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AU2002211521A1 - Polishing apparatus and method with a refreshing polishing belt and loadable housing - Google Patents

Polishing apparatus and method with a refreshing polishing belt and loadable housing

Info

Publication number
AU2002211521A1
AU2002211521A1 AU2002211521A AU1152102A AU2002211521A1 AU 2002211521 A1 AU2002211521 A1 AU 2002211521A1 AU 2002211521 A AU2002211521 A AU 2002211521A AU 1152102 A AU1152102 A AU 1152102A AU 2002211521 A1 AU2002211521 A1 AU 2002211521A1
Authority
AU
Australia
Prior art keywords
polishing
refreshing
belt
loadable
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002211521A
Inventor
Jalal Ashjaee
Homayoun Talieh
Konstantin Volodarsky
Douglas W. Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Nutool Inc
Original Assignee
ASM Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc
Publication of AU2002211521A1 publication Critical patent/AU2002211521A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/02Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2002211521A 2000-10-06 2001-10-04 Polishing apparatus and method with a refreshing polishing belt and loadable housing Abandoned AU2002211521A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/684,059 US6468139B1 (en) 1998-12-01 2000-10-06 Polishing apparatus and method with a refreshing polishing belt and loadable housing
US09684059 2000-10-06
PCT/US2001/031423 WO2002028595A1 (en) 2000-10-06 2001-10-04 Polishing apparatus and method with a refreshing polishing belt and loadable housing

Publications (1)

Publication Number Publication Date
AU2002211521A1 true AU2002211521A1 (en) 2002-04-15

Family

ID=24746539

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002211521A Abandoned AU2002211521A1 (en) 2000-10-06 2001-10-04 Polishing apparatus and method with a refreshing polishing belt and loadable housing

Country Status (4)

Country Link
US (1) US6468139B1 (en)
AU (1) AU2002211521A1 (en)
TW (1) TW496811B (en)
WO (1) WO2002028595A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6464571B2 (en) * 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US7425250B2 (en) 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US6589105B2 (en) * 1998-12-01 2003-07-08 Nutool, Inc. Pad tensioning method and system in a bi-directional linear polisher
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
US6939203B2 (en) * 2002-04-18 2005-09-06 Asm Nutool, Inc. Fluid bearing slide assembly for workpiece polishing
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7025861B2 (en) * 2003-02-06 2006-04-11 Applied Materials Contact plating apparatus
US7648622B2 (en) 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
US7285195B2 (en) * 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
JP4744250B2 (en) * 2005-09-14 2011-08-10 株式会社岡本工作機械製作所 Double-side polishing apparatus and double-side polishing method for square substrate
CN102554731B (en) * 2011-12-08 2014-08-06 高健生 Polishing machine
CN104084866B (en) * 2014-07-15 2016-08-24 重庆大学 A kind of belt-sanding burnishing device
CN107097135B (en) * 2017-06-22 2019-11-29 赵君彪 A kind of plate derusting device
CN118744387B (en) * 2024-08-13 2025-04-01 山东国耀金属科技股份有限公司 A forging workpiece surface grinding and polishing equipment

