AU2003267606A1 - Cathode design for use in electrodeposition cell - Google Patents
Cathode design for use in electrodeposition cellInfo
- Publication number
- AU2003267606A1 AU2003267606A1 AU2003267606A AU2003267606A AU2003267606A1 AU 2003267606 A1 AU2003267606 A1 AU 2003267606A1 AU 2003267606 A AU2003267606 A AU 2003267606A AU 2003267606 A AU2003267606 A AU 2003267606A AU 2003267606 A1 AU2003267606 A1 AU 2003267606A1
- Authority
- AU
- Australia
- Prior art keywords
- electrodeposition cell
- cathode design
- cathode
- electrodeposition
- design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004070 electrodeposition Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0222711A GB2393736A (en) | 2002-10-01 | 2002-10-01 | A Cathode for use in an Electroplating Cell |
| GB0222711.4 | 2002-10-01 | ||
| PCT/GB2003/004080 WO2004031454A2 (en) | 2002-10-01 | 2003-09-25 | Cathode design for use in electrodeposition cell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2003267606A8 AU2003267606A8 (en) | 2004-04-23 |
| AU2003267606A1 true AU2003267606A1 (en) | 2004-04-23 |
Family
ID=9945068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003267606A Abandoned AU2003267606A1 (en) | 2002-10-01 | 2003-09-25 | Cathode design for use in electrodeposition cell |
Country Status (4)
| Country | Link |
|---|---|
| AU (1) | AU2003267606A1 (en) |
| GB (1) | GB2393736A (en) |
| TW (1) | TW200408730A (en) |
| WO (1) | WO2004031454A2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6616438B2 (en) * | 2018-02-09 | 2019-12-04 | 田中貴金属工業株式会社 | Feeder |
| CN113136573A (en) * | 2020-01-17 | 2021-07-20 | 先丰通讯股份有限公司 | Chemical deposition system |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61117182A (en) * | 1984-11-08 | 1986-06-04 | 株式会社ブリヂストン | Porous ceramic structure |
| US5262718A (en) * | 1985-08-05 | 1993-11-16 | Raychem Limited | Anisotropically electrically conductive article |
| DE4214905C2 (en) * | 1992-05-05 | 1996-06-27 | Friwo Silberkraft Ges Fuer Bat | Process for metallizing plastic films and their use |
| US5498467A (en) * | 1994-07-26 | 1996-03-12 | W. L. Gore & Associates, Inc. | Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom |
| WO1998019858A1 (en) * | 1996-11-06 | 1998-05-14 | Motorola Inc. | Circuit comprising microstrip conductor and method for making the same |
| US20040146647A1 (en) * | 2001-06-04 | 2004-07-29 | Fixter Gregory Peter Wade | Patterning method |
| GB0113408D0 (en) * | 2001-06-04 | 2001-07-25 | Secr Defence | Autocatalytic coating method |
| US6835889B2 (en) * | 2001-09-21 | 2004-12-28 | Kabushiki Kaisha Toshiba | Passive element component and substrate with built-in passive element |
-
2002
- 2002-10-01 GB GB0222711A patent/GB2393736A/en not_active Withdrawn
-
2003
- 2003-09-25 AU AU2003267606A patent/AU2003267606A1/en not_active Abandoned
- 2003-09-25 WO PCT/GB2003/004080 patent/WO2004031454A2/en not_active Ceased
- 2003-09-30 TW TW092126999A patent/TW200408730A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB0222711D0 (en) | 2002-11-06 |
| AU2003267606A8 (en) | 2004-04-23 |
| WO2004031454A2 (en) | 2004-04-15 |
| GB2393736A (en) | 2004-04-07 |
| WO2004031454A3 (en) | 2005-01-06 |
| TW200408730A (en) | 2004-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |