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AU2002234028A1 - A power distribution system with a dedicated power structure and a high performance voltage regulator - Google Patents

A power distribution system with a dedicated power structure and a high performance voltage regulator

Info

Publication number
AU2002234028A1
AU2002234028A1 AU2002234028A AU3402802A AU2002234028A1 AU 2002234028 A1 AU2002234028 A1 AU 2002234028A1 AU 2002234028 A AU2002234028 A AU 2002234028A AU 3402802 A AU3402802 A AU 3402802A AU 2002234028 A1 AU2002234028 A1 AU 2002234028A1
Authority
AU
Australia
Prior art keywords
high performance
distribution system
voltage regulator
power distribution
performance voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002234028A
Other languages
English (en)
Inventor
Michael C. Freda
Istvan Novak
Larry D. Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Publication of AU2002234028A1 publication Critical patent/AU2002234028A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU2002234028A 2000-10-30 2001-10-30 A power distribution system with a dedicated power structure and a high performance voltage regulator Abandoned AU2002234028A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US24439900P 2000-10-30 2000-10-30
US60/244,399 2000-10-30
US09/809,826 2001-03-16
US09/809,826 US6791846B2 (en) 2000-10-30 2001-03-16 Power distribution system with a dedicated power structure and a high performance voltage regulator
PCT/US2001/048496 WO2002037248A2 (fr) 2000-10-30 2001-10-30 Systeme de distribution de puissance a structure d'alimentation dediee et regulateur de tension a performance elevee

Publications (1)

Publication Number Publication Date
AU2002234028A1 true AU2002234028A1 (en) 2002-05-15

Family

ID=26936508

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002234028A Abandoned AU2002234028A1 (en) 2000-10-30 2001-10-30 A power distribution system with a dedicated power structure and a high performance voltage regulator

Country Status (4)

Country Link
US (2) US6791846B2 (fr)
AU (1) AU2002234028A1 (fr)
GB (1) GB2386478B (fr)
WO (1) WO2002037248A2 (fr)

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US6791846B2 (en) * 2000-10-30 2004-09-14 Sun Microsystems, Inc. Power distribution system with a dedicated power structure and a high performance voltage regulator
US6711811B2 (en) * 2001-06-18 2004-03-30 Hewlett-Packard Development Company, L.P. Method to assemble a uniform force hydrostatic bolster plate
US6759257B2 (en) * 2001-11-13 2004-07-06 Fujitsu Limited Structure and method for embedding capacitors in z-connected multi-chip modules
US6739879B2 (en) * 2002-07-03 2004-05-25 Intel Corporation Ball grid array circuit board jumper
US7161238B2 (en) * 2002-12-31 2007-01-09 Intel Corporation Structural reinforcement for electronic substrate
US7091586B2 (en) * 2003-11-04 2006-08-15 Intel Corporation Detachable on package voltage regulation module
US7005742B2 (en) * 2004-02-05 2006-02-28 Texas Instruments Incorporated Socket grid array
US7145782B2 (en) 2004-07-16 2006-12-05 Intel Corporation Reducing loadline impedance in a system
US7247930B2 (en) * 2004-09-30 2007-07-24 Intel Corporation Power management integrated circuit
US7698576B2 (en) 2004-09-30 2010-04-13 Intel Corporation CPU power delivery system
US20060071650A1 (en) * 2004-09-30 2006-04-06 Narendra Siva G CPU power delivery system
US7568115B2 (en) 2005-09-28 2009-07-28 Intel Corporation Power delivery and power management of many-core processors
JP2007096223A (ja) * 2005-09-30 2007-04-12 Fujitsu Ltd 電気部品の電源ピンへのコンデンサ内蔵型給電装置
JP5181415B2 (ja) * 2005-09-30 2013-04-10 富士通株式会社 電気部品の電源ピンへの給電装置
US8179693B2 (en) * 2007-03-30 2012-05-15 International Business Machines Corporation Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements
US20090080163A1 (en) * 2007-05-17 2009-03-26 Lockheed Martin Corporation Printed wiring board assembly
US8018738B2 (en) * 2008-06-02 2011-09-13 Oracle America, Inc., Voltage regulator attach for high current chip applications
US8812879B2 (en) * 2009-12-30 2014-08-19 International Business Machines Corporation Processor voltage regulation
JP5293787B2 (ja) * 2011-08-31 2013-09-18 富士通株式会社 電気部品の電源ピンへのコンデンサ内蔵型給電装置
US9136624B1 (en) * 2013-03-28 2015-09-15 Juniper Networks, Inc. Orthogonal cross-connecting of printed circuit boards without a midplane board
US10345834B2 (en) * 2017-08-09 2019-07-09 Qualcomm Incorporated Sensing total current of distributed load circuits independent of current distribution using distributed voltage averaging
US10910746B2 (en) * 2017-12-01 2021-02-02 Intel Corporation Memory and power mezzanine connectors
US10999930B2 (en) 2018-12-17 2021-05-04 Cisco Technology, Inc. Integrated power delivery board for delivering power to an ASIC with bypass of signal vias in a printed circuit board
US11418120B2 (en) * 2018-12-26 2022-08-16 Empower Semiconductor, Inc. Deeply integrated voltage regulator architectures
JP6873217B1 (ja) * 2019-12-05 2021-05-19 三菱電機株式会社 電力変換装置
EP4388389A1 (fr) * 2021-08-18 2024-06-26 Tesla, Inc. Distribution d'énergie intégrée verticalement basée sur un réseau à plusieurs étages

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Also Published As

Publication number Publication date
US20050024840A1 (en) 2005-02-03
US6791846B2 (en) 2004-09-14
GB0311827D0 (en) 2003-06-25
GB2386478A (en) 2003-09-17
US7162795B2 (en) 2007-01-16
WO2002037248A3 (fr) 2003-01-16
GB2386478B (en) 2004-05-19
US20020145839A1 (en) 2002-10-10
WO2002037248A2 (fr) 2002-05-10

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