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AU2002215356A1 - A reactor for electrochemically processing a microelectronic workpiece includingimproved electrode assembly - Google Patents

A reactor for electrochemically processing a microelectronic workpiece includingimproved electrode assembly

Info

Publication number
AU2002215356A1
AU2002215356A1 AU2002215356A AU1535602A AU2002215356A1 AU 2002215356 A1 AU2002215356 A1 AU 2002215356A1 AU 2002215356 A AU2002215356 A AU 2002215356A AU 1535602 A AU1535602 A AU 1535602A AU 2002215356 A1 AU2002215356 A1 AU 2002215356A1
Authority
AU
Australia
Prior art keywords
includingimproved
reactor
electrode assembly
microelectronic workpiece
electrochemically processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002215356A
Inventor
Steven L. Peace
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Publication of AU2002215356A1 publication Critical patent/AU2002215356A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
AU2002215356A 2000-10-17 2001-10-15 A reactor for electrochemically processing a microelectronic workpiece includingimproved electrode assembly Abandoned AU2002215356A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09690856 2000-10-17
US09/690,856 US6544391B1 (en) 2000-10-17 2000-10-17 Reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly
PCT/US2001/032158 WO2002033152A1 (en) 2000-10-17 2001-10-15 A reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly

Publications (1)

Publication Number Publication Date
AU2002215356A1 true AU2002215356A1 (en) 2002-04-29

Family

ID=24774247

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002215356A Abandoned AU2002215356A1 (en) 2000-10-17 2001-10-15 A reactor for electrochemically processing a microelectronic workpiece includingimproved electrode assembly

Country Status (4)

Country Link
US (2) US6544391B1 (en)
AU (1) AU2002215356A1 (en)
TW (1) TW511130B (en)
WO (1) WO2002033152A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6544391B1 (en) * 2000-10-17 2003-04-08 Semitool, Inc. Reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly
FR2821862B1 (en) * 2001-03-07 2003-11-14 Saint Gobain METHOD OF ENGRAVING LAYERS DEPOSITED ON TRANSPARENT SUBSTRATES OF THE GLASS SUBSTRATE TYPE
US7247222B2 (en) * 2002-07-24 2007-07-24 Applied Materials, Inc. Electrochemical processing cell
US7128823B2 (en) 2002-07-24 2006-10-31 Applied Materials, Inc. Anolyte for copper plating
EP1391540A3 (en) 2002-08-08 2006-10-04 Texas Instruments Incorporated Methods and apparatus for improved current density and feature fill control in ECD reactors
TWI240766B (en) * 2003-09-09 2005-10-01 Ind Tech Res Inst Electroplating device having rectification and voltage detection function
KR100651919B1 (en) * 2005-09-29 2006-12-01 엘지전자 주식회사 Mobile communication terminal with recording speed control function and method using the same
DE102008045256A1 (en) * 2008-09-01 2010-03-04 Rena Gmbh Apparatus and method for the wet treatment of different substrates
JP6986921B2 (en) * 2017-10-12 2021-12-22 株式会社荏原製作所 Plating equipment and plating method
TWI835872B (en) * 2018-10-03 2024-03-21 美商蘭姆研究公司 Flow distribution apparatus for an inert anode plating cell

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4032422A (en) 1975-10-03 1977-06-28 National Semiconductor Corporation Apparatus for plating semiconductor chip headers
CA1159008A (en) 1978-12-04 1983-12-20 Sankar Das Gupta Reactor with working and secondary electrodes and polarity reversal means for treating waste water
US4304641A (en) 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
US4514266A (en) 1981-09-11 1985-04-30 Republic Steel Corporation Method and apparatus for electroplating
US4469566A (en) 1983-08-29 1984-09-04 Dynamic Disk, Inc. Method and apparatus for producing electroplated magnetic memory disk, and the like
US4890727A (en) 1988-07-27 1990-01-02 Osteo-Dyne, Inc. Method and apparatus for plating through holes in graphite composites
JPH02197599A (en) * 1989-01-25 1990-08-06 Yamaha Motor Co Ltd Chemically treating device for surface of metal
US5169408A (en) 1990-01-26 1992-12-08 Fsi International, Inc. Apparatus for wafer processing with in situ rinse
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
US5227041A (en) 1992-06-12 1993-07-13 Digital Equipment Corporation Dry contact electroplating apparatus
US5334246A (en) * 1992-12-23 1994-08-02 Xerox Corporation Dip coat process material handling system
US5514258A (en) 1994-08-18 1996-05-07 Brinket; Oscar J. Substrate plating device having laminar flow
JPH08209384A (en) 1995-02-02 1996-08-13 Yamaha Motor Co Ltd Surface-treating device
US5731678A (en) 1996-07-15 1998-03-24 Semitool, Inc. Processing head for semiconductor processing machines
US5980706A (en) 1996-07-15 1999-11-09 Semitool, Inc. Electrode semiconductor workpiece holder
US5683564A (en) 1996-10-15 1997-11-04 Reynolds Tech Fabricators Inc. Plating cell and plating method with fluid wiper
DE69735925T2 (en) * 1996-12-25 2007-02-15 Asahi Kasei Medical Co., Ltd. Process for producing a hollow fiber membrane, hollow fiber membrane and hollow fiber dialyzer
US6001235A (en) 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
US6179983B1 (en) * 1997-11-13 2001-01-30 Novellus Systems, Inc. Method and apparatus for treating surface including virtual anode
US6139705A (en) * 1998-05-06 2000-10-31 Eltech Systems Corporation Lead electrode
US6080288A (en) 1998-05-29 2000-06-27 Schwartz; Vladimir System for forming nickel stampers utilized in optical disc production
US6228232B1 (en) 1998-07-09 2001-05-08 Semitool, Inc. Reactor vessel having improved cup anode and conductor assembly
US6251251B1 (en) * 1998-11-16 2001-06-26 International Business Machines Corporation Anode design for semiconductor deposition
US6103085A (en) 1998-12-04 2000-08-15 Advanced Micro Devices, Inc. Electroplating uniformity by diffuser design
US6113759A (en) * 1998-12-18 2000-09-05 International Business Machines Corporation Anode design for semiconductor deposition having novel electrical contact assembly
US6261426B1 (en) * 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
US6254742B1 (en) * 1999-07-12 2001-07-03 Semitool, Inc. Diffuser with spiral opening pattern for an electroplating reactor vessel
US6544391B1 (en) * 2000-10-17 2003-04-08 Semitool, Inc. Reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly

Also Published As

Publication number Publication date
US20030178297A1 (en) 2003-09-25
TW511130B (en) 2002-11-21
US6544391B1 (en) 2003-04-08
WO2002033152A1 (en) 2002-04-25

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