AU2002212125A1 - Cvd reactor with a gas outlet ring made of solid graphite - Google Patents
Cvd reactor with a gas outlet ring made of solid graphiteInfo
- Publication number
- AU2002212125A1 AU2002212125A1 AU2002212125A AU1212502A AU2002212125A1 AU 2002212125 A1 AU2002212125 A1 AU 2002212125A1 AU 2002212125 A AU2002212125 A AU 2002212125A AU 1212502 A AU1212502 A AU 1212502A AU 2002212125 A1 AU2002212125 A1 AU 2002212125A1
- Authority
- AU
- Australia
- Prior art keywords
- gas outlet
- ring made
- cvd reactor
- outlet ring
- solid graphite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title 1
- 229910002804 graphite Inorganic materials 0.000 title 1
- 239000010439 graphite Substances 0.000 title 1
- 239000007787 solid Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
- C23C16/45508—Radial flow
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/4558—Perforated rings
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10043599.8 | 2000-09-01 | ||
| DE10043599A DE10043599A1 (de) | 2000-09-01 | 2000-09-01 | Vorrichtung zum Abscheiden insbesondere kristalliner Schichten auf einem oder mehreren insbesondere ebenfalls kristalliner Substraten |
| PCT/EP2001/008886 WO2002018670A2 (fr) | 2000-09-01 | 2001-08-01 | Dispositif de depot de couches, en particulier cristallines, sur un ou plusieurs substrats, en particulier egalement cristallins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2002212125A1 true AU2002212125A1 (en) | 2002-03-13 |
Family
ID=7654973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002212125A Abandoned AU2002212125A1 (en) | 2000-09-01 | 2001-08-01 | Cvd reactor with a gas outlet ring made of solid graphite |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7332038B2 (fr) |
| EP (1) | EP1397528B8 (fr) |
| JP (1) | JP4961092B2 (fr) |
| AU (1) | AU2002212125A1 (fr) |
| DE (2) | DE10043599A1 (fr) |
| TW (1) | TW526276B (fr) |
| WO (1) | WO2002018670A2 (fr) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10043601A1 (de) * | 2000-09-01 | 2002-03-14 | Aixtron Ag | Vorrichtung und Verfahren zum Abscheiden insbesondere kristalliner Schichten auf insbesondere kristallinen Substraten |
| DE10043599A1 (de) * | 2000-09-01 | 2002-03-14 | Aixtron Ag | Vorrichtung zum Abscheiden insbesondere kristalliner Schichten auf einem oder mehreren insbesondere ebenfalls kristalliner Substraten |
| DE102004009772A1 (de) * | 2004-02-28 | 2005-09-15 | Aixtron Ag | CVD-Reaktor mit Prozesskammerhöhenstabilisierung |
| US20110114022A1 (en) * | 2007-12-12 | 2011-05-19 | Veeco Instruments Inc. | Wafer carrier with hub |
| US8021487B2 (en) | 2007-12-12 | 2011-09-20 | Veeco Instruments Inc. | Wafer carrier with hub |
| DE102008055582A1 (de) * | 2008-12-23 | 2010-06-24 | Aixtron Ag | MOCVD-Reaktor mit zylindrischem Gaseinlassorgan |
| DE102010000554A1 (de) | 2009-03-16 | 2010-09-30 | Aixtron Ag | MOCVD-Reaktor mit einer örtlich verschieden an ein Wärmeableitorgan angekoppelten Deckenplatte |
| KR20120007063A (ko) * | 2009-04-24 | 2012-01-19 | 어플라이드 머티어리얼스, 인코포레이티드 | 측면 가스 출구를 가진 기판 지지대 및 방법 |
| DE102009043848A1 (de) * | 2009-08-25 | 2011-03-03 | Aixtron Ag | CVD-Verfahren und CVD-Reaktor |
| JP5409413B2 (ja) * | 2010-01-26 | 2014-02-05 | 日本パイオニクス株式会社 | Iii族窒化物半導体の気相成長装置 |
| CN102465280B (zh) * | 2010-11-04 | 2013-11-27 | 上海蓝光科技有限公司 | 双面生长型mocvd反应器 |
| CN102766851B (zh) * | 2011-05-04 | 2014-01-01 | 广东量晶光电科技有限公司 | 一种金属有机化学气相沉积反应器 |
