpoint window and systems and methods using the same
JP5596030B2 (en) 2008-06-26 2014-09-24 スリーエム イノベイティブ プロパティズ カンパニー Polishing pad having porous element and method for producing and using the same
CN102686362A (en) 2009-12-30 2012-09-19 3M创新有限公司 Polishing pads including phase-separated polymer blend and method of making and using the same
WO2012094102A2 (en) * 2011-01-03 2012-07-12 Applied Materials, Inc. Pressure controlled polishing platen
CN102990535A (en) * 2012-11-27 2013-03-27 无锡市彩云机械设备有限公司 Polishing pad
KR102427159B1 (en) * 2015-11-11 2022-08-01 삼성전자주식회사 apparatus for laminating tape film on the substrate and equipment for manufacturing semiconductor device including the same
JP6883475B2 (en) 2017-06-06 2021-06-09 株式会社荏原製作所 Polishing table and polishing equipment equipped with it
KR101987949B1 (en) * 2017-10-16 2019-06-11 세메스 주식회사 Substrate treating apparatus and substarte terathing method
US20210053179A1 (en) * 2019-08-23 2021-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Novel CMP Pad Design and Method of Using the Same
CN115805523A (en) * 2022-12-29 2023-03-17 西安奕斯伟材料科技有限公司 Fixed plate, polishing device and polishing method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
JP3024417B2 (en) * 1992-02-12 2000-03-21 住友金属工業株式会社 Polishing equipment
US6439979B1 (en) * 1992-02-12 2002-08-27 Tokyo Electron Limited Polishing apparatus and polishing method using the same
US5558563A (en) * 1995-02-23 1996-09-24 International Business Machines Corporation Method and apparatus for uniform polishing of a substrate
JP3329644B2 (en) * 1995-07-21 2002-09-30 株式会社東芝 Polishing pad, polishing apparatus and polishing method
JPH106207A (en) * 1996-06-18 1998-01-13 Tokyo Seimitsu Co Ltd Surface plate for polishing device
JP2738392B1 (en) * 1996-11-05 1998-04-08 日本電気株式会社 Polishing apparatus and polishing method for semiconductor device
JPH10156705A (en) * 1996-11-29 1998-06-16 Sumitomo Metal Ind Ltd Polishing apparatus and polishing method
JPH10235552A (en) * 1997-02-24 1998-09-08 Ebara Corp Polishing device
EP0881039B1 (en) * 1997-05-28 2003-04-16 Tokyo Seimitsu Co.,Ltd. Wafer polishing apparatus with retainer ring
US6187681B1 (en) * 1998-10-14 2001-02-13 Micron Technology, Inc. Method and apparatus for planarization of a substrate
JP2001071250A (en) * 1999-07-09 2001-03-21 Applied Materials Inc Fixed polishing belt polisher
US6267659B1 (en) * 2000-05-04 2001-07-31 International Business Machines Corporation Stacked polish pad
JP2002246346A (en) * 2001-02-14 2002-08-30 Hiroshima Nippon Denki Kk Chemical mechanical polishing equipment
US6863771B2 (en) * 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
US6749491B1 (en) * 2001-12-26 2004-06-15 Lam Research Corporation CMP belt stretch compensation apparatus and methods for using the same

Also Published As

Publication number Publication date
TW200414966A (en) 2004-08-16
JP2004160573A (en) 2004-06-10
WO2004043648A1 (en) 2004-05-27
US20070004324A1 (en) 2007-01-04

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase