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AU2002213733A1 - Electronics arrangement - Google Patents

Electronics arrangement

Info

Publication number
AU2002213733A1
AU2002213733A1 AU2002213733A AU1373302A AU2002213733A1 AU 2002213733 A1 AU2002213733 A1 AU 2002213733A1 AU 2002213733 A AU2002213733 A AU 2002213733A AU 1373302 A AU1373302 A AU 1373302A AU 2002213733 A1 AU2002213733 A1 AU 2002213733A1
Authority
AU
Australia
Prior art keywords
electronics arrangement
electronics
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002213733A
Inventor
Hendrik Koopmans
Robert Streit
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Energy Systems Switzerland AG
Original Assignee
Ascom Energy Systems AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ascom Energy Systems AG filed Critical Ascom Energy Systems AG
Publication of AU2002213733A1 publication Critical patent/AU2002213733A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20154Heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU2002213733A 2000-12-08 2001-11-19 Electronics arrangement Abandoned AU2002213733A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH2397/00 2000-12-08
CH23972000 2000-12-08
PCT/CH2001/000678 WO2002047453A1 (en) 2000-12-08 2001-11-19 Electronics arrangement

Publications (1)

Publication Number Publication Date
AU2002213733A1 true AU2002213733A1 (en) 2002-06-18

Family

ID=4568991

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002213733A Abandoned AU2002213733A1 (en) 2000-12-08 2001-11-19 Electronics arrangement

Country Status (5)

Country Link
US (1) US20050122682A1 (en)
EP (1) EP1340417B1 (en)
AU (1) AU2002213733A1 (en)
DE (1) DE50103923D1 (en)
WO (1) WO2002047453A1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6970356B2 (en) * 2002-07-16 2005-11-29 Tseng Jyi Peng Heat sink system
DE102004004440B4 (en) * 2004-01-28 2006-06-29 Kermi Gmbh Cooling device for an electronic component, in particular for a microprocessor
ATE485451T1 (en) 2004-03-30 2010-11-15 Ebm Papst St Georgen Gmbh & Co FAN ARRANGEMENT
PL193094B1 (en) * 2004-11-15 2007-01-31 Adb Polska Sp Pcb board with forced air circulation and device with the pcb board with forced air circulation
US7675744B2 (en) * 2005-10-31 2010-03-09 International Business Machines Corporation Air distribution system compatible with disparate data storage systems
US20080112133A1 (en) * 2006-11-10 2008-05-15 Sun Microsystems, Inc. Switch chassis
US7898805B2 (en) * 2006-12-30 2011-03-01 Intel Corporation Central pressuring fan with bottom inlets for notebook cooling
US7643301B1 (en) * 2007-08-20 2010-01-05 Nvidia Corporation Heat exchanger system and method for circulating external air about a chipset
WO2011024319A1 (en) * 2009-08-31 2011-03-03 富士通株式会社 Electronic apparatus
TW201310216A (en) * 2011-08-17 2013-03-01 Hon Hai Prec Ind Co Ltd Power supply system
WO2018194641A1 (en) * 2017-04-21 2018-10-25 Hewlett-Packard Development Company, L.P. Thermal modules with conductive cover plates
US11821420B2 (en) * 2017-06-30 2023-11-21 Tesla, Inc. Electric pump system and method
US10957445B2 (en) 2017-10-05 2021-03-23 Hill-Rom Services, Inc. Caregiver and staff information system
US10545546B2 (en) 2018-02-23 2020-01-28 Intel Corporation Reversible direction thermal cooling system
US10481658B1 (en) * 2018-06-26 2019-11-19 Dell Products, L.P. Under-motherboard air cooling plenum
EP3628872B1 (en) 2018-09-27 2023-01-25 INTEL Corporation Volumetric resistance blowers
US11512889B2 (en) 2019-02-25 2022-11-29 Lg Electronics Inc. Entrance refrigerator
CN111609653A (en) 2019-02-25 2020-09-01 Lg电子株式会社 Entrance refrigerator and refrigerator
CN111609650A (en) 2019-02-25 2020-09-01 Lg电子株式会社 Entrance refrigerator and refrigerator
CN111609647B (en) 2019-02-25 2021-11-05 Lg电子株式会社 Entrance refrigerator and refrigerator
CN111609649B (en) 2019-02-25 2022-01-18 Lg电子株式会社 Entrance refrigerator and refrigerator
CN111609648A (en) 2019-02-25 2020-09-01 Lg电子株式会社 Entrance refrigerators and refrigerators
US11448456B2 (en) 2019-02-25 2022-09-20 Lg Electronics Inc. Entrance refrigerator
EP3699527B1 (en) 2019-02-25 2022-09-21 LG Electronics Inc. Entrance refrigerator
CN111609651B (en) * 2019-02-25 2022-06-28 Lg电子株式会社 Entrance refrigerator and refrigerator
EP3699525B1 (en) 2019-02-25 2022-07-06 LG Electronics Inc. Entrance refrigerator
US11317540B2 (en) * 2019-09-20 2022-04-26 Samsung Electronics Co., Ltd. Solid state drive apparatus and data storage apparatus including the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956673A (en) * 1974-02-14 1976-05-11 Lockheed Aircraft Corporation Printed circuit modules cooled by rack with forced air
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
US4885488A (en) * 1988-05-23 1989-12-05 Texas Instruments Incorporated Miniaturized fan for printed circuit boards
US5079438A (en) * 1989-01-30 1992-01-07 Heung Lap Yan Circuit module fan assembly
US5297929A (en) * 1992-12-30 1994-03-29 Alex Horng Super thin small heat dispersing fan
US5478221A (en) * 1994-01-31 1995-12-26 Lzr Electronics, Inc. Miniature fan for printed circuit board
US5694294A (en) * 1995-01-27 1997-12-02 Hitachi, Ltd. Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a second space created between the first circuit board and a second circuit board
DE29504306U1 (en) * 1995-03-14 1995-05-11 Global Win Technology Co., Ltd., Shih Lin, Taipeh IC cooling device
US5810554A (en) * 1995-05-31 1998-09-22 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
US5630469A (en) * 1995-07-11 1997-05-20 International Business Machines Corporation Cooling apparatus for electronic chips
JPH09172113A (en) * 1995-12-18 1997-06-30 Nec Corp Heat sink for semiconductor device
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
US5831847A (en) * 1997-02-05 1998-11-03 Jerome Industries Corp. Power supply with separated airflows
US6452797B1 (en) * 1997-11-12 2002-09-17 Intel Corporation Fan-cooled card
US5873407A (en) * 1998-03-27 1999-02-23 Inventec Corporation Windblown-type heat-dissipating device for computer mother board
US6179561B1 (en) * 1998-12-02 2001-01-30 Sunonwealth Electric Machine Industry Co., Ltd. Fan wheel structures
DE20013029U1 (en) * 2000-07-27 2000-12-14 Yu, Ming-Chuan, Taoyuan Cooling pad for notebook
TW568301U (en) * 2003-04-11 2003-12-21 Hon Hai Prec Ind Co Ltd Mounting apparatus for computer peripheral

Also Published As

Publication number Publication date
DE50103923D1 (en) 2004-11-04
EP1340417B1 (en) 2004-09-29
EP1340417A1 (en) 2003-09-03
US20050122682A1 (en) 2005-06-09
WO2002047453A1 (en) 2002-06-13

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