| JP5867913B2 (ja) * | 2011-05-30 | 2016-02-24 | 昭和電工株式会社 | 炭化珪素膜のcvd装置 |
| JP5897834B2 (ja) | 2011-07-19 | 2016-03-30 | 昭和電工株式会社 | SiCエピタキシャルウェハの製造方法 |
| JP5933202B2 (ja) | 2011-08-05 | 2016-06-08 | 昭和電工株式会社 | エピタキシャルウェハの製造装置及び製造方法 |
| JP5865625B2 (ja) | 2011-08-05 | 2016-02-17 | 昭和電工株式会社 | エピタキシャルウェハの製造装置及び製造方法 |
| DE102011083245B4 (de) | 2011-09-22 | 2019-04-25 | Siltronic Ag | Verfahren und Vorrichtung zum Abscheiden einer epitaktischen Schicht aus Silizium auf einer Halbleiterscheibe aus einkristallinem Silizium durch Gasphasenabscheidung in einer Prozesskammer |
| US20130171350A1 (en) * | 2011-12-29 | 2013-07-04 | Intermolecular Inc. | High Throughput Processing Using Metal Organic Chemical Vapor Deposition |
| JP6037671B2 (ja) | 2012-06-19 | 2016-12-07 | 昭和電工株式会社 | SiCエピタキシャルウェハ及びその製造方法 |
| US8860040B2 (en) | 2012-09-11 | 2014-10-14 | Dow Corning Corporation | High voltage power semiconductor devices on SiC |
| US9018639B2 (en) | 2012-10-26 | 2015-04-28 | Dow Corning Corporation | Flat SiC semiconductor substrate |
| US9797064B2 (en) | 2013-02-05 | 2017-10-24 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion |
| US9738991B2 (en) | 2013-02-05 | 2017-08-22 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion |
| US9017804B2 (en) | 2013-02-05 | 2015-04-28 | Dow Corning Corporation | Method to reduce dislocations in SiC crystal growth |
| US8940614B2 (en) | 2013-03-15 | 2015-01-27 | Dow Corning Corporation | SiC substrate with SiC epitaxial film |
| US9279192B2 (en) | 2014-07-29 | 2016-03-08 | Dow Corning Corporation | Method for manufacturing SiC wafer fit for integration with power device manufacturing technology |
| US20160033070A1 (en) * | 2014-08-01 | 2016-02-04 | Applied Materials, Inc. | Recursive pumping member |
| KR101792941B1 (ko) * | 2015-04-30 | 2017-11-02 | 어드밴스드 마이크로 패브리케이션 이큅먼트 인코퍼레이티드, 상하이 | 화학기상증착장치 및 그 세정방법 |
| KR102369676B1 (ko) | 2017-04-10 | 2022-03-04 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
| DE102018128558A1 (de) * | 2018-11-14 | 2020-05-14 | Aixtron Se | Gasauslassvorrichtung eines CVD-Reaktors |
| DE102019117479A1 (de) | 2019-06-28 | 2020-12-31 | Aixtron Se | In einem CVD-Reaktor verwendbares flaches Bauteil |
| DE102020101066A1 (de) | 2020-01-17 | 2021-07-22 | Aixtron Se | CVD-Reaktor mit doppelter Vorlaufzonenplatte |
| DE102020117669A1 (de) | 2020-07-03 | 2022-01-05 | Aixtron Se | CVD-Reaktor mit aus einem Graphitschaum bestehenden gasleitenden Bauteilen |
| CN117684262B (zh) * | 2024-02-04 | 2024-05-10 | 楚赟精工科技(上海)有限公司 | 气体注入装置和气相反应设备 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1667036A1 (de) * | 1967-01-02 | 1971-05-27 | Bayer Ag | Verfahren und Vorrichtung zum direkten elektrischen Erhitzen von Gasen oder gasfoermigen Stoffen |
| JPS59149020A (ja) * | 1983-02-16 | 1984-08-25 | Hitachi Ltd | 縦型反応炉 |
| JPS61236604A (ja) * | 1985-04-11 | 1986-10-21 | Toshiba Ceramics Co Ltd | β−Si↓3N↓4の合成方法 |
| FR2628984B1 (fr) * | 1988-03-22 | 1990-12-28 | Labo Electronique Physique | Reacteur d'epitaxie a planetaire |
| FR2638020B1 (fr) * | 1988-10-14 | 1990-12-28 | Labo Electronique Physique | Reacteur d'epitaxie a collecteur de gaz ameliore |
| JP2745819B2 (ja) * | 1990-12-10 | 1998-04-28 | 日立電線株式会社 | 気相膜成長装置 |
| JP3414475B2 (ja) * | 1994-02-25 | 2003-06-09 | スタンレー電気株式会社 | 結晶成長装置 |
| DE19622402C1 (de) * | 1996-06-04 | 1997-10-16 | Siemens Ag | Vorrichtung zum Behandeln wenigstens eines Substrats sowie Verwendung der Vorrichtung |