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US669923A (en) * 1900-04-11 1901-03-12 Edgar Grauert Grinding and polishing device.
US3888050A (en) * 1974-02-19 1975-06-10 Timesavers Inc Method of and apparatus for rapidly and simultaneously abrading metal workpieces in preselected plural numbers
US4412400A (en) * 1980-10-20 1983-11-01 Verbatim Corporation Apparatus for burnishing
DE3113204A1 (en) 1981-04-02 1982-10-28 Percy 3008 Garbsen Lambelet Apparatus for grinding, abrading or polishing workpieces
DE3643914A1 (en) 1986-12-22 1988-06-30 Zeiss Carl Fa METHOD AND DEVICE FOR LAPPING OR POLISHING OPTICAL SURFACES
JPH05177523A (en) 1991-06-06 1993-07-20 Commiss Energ Atom Stretched fine abrasive platelet and abrasive apparatus provided with improved wafer supporting head
EP0550298B1 (en) * 1991-11-30 1997-10-22 Sony Corporation Grinder for grinding stamper used for disc molding
US5245796A (en) 1992-04-02 1993-09-21 At&T Bell Laboratories Slurry polisher using ultrasonic agitation
JP3200468B2 (en) 1992-05-21 2001-08-20 日本エレクトロプレイテイング・エンジニヤース株式会社 Wafer plating equipment
US5377453A (en) * 1993-02-12 1995-01-03 Perneczky; George C. Automated method and apparatus for polishing hot strip mill run-out table rolls
BR9406687A (en) * 1993-05-26 1996-02-06 Minnesota Mining & Mfg Process for polishing a workpiece
JP2894153B2 (en) 1993-05-27 1999-05-24 信越半導体株式会社 Method and apparatus for manufacturing silicon wafer
US5489235A (en) * 1993-09-13 1996-02-06 Minnesota Mining And Manufacturing Company Abrasive article and method of making same
RU2124978C1 (en) * 1993-09-13 1999-01-20 Миннесота Майнинг Энд Мэнюфекчуринг Компани Abrasive article, method and tool for its production and use for finishing treatment of products
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US5650039A (en) 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
ATE186001T1 (en) * 1994-08-09 1999-11-15 Ontrak Systems Inc LINEAR POLISHER AND WAFER PLANARISATION PROCESS
US5551959A (en) * 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same
WO1996010471A1 (en) * 1994-09-30 1996-04-11 Minnesota Mining And Manufacturing Company Coated abrasive article, method for preparing the same, and method of using
US5593344A (en) 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5762751A (en) 1995-08-17 1998-06-09 Semitool, Inc. Semiconductor processor with wafer face protection
US5951373A (en) 1995-10-27 1999-09-14 Applied Materials, Inc. Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning
US5961372A (en) 1995-12-05 1999-10-05 Applied Materials, Inc. Substrate belt polisher
JP2830907B2 (en) * 1995-12-06 1998-12-02 日本電気株式会社 Semiconductor substrate polishing equipment
WO1997042005A1 (en) * 1996-05-03 1997-11-13 Minnesota Mining And Manufacturing Company Nonwoven abrasive articles
US5951368A (en) * 1996-05-29 1999-09-14 Ebara Corporation Polishing apparatus
US5770521A (en) 1996-05-30 1998-06-23 Cypress Semiconductor Corporation Anti-shear method and system for semiconductor wafer removal
JPH09321001A (en) 1996-05-31 1997-12-12 Komatsu Electron Metals Co Ltd Method for polishing semiconductor wafer
JPH1034514A (en) * 1996-07-24 1998-02-10 Sanshin:Kk Surface polishing method and device therefor
US5951377A (en) * 1996-08-01 1999-09-14 Radtec, Inc. Microfinishing machine
US5899801A (en) 1996-10-31 1999-05-04 Applied Materials, Inc. Method and apparatus for removing a substrate from a polishing pad in a chemical mechanical polishing system
US5807165A (en) 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
US6312319B1 (en) * 1997-04-04 2001-11-06 Timothy J. Donohue Polishing media magazine for improved polishing
US6110025A (en) 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US6113479A (en) 1997-07-25 2000-09-05 Obsidian, Inc. Wafer carrier for chemical mechanical planarization polishing
US5899798A (en) 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
US6196896B1 (en) 1997-10-31 2001-03-06 Obsidian, Inc. Chemical mechanical polisher
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6464571B2 (en) * 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US6103628A (en) * 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
US6244935B1 (en) 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
EP1025955B1 (en) * 1999-02-04 2005-04-13 Applied Materials, Inc. Chemical mechanical polishing with a moving polishing sheet
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6241583B1 (en) * 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
EP1052063A1 (en) 1999-05-03 2000-11-15 Applied Materials, Inc. System for chemical mechanical planarization
US6520833B1 (en) * 2000-06-30 2003-02-18 Lam Research Corporation Oscillating fixed abrasive CMP system and methods for implementing the same

Also Published As

Publication number Publication date
WO2002028595A1 (en) 2002-04-11
TW496811B (en) 2002-08-01
US6468139B1 (en) 2002-10-22

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