AU2003244182A8 - Curable composition, cured article obtained therefrom, and polyimide resin for use in the same - Google Patents

Curable composition, cured article obtained therefrom, and polyimide resin for use in the same

Info

Publication number: AU2003244182A8
Authority: AU; Australia
Prior art keywords: same; curable composition; polyimide resin; obtained therefrom; article obtained
Prior art date: 2002-06-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2003244182A

Other versions

AU2003244182A1 (en

Inventor

Masaki Sasaki

Tadatomi Nishikubo

Hiroto Kudo

Shohei Makita

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kanagawa University

Taiyo Holdings Co Ltd

Original Assignee

Taiyo Ink Mfg Co Ltd

Kanagawa University

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-06-26

Filing date

2003-06-24

Publication date

2004-01-19

2003-06-24 Application filed by Taiyo Ink Mfg Co Ltd, Kanagawa University filed Critical Taiyo Ink Mfg Co Ltd

2004-01-19 Publication of AU2003244182A1 publication Critical patent/AU2003244182A1/en

2004-01-19 Publication of AU2003244182A8 publication Critical patent/AU2003244182A8/en

Status Abandoned legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Materials For Photolithography (AREA)

AU2003244182A 2002-06-26 2003-06-24 Curable composition, cured article obtained therefrom, and polyimide resin for use in the same Abandoned AU2003244182A1 (en)

Applications Claiming Priority (5)

Application Number	Priority Date	Filing Date	Title
JP2002185642		2002-06-26
JP2002185647		2002-06-26
JP2002-185647		2002-06-26
JP2002-185642		2002-06-26
PCT/JP2003/007994 WO2004003057A1 (en)	2002-06-26	2003-06-24	Curable composition, cured article obtained therefrom, and polyimide resin for use in the same

Publications (2)

Publication Number	Publication Date
AU2003244182A1 AU2003244182A1 (en)	2004-01-19
AU2003244182A8 true AU2003244182A8 (en)	2004-01-19

Family

ID=30002281

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2003244182A Abandoned AU2003244182A1 (en)	2002-06-26	2003-06-24	Curable composition, cured article obtained therefrom, and polyimide resin for use in the same

Country Status (4)

Country	Link
JP (1)	JP4480573B2 (en)
AU (1)	AU2003244182A1 (en)
TW (1)	TWI286564B (en)
WO (1)	WO2004003057A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5119781B2 (en) *	2006-07-25	2013-01-16	宇部興産株式会社	Multi-branched polyimide for promoting electroless plating, metal-coated multi-branched polyimide, and production method thereof
JP5188495B2 (en) *	2007-03-19	2013-04-24	イビデン株式会社	Positive photosensitive polyimide precursor composition
JP4650582B2 (en) *	2009-05-14	2011-03-16	東洋紡績株式会社	Resin having hyperbranch structure and resist agent using the same
JP4650581B2 (en) *	2009-05-14	2011-03-16	東洋紡績株式会社	Resin having hyperbranch structure and resist agent using the same
JP5210249B2 (en) *	2009-06-23	2013-06-12	日東電工株式会社	Polyimide compound and process for producing the same, and optical film and optical waveguide obtained from the compound
JP2011048921A (en) *	2009-08-25	2011-03-10	Sanyo Electric Co Ltd	Lithium secondary battery, and method of manufacturing the same
JP6462983B2 (en) *	2014-01-28	2019-01-30	太陽インキ製造株式会社	Photosensitive thermosetting resin composition and flexible printed wiring board
KR102380068B1 (en) *	2016-10-05	2022-03-31	도레이 카부시키가이샤	Resin composition, cured film, semiconductor device, and manufacturing method thereof
CN116948520A (en) *	2020-09-08	2023-10-27	深圳市志邦科技有限公司	Heat-resistant high-adhesion polyimide coating and preparation method thereof and preparation method of coating
WO2025028429A1 (en) *	2023-07-28	2025-02-06	富士フイルム株式会社	Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4216256B1 (en) *	1963-04-12	1967-09-04
JPH11343414A (en) *	1998-05-29	1999-12-14	Jsr Corp	Thermosetting resin composition and cured product thereof
JP3546303B2 (en) *	1999-07-26	2004-07-28	財団法人理工学振興会	Polyimide resin
JP2002080597A (en) *	2000-09-05	2002-03-19	Rikogaku Shinkokai	Method for producing polyimide resin
JP2002221793A (en) *	2001-01-29	2002-08-09	Jsr Corp	Positive photosensitive polyimide composition and polyimide film

2003
- 2003-06-24 JP JP2004517265A patent/JP4480573B2/en not_active Expired - Lifetime
- 2003-06-24 WO PCT/JP2003/007994 patent/WO2004003057A1/en not_active Ceased
- 2003-06-24 AU AU2003244182A patent/AU2003244182A1/en not_active Abandoned
- 2003-06-25 TW TW92117263A patent/TWI286564B/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
JPWO2004003057A1 (en)	2005-10-27
JP4480573B2 (en)	2010-06-16
TW200401007A (en)	2004-01-16
TWI286564B (en)	2007-09-11
AU2003244182A1 (en)	2004-01-19
WO2004003057A1 (en)	2004-01-08

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Legal Events

Date	Code	Title	Description
2005-03-17	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase
2005-08-18	TH	Corrigenda	Free format text: IN VOL 18, NO 9, PAGE(S) 2395 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME KANAGAWA UNIVERSITY, APPLICATION NO. 2003244182, UNDER INID (71) CORRECT THE NAME TO READ KANAGAWA UNIVERSITY; TAIYO INK MANUFACTURING CO., LTD.