| US5891251A (en) * | 1996-08-07 | 1999-04-06 | Macleish; Joseph H. | CVD reactor having heated process chamber within isolation chamber |
| US5653808A (en) * | 1996-08-07 | 1997-08-05 | Macleish; Joseph H. | Gas injection system for CVD reactors |
| US5788777A (en) * | 1997-03-06 | 1998-08-04 | Burk, Jr.; Albert A. | Susceptor for an epitaxial growth factor |
| ATE276381T1 (de) * | 1999-07-13 | 2004-10-15 | Aixtron Ag | Abdichtungsmittel und dessen verwendung in abscheidungsreaktor |
| SE9903675D0 (sv) * | 1999-10-13 | 1999-10-13 | Abb Research Ltd | A device and a method for heat treatment of an object in a susceptor |
| EP1240366B1 (fr) * | 1999-12-22 | 2003-07-09 | Aixtron AG | Reacteur de depot chimique en phase vapeur et chambre de traitement destinee a ce reacteur |
| US6716289B1 (en) * | 2000-08-09 | 2004-04-06 | Itt Manufacturing Enterprises, Inc. | Rigid gas collector for providing an even flow of gasses |
| US6666920B1 (en) * | 2000-08-09 | 2003-12-23 | Itt Manufacturing Enterprises, Inc. | Gas collector for providing an even flow of gasses through a reaction chamber of an epitaxial reactor |
| US6325855B1 (en) * | 2000-08-09 | 2001-12-04 | Itt Manufacturing Enterprises, Inc. | Gas collector for epitaxial reactors |
| DE10043601A1 (de) * | 2000-09-01 | 2002-03-14 | Aixtron Ag | Vorrichtung und Verfahren zum Abscheiden insbesondere kristalliner Schichten auf insbesondere kristallinen Substraten |
| DE10043599A1 (de) * | 2000-09-01 | 2002-03-14 | Aixtron Ag | Vorrichtung zum Abscheiden insbesondere kristalliner Schichten auf einem oder mehreren insbesondere ebenfalls kristalliner Substraten |
| DE10043597A1 (de) * | 2000-09-01 | 2002-03-14 | Aixtron Ag | Vorrichtung zum Abscheiden insbesondere kristalliner Schichten auf insbesonder e kristallinen Substraten |
| DE10043600B4 (de) * | 2000-09-01 | 2013-12-05 | Aixtron Se | Vorrichtung zum Abscheiden insbesondere kristalliner Schichten auf einem oder mehreren, insbesondere ebenfalls kristallinen Substraten |
| DE10064944A1 (de) * | 2000-09-22 | 2002-04-11 | Aixtron Ag | Verfahren zum Abscheiden von insbesondere kristallinen Schichten, Gaseinlassorgan sowie Vorrichtung zur Durchführung des Verfahrens |
| KR100443908B1 (ko) * | 2001-10-25 | 2004-08-09 | 삼성전자주식회사 | 플라즈마 화학기상증착장치 및 이를 이용한나이트라이드막 형성방법 |
-
2000
- 2000-09-01 DE DE10043599A patent/DE10043599A1/de not_active Ceased
-
2001
- 2001-08-01 AU AU2002212125A patent/AU2002212125A1/en not_active Abandoned
- 2001-08-01 WO PCT/EP2001/008886 patent/WO2002018670A2/fr not_active Ceased
- 2001-08-01 EP EP01980228A patent/EP1397528B8/fr not_active Expired - Lifetime
- 2001-08-01 DE DE50114978T patent/DE50114978D1/de not_active Expired - Lifetime
- 2001-08-01 JP JP2002522571A patent/JP4961092B2/ja not_active Expired - Lifetime
- 2001-08-24 TW TW090120837A patent/TW526276B/zh not_active IP Right Cessation
-
2003
- 2003-03-03 US US10/378,493 patent/US7332038B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP4961092B2 (ja) | 2012-06-27 |
| US20040003779A1 (en) | 2004-01-08 |
| EP1397528B1 (fr) | 2009-07-08 |
| US7332038B2 (en) | 2008-02-19 |
| EP1397528A2 (fr) | 2004-03-17 |
| DE10043599A1 (de) | 2002-03-14 |
| TW526276B (en) | 2003-04-01 |
| EP1397528B8 (fr) | 2009-09-09 |
| WO2002018670A2 (fr) | 2002-03-07 |
| WO2002018670A3 (fr) | 2003-12-24 |
| DE50114978D1 (de) | 2009-08-20 |
| JP2004507897A (ja) | 2004-03-11 |
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