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AU2003266358A8 - Device - Google Patents

Device

Info

Publication number
AU2003266358A8
AU2003266358A8 AU2003266358A AU2003266358A AU2003266358A8 AU 2003266358 A8 AU2003266358 A8 AU 2003266358A8 AU 2003266358 A AU2003266358 A AU 2003266358A AU 2003266358 A AU2003266358 A AU 2003266358A AU 2003266358 A8 AU2003266358 A8 AU 2003266358A8
Authority
AU
Australia
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003266358A
Other versions
AU2003266358A1 (en
Inventor
Klaus Hornle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEW Eurodrive GmbH and Co KG
Original Assignee
SEW Eurodrive GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10251411A external-priority patent/DE10251411B4/en
Application filed by SEW Eurodrive GmbH and Co KG filed Critical SEW Eurodrive GmbH and Co KG
Publication of AU2003266358A1 publication Critical patent/AU2003266358A1/en
Publication of AU2003266358A8 publication Critical patent/AU2003266358A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2003266358A 2002-10-16 2003-09-06 Device Abandoned AU2003266358A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE10248369 2002-10-16
DE10248369.8 2002-10-16
DE10251411.9 2002-11-05
DE10251411A DE10251411B4 (en) 2002-10-16 2002-11-05 Device comprising an electronic circuit with at least one semiconductor module
PCT/EP2003/009909 WO2004036643A2 (en) 2002-10-16 2003-09-06 Device

Publications (2)

Publication Number Publication Date
AU2003266358A1 AU2003266358A1 (en) 2004-05-04
AU2003266358A8 true AU2003266358A8 (en) 2004-05-04

Family

ID=32108792

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003266358A Abandoned AU2003266358A1 (en) 2002-10-16 2003-09-06 Device

Country Status (3)

Country Link
EP (1) EP1554752B1 (en)
AU (1) AU2003266358A1 (en)
WO (1) WO2004036643A2 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2569003B2 (en) * 1986-03-20 1997-01-08 株式会社日立製作所 Heat conduction device
US5084071A (en) * 1989-03-07 1992-01-28 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US5098609A (en) * 1989-11-03 1992-03-24 The Research Foundation Of State Univ. Of N.Y. Stable high solids, high thermal conductivity pastes
US5825087A (en) * 1996-12-03 1998-10-20 International Business Machines Corporation Integral mesh flat plate cooling module
US6225695B1 (en) * 1997-06-05 2001-05-01 Lsi Logic Corporation Grooved semiconductor die for flip-chip heat sink attachment
US6275381B1 (en) * 1998-12-10 2001-08-14 International Business Machines Corporation Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
US6250127B1 (en) * 1999-10-11 2001-06-26 Polese Company, Inc. Heat-dissipating aluminum silicon carbide composite manufacturing method

Also Published As

Publication number Publication date
AU2003266358A1 (en) 2004-05-04
EP1554752B1 (en) 2009-11-18
WO2004036643A3 (en) 2005-01-20
EP1554752A2 (en) 2005-07-20
WO2004036643A2 (en) 2004-04-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase