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AU2003256917A1 - Low temperature anodic bonding method using focused energy for assembly of micromachined systems - Google Patents

Low temperature anodic bonding method using focused energy for assembly of micromachined systems

Info

Publication number
AU2003256917A1
AU2003256917A1 AU2003256917A AU2003256917A AU2003256917A1 AU 2003256917 A1 AU2003256917 A1 AU 2003256917A1 AU 2003256917 A AU2003256917 A AU 2003256917A AU 2003256917 A AU2003256917 A AU 2003256917A AU 2003256917 A1 AU2003256917 A1 AU 2003256917A1
Authority
AU
Australia
Prior art keywords
assembly
low temperature
bonding method
anodic bonding
focused energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003256917A
Inventor
Steven T. Cho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hospira Inc
Original Assignee
Abbott Laboratories
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abbott Laboratories filed Critical Abbott Laboratories
Publication of AU2003256917A1 publication Critical patent/AU2003256917A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K9/00—Medicinal preparations characterised by special physical form
    • A61K9/0087—Galenical forms not covered by A61K9/02 - A61K9/7023
    • A61K9/0097—Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K9/00—Medicinal preparations characterised by special physical form
    • A61K9/0002—Galenical forms characterised by the drug release technique; Application systems commanded by energy
    • A61K9/0009—Galenical forms characterised by the drug release technique; Application systems commanded by energy involving or responsive to electricity, magnetism or acoustic waves; Galenical aspects of sonophoresis, iontophoresis, electroporation or electroosmosis
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M2205/00—General characteristics of the apparatus
    • A61M2205/02—General characteristics of the apparatus characterised by a particular materials
    • A61M2205/0244—Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology

Landscapes

  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Engineering & Computer Science (AREA)
  • Dermatology (AREA)
  • Micromachines (AREA)
AU2003256917A 2002-07-30 2003-07-29 Low temperature anodic bonding method using focused energy for assembly of micromachined systems Abandoned AU2003256917A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/208,309 US20040020173A1 (en) 2002-07-30 2002-07-30 Low temperature anodic bonding method using focused energy for assembly of micromachined systems
US10/208,309 2002-07-30
PCT/US2003/023518 WO2004011368A2 (en) 2002-07-30 2003-07-29 Low temperature anodic bonding method using focused energy for assembly of micromachined systems

Publications (1)

Publication Number Publication Date
AU2003256917A1 true AU2003256917A1 (en) 2004-02-16

Family

ID=31186792

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003256917A Abandoned AU2003256917A1 (en) 2002-07-30 2003-07-29 Low temperature anodic bonding method using focused energy for assembly of micromachined systems

Country Status (3)

Country Link
US (1) US20040020173A1 (en)
AU (1) AU2003256917A1 (en)
WO (1) WO2004011368A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002534139A (en) * 1999-01-05 2002-10-15 マサチューセッツ・アイ・アンド・イア・インファーマリー Transscleral sustained release drug targeted delivery to retina and choroid
EP1387671A1 (en) 2001-05-03 2004-02-11 MASSACHUSETTS EYE & EAR INFIRMARY Implantable drug delivery device and use thereof
AU2003217531A1 (en) * 2002-05-02 2003-11-17 Massachusetts Eye And Ear Infirmary Ocular drug delivery systems and use thereof
US7399681B2 (en) * 2003-02-18 2008-07-15 Corning Incorporated Glass-based SOI structures
WO2004073551A2 (en) * 2003-02-18 2004-09-02 Massachusetts Eye And Ear Infirmary Transscleral drug delivery device and related methods
US7176528B2 (en) * 2003-02-18 2007-02-13 Corning Incorporated Glass-based SOI structures
KR101211576B1 (en) 2004-11-04 2012-12-12 마이크로칩스 인코포레이티드 Compression and cold weld sealing methods and devices
US20070264796A1 (en) * 2006-05-12 2007-11-15 Stocker Mark A Method for forming a semiconductor on insulator structure
US9937124B2 (en) * 2014-09-11 2018-04-10 International Business Machines Corporation Microchip substance delivery devices having low-power electromechanical release mechanisms
DE102016107059B4 (en) * 2015-07-17 2022-12-22 Infineon Technologies Dresden Gmbh Integrated semiconductor device and manufacturing process
US10881788B2 (en) 2015-10-30 2021-01-05 International Business Machines Corporation Delivery device including reactive material for programmable discrete delivery of a substance
US10286198B2 (en) 2016-04-08 2019-05-14 International Business Machines Corporation Microchip medical substance delivery devices
US10508755B2 (en) * 2017-07-21 2019-12-17 International Business Machines Corporation Fluid delivery device with hydrophobic surface
NL2021872B1 (en) * 2018-10-24 2020-05-13 Medspray B V Spray device and spray nozzle unit

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0539741B1 (en) * 1991-09-30 2003-01-15 Canon Kabushiki Kaisha Anodic bonding process with light irradiation
DE4219132A1 (en) * 1992-06-11 1993-12-16 Suess Kg Karl Bonded silicon@ wafer-glass or silicon@-silicon@ joint prodn. - comprises using laser light radiation to initially fix materials at spot(s) and/or lines and conventional high temp. bonding for pressure and acceleration sensors or micro-system elements
US5366454A (en) * 1993-03-17 1994-11-22 La Corporation De L'ecole Polytechnique Implantable medication dispensing device
JP3188546B2 (en) * 1993-03-23 2001-07-16 キヤノン株式会社 Bonded body of insulator and conductor and bonding method
US5536354A (en) * 1993-04-23 1996-07-16 Canon Kabushiki Kaisha Solid phase bonding method
US5443450A (en) * 1994-04-29 1995-08-22 Medtronic, Inc. Medication delivery device and method of construction
US5938923A (en) * 1997-04-15 1999-08-17 The Regents Of The University Of California Microfabricated filter and capsule using a substrate sandwich
DE10053865C1 (en) * 2000-10-27 2002-04-04 Inst Physikalische Hochtech Ev Process for anodically bonding materials with glass components used in microsystems for joining glass with silicon comprises using niobium or tantalum phosphate glass having a specified alkali ion conductivity

Also Published As

Publication number Publication date
WO2004011368A2 (en) 2004-02-05
WO2004011368A3 (en) 2004-06-10
US20040020173A1 (en) 2004-02-05

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase