AU2002223435A1 - Electrochemical coating device and method - Google Patents
Electrochemical coating device and methodInfo
- Publication number
- AU2002223435A1 AU2002223435A1 AU2002223435A AU2002223435A AU2002223435A1 AU 2002223435 A1 AU2002223435 A1 AU 2002223435A1 AU 2002223435 A AU2002223435 A AU 2002223435A AU 2002223435 A AU2002223435 A AU 2002223435A AU 2002223435 A1 AU2002223435 A1 AU 2002223435A1
- Authority
- AU
- Australia
- Prior art keywords
- layers
- coated
- substrate
- thin layers
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 4
- 239000004065 semiconductor Substances 0.000 abstract 2
- 229920001940 conductive polymer Polymers 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
- 230000000704 physical effect Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Automation & Control Theory (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Battery Mounting, Suspending (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Abstract
The invention relates to a device and method, with which it is possible to electrochemically deposit thin layers with a nearly homogeneous layer thickness on large-surface substrates having relatively high resistances. These thin layers are, for example, metal layers, metal oxide layers or semiconductor layers as well as layers consisting of conductive polymers that, for example, are deposited on transparent electrodes or semiconductor substrates. The counter-electrode for the substrate to be coated is divided into several electrode segments and voltages that differ from one another can be applied between each individual electrode segment and the substrate to be coated. This results in achieving a good homogeneity of the deposited thin layers with respect to thickness and physical properties.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10100297A DE10100297A1 (en) | 2001-01-04 | 2001-01-04 | Device and method for electrochemical coating |
| DE10100297.1 | 2001-01-04 | ||
| PCT/DE2001/003676 WO2002053806A2 (en) | 2001-01-04 | 2001-09-24 | Electrochemical coating device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2002223435A1 true AU2002223435A1 (en) | 2002-07-16 |
Family
ID=7669816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002223435A Abandoned AU2002223435A1 (en) | 2001-01-04 | 2001-09-24 | Electrochemical coating device and method |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1534880B1 (en) |
| AT (1) | ATE358194T1 (en) |
| AU (1) | AU2002223435A1 (en) |
| DE (3) | DE10100297A1 (en) |
| WO (1) | WO2002053806A2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10132408C2 (en) * | 2001-07-04 | 2003-08-21 | Fraunhofer Ges Forschung | Variable shape electrode |
| DE10141056C2 (en) | 2001-08-22 | 2003-12-24 | Atotech Deutschland Gmbh | Method and device for the electrolytic treatment of electrically conductive layers in continuous systems |
| DE102004056158B3 (en) * | 2004-11-17 | 2006-03-30 | Siemens Ag | Method for monitoring an electrochemical treatment process and electrode arrangement suitable for this method |
| JP6993288B2 (en) * | 2018-05-07 | 2022-01-13 | 株式会社荏原製作所 | Plating equipment |
| DE102018004841B9 (en) | 2018-06-13 | 2020-12-03 | Hooshiar Mahdjour | Method and device for the automated regulation of the currents in an electroplating bath |
| WO2024223646A1 (en) | 2023-04-25 | 2024-10-31 | Atotech Deutschland GmbH & Co. KG | Apparatus and method for conducting electrolysis and electrode unit for such an apparatus |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61279695A (en) * | 1985-06-04 | 1986-12-10 | Central Glass Co Ltd | Formation of thin film by electrolytic synthesizing method |
| JPH04143299A (en) * | 1990-10-03 | 1992-05-18 | Fujitsu Ltd | Electroplating method |
| US5156730A (en) * | 1991-06-25 | 1992-10-20 | International Business Machines | Electrode array and use thereof |
| JP3207909B2 (en) * | 1992-02-07 | 2001-09-10 | ティーディーケイ株式会社 | Electroplating method and split type insoluble electrode for electroplating |
| DE19717489B4 (en) * | 1997-04-25 | 2008-04-10 | Sms Demag Ag | Arrangement for the electrogalvanic metal coating of a strip |
| WO2001014618A2 (en) * | 1999-08-26 | 2001-03-01 | Cvc Products, Inc. | Apparatus and method for electroplating a material layer onto a wafer |
| WO2001094656A2 (en) * | 2000-06-05 | 2001-12-13 | Applied Materials, Inc. | Plating apparatus with individually controllable anode segments and associated method |
-
2001
- 2001-01-04 DE DE10100297A patent/DE10100297A1/en not_active Withdrawn
- 2001-09-24 DE DE50112278T patent/DE50112278D1/en not_active Expired - Lifetime
- 2001-09-24 AU AU2002223435A patent/AU2002223435A1/en not_active Abandoned
- 2001-09-24 AT AT01272605T patent/ATE358194T1/en active
- 2001-09-24 WO PCT/DE2001/003676 patent/WO2002053806A2/en not_active Ceased
- 2001-09-24 DE DE10195773T patent/DE10195773D2/en not_active Expired - Fee Related
- 2001-09-24 EP EP01272605A patent/EP1534880B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1534880B1 (en) | 2007-03-28 |
| DE10195773D2 (en) | 2004-01-22 |
| DE10100297A1 (en) | 2002-07-18 |
| WO2002053806A2 (en) | 2002-07-11 |
| ATE358194T1 (en) | 2007-04-15 |
| WO2002053806A3 (en) | 2005-03-24 |
| EP1534880A2 (en) | 2005-06-01 |
| DE50112278D1 (en) | 2007-05-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |