AU2003252731A1 - Work transfer means - Google Patents
Work transfer meansInfo
- Publication number
- AU2003252731A1 AU2003252731A1 AU2003252731A AU2003252731A AU2003252731A1 AU 2003252731 A1 AU2003252731 A1 AU 2003252731A1 AU 2003252731 A AU2003252731 A AU 2003252731A AU 2003252731 A AU2003252731 A AU 2003252731A AU 2003252731 A1 AU2003252731 A1 AU 2003252731A1
- Authority
- AU
- Australia
- Prior art keywords
- transfer means
- work transfer
- work
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2003/009670 WO2005011927A1 (en) | 2003-07-30 | 2003-07-30 | Work transfer means |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003252731A1 true AU2003252731A1 (en) | 2005-02-15 |
Family
ID=34113459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003252731A Abandoned AU2003252731A1 (en) | 2003-07-30 | 2003-07-30 | Work transfer means |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU2003252731A1 (en) |
| WO (1) | WO2005011927A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5447565B2 (en) * | 2012-03-21 | 2014-03-19 | セイコーエプソン株式会社 | Handler teaching method and handler |
| JP2024046799A (en) * | 2022-09-26 | 2024-04-05 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06204266A (en) * | 1992-12-28 | 1994-07-22 | Toshiba Seiki Kk | Picking-up method for semiconductor pellet |
| JP3507704B2 (en) * | 1998-07-16 | 2004-03-15 | 松下電器産業株式会社 | Method for detecting suction height of micro ball and method for suction of micro ball |
-
2003
- 2003-07-30 AU AU2003252731A patent/AU2003252731A1/en not_active Abandoned
- 2003-07-30 WO PCT/JP2003/009670 patent/WO2005011927A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005011927A1 (en) | 2005-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |