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AU2002338178A1 - Substrate cleaner - Google Patents

Substrate cleaner

Info

Publication number
AU2002338178A1
AU2002338178A1 AU2002338178A AU2002338178A AU2002338178A1 AU 2002338178 A1 AU2002338178 A1 AU 2002338178A1 AU 2002338178 A AU2002338178 A AU 2002338178A AU 2002338178 A AU2002338178 A AU 2002338178A AU 2002338178 A1 AU2002338178 A1 AU 2002338178A1
Authority
AU
Australia
Prior art keywords
substrate cleaner
cleaner
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002338178A
Inventor
Yutaka Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UNITECH Corp
Original Assignee
UNITECH CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UNITECH CORP filed Critical UNITECH CORP
Publication of AU2002338178A1 publication Critical patent/AU2002338178A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/20Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04Cleaning by suction, with or without auxiliary action
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/26Cleaning or polishing of the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0191Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/082Suction, e.g. for holding solder balls or components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1509Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning In General (AREA)
AU2002338178A 2002-10-11 2002-10-11 Substrate cleaner Abandoned AU2002338178A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/010612 WO2004034757A1 (en) 2002-10-11 2002-10-11 Substrate cleaner

Publications (1)

Publication Number Publication Date
AU2002338178A1 true AU2002338178A1 (en) 2004-05-04

Family

ID=32089056

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002338178A Abandoned AU2002338178A1 (en) 2002-10-11 2002-10-11 Substrate cleaner

Country Status (4)

Country Link
JP (1) JP4326472B2 (en)
CN (1) CN1602652B (en)
AU (1) AU2002338178A1 (en)
WO (1) WO2004034757A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100542700C (en) * 2004-12-24 2009-09-23 鸿富锦精密工业(深圳)有限公司 Carrier for glass substrate cleaning
US8079105B2 (en) 2005-11-10 2011-12-20 Datacard Corporation Card cleaning mechanism
KR20080051961A (en) 2006-12-07 2008-06-11 한국전자통신연구원 Cleaning Method of Flexible Substrate
JP4406652B2 (en) * 2007-05-22 2010-02-03 株式会社松栄工機 Transport device
JP2009157247A (en) * 2007-12-27 2009-07-16 Orc Mfg Co Ltd Exposure apparatus
JP5253481B2 (en) * 2010-11-04 2013-07-31 ユニテク株式会社 Substrate cleaning device
CN105307786B (en) * 2013-06-18 2019-09-17 苹果公司 Pressure-sensing roller for laminating system
JP6382622B2 (en) * 2014-02-25 2018-08-29 バンドー化学株式会社 Cleaning device, adhesive roller unit and adhesive roller
CN110813930A (en) * 2019-11-23 2020-02-21 湖南东神自动化设备有限公司 Circuit board surface cleaning device
GB2595670B8 (en) * 2020-06-02 2023-01-25 Illinois Tool Works Cleaning surface
CN112140633A (en) * 2020-09-21 2020-12-29 昆山市天丰印刷包装有限公司 Full-automatic aqueous printing slotting die-cutting machine
CN114364153B (en) * 2021-12-15 2023-12-08 上海羽默电子科技有限公司 Circuit board printing process

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0614860Y2 (en) * 1990-04-04 1994-04-20 住友金属工業株式会社 Foreign material removal device for belt-shaped ultra-low tension sheet
JPH0763685B2 (en) * 1991-09-10 1995-07-12 都ローラー工業株式会社 Dust removal roller and dust removal device using the same
CN1344131A (en) * 2000-09-18 2002-04-10 华通电脑股份有限公司 Laser Drilling Method for Printed Circuit Board and Substrate
JP2002153825A (en) * 2000-11-17 2002-05-28 Taiyo Kogyo Kk Tacky adhesive roller for removing dust
JP3078286U (en) * 2000-12-12 2001-06-29 榮華 葉 Circuit board cleaning machine

Also Published As

Publication number Publication date
JP4326472B2 (en) 2009-09-09
CN1602652A (en) 2005-03-30
WO2004034757A1 (en) 2004-04-22
CN1602652B (en) 2010-06-09
JPWO2004034757A1 (en) 2006-02-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase