AU2002211521A1 - Polishing apparatus and method with a refreshing polishing belt and loadable housing - Google Patents
Polishing apparatus and method with a refreshing polishing belt and loadable housingInfo
- Publication number
- AU2002211521A1 AU2002211521A1 AU2002211521A AU1152102A AU2002211521A1 AU 2002211521 A1 AU2002211521 A1 AU 2002211521A1 AU 2002211521 A AU2002211521 A AU 2002211521A AU 1152102 A AU1152102 A AU 1152102A AU 2002211521 A1 AU2002211521 A1 AU 2002211521A1
- Authority
- AU
- Australia
- Prior art keywords
- polishing
- refreshing
- belt
- loadable
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005498 polishing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/684,059 US6468139B1 (en) | 1998-12-01 | 2000-10-06 | Polishing apparatus and method with a refreshing polishing belt and loadable housing |
| US09684059 | 2000-10-06 | ||
| PCT/US2001/031423 WO2002028595A1 (en) | 2000-10-06 | 2001-10-04 | Polishing apparatus and method with a refreshing polishing belt and loadable housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2002211521A1 true AU2002211521A1 (en) | 2002-04-15 |
Family
ID=24746539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002211521A Abandoned AU2002211521A1 (en) | 2000-10-06 | 2001-10-04 | Polishing apparatus and method with a refreshing polishing belt and loadable housing |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6468139B1 (en) |
| AU (1) | AU2002211521A1 (en) |
| TW (1) | TW496811B (en) |
| WO (1) | WO2002028595A1 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6464571B2 (en) * | 1998-12-01 | 2002-10-15 | Nutool, Inc. | Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
| US7425250B2 (en) | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
| US6589105B2 (en) * | 1998-12-01 | 2003-07-08 | Nutool, Inc. | Pad tensioning method and system in a bi-directional linear polisher |
| US20030146102A1 (en) * | 2002-02-05 | 2003-08-07 | Applied Materials, Inc. | Method for forming copper interconnects |
| US6939203B2 (en) * | 2002-04-18 | 2005-09-06 | Asm Nutool, Inc. | Fluid bearing slide assembly for workpiece polishing |
| US7138039B2 (en) * | 2003-01-21 | 2006-11-21 | Applied Materials, Inc. | Liquid isolation of contact rings |
| US7087144B2 (en) * | 2003-01-31 | 2006-08-08 | Applied Materials, Inc. | Contact ring with embedded flexible contacts |
| US7025861B2 (en) * | 2003-02-06 | 2006-04-11 | Applied Materials | Contact plating apparatus |
| US7648622B2 (en) | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
| US20050218000A1 (en) * | 2004-04-06 | 2005-10-06 | Applied Materials, Inc. | Conditioning of contact leads for metal plating systems |
| US7285195B2 (en) * | 2004-06-24 | 2007-10-23 | Applied Materials, Inc. | Electric field reducing thrust plate |
| JP4744250B2 (en) * | 2005-09-14 | 2011-08-10 | 株式会社岡本工作機械製作所 | Double-side polishing apparatus and double-side polishing method for square substrate |
| CN102554731B (en) * | 2011-12-08 | 2014-08-06 | 高健生 | Polishing machine |
| CN104084866B (en) * | 2014-07-15 | 2016-08-24 | 重庆大学 | A kind of belt-sanding burnishing device |
| CN107097135B (en) * | 2017-06-22 | 2019-11-29 | 赵君彪 | A kind of plate derusting device |
| CN118744387B (en) * | 2024-08-13 | 2025-04-01 | 山东国耀金属科技股份有限公司 | A forging workpiece surface grinding and polishing equipment |
Family Cites Families (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US669923A (en) * | 1900-04-11 | 1901-03-12 | Edgar Grauert | Grinding and polishing device. |
| US3888050A (en) * | 1974-02-19 | 1975-06-10 | Timesavers Inc | Method of and apparatus for rapidly and simultaneously abrading metal workpieces in preselected plural numbers |
| US4412400A (en) * | 1980-10-20 | 1983-11-01 | Verbatim Corporation | Apparatus for burnishing |
| DE3113204A1 (en) | 1981-04-02 | 1982-10-28 | Percy 3008 Garbsen Lambelet | Apparatus for grinding, abrading or polishing workpieces |
| DE3643914A1 (en) | 1986-12-22 | 1988-06-30 | Zeiss Carl Fa | METHOD AND DEVICE FOR LAPPING OR POLISHING OPTICAL SURFACES |
| JPH05177523A (en) | 1991-06-06 | 1993-07-20 | Commiss Energ Atom | Stretched fine abrasive platelet and abrasive apparatus provided with improved wafer supporting head |
| EP0550298B1 (en) * | 1991-11-30 | 1997-10-22 | Sony Corporation | Grinder for grinding stamper used for disc molding |
| US5245796A (en) | 1992-04-02 | 1993-09-21 | At&T Bell Laboratories | Slurry polisher using ultrasonic agitation |
| JP3200468B2 (en) | 1992-05-21 | 2001-08-20 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Wafer plating equipment |
| US5377453A (en) * | 1993-02-12 | 1995-01-03 | Perneczky; George C. | Automated method and apparatus for polishing hot strip mill run-out table rolls |
| BR9406687A (en) * | 1993-05-26 | 1996-02-06 | Minnesota Mining & Mfg | Process for polishing a workpiece |
| JP2894153B2 (en) | 1993-05-27 | 1999-05-24 | 信越半導体株式会社 | Method and apparatus for manufacturing silicon wafer |
| US5489235A (en) * | 1993-09-13 | 1996-02-06 | Minnesota Mining And Manufacturing Company | Abrasive article and method of making same |
| RU2124978C1 (en) * | 1993-09-13 | 1999-01-20 | Миннесота Майнинг Энд Мэнюфекчуринг Компани | Abrasive article, method and tool for its production and use for finishing treatment of products |
| US5938504A (en) * | 1993-11-16 | 1999-08-17 | Applied Materials, Inc. | Substrate polishing apparatus |
| US5650039A (en) | 1994-03-02 | 1997-07-22 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved slurry distribution |
| ATE186001T1 (en) * | 1994-08-09 | 1999-11-15 | Ontrak Systems Inc | LINEAR POLISHER AND WAFER PLANARISATION PROCESS |
| US5551959A (en) * | 1994-08-24 | 1996-09-03 | Minnesota Mining And Manufacturing Company | Abrasive article having a diamond-like coating layer and method for making same |
| WO1996010471A1 (en) * | 1994-09-30 | 1996-04-11 | Minnesota Mining And Manufacturing Company | Coated abrasive article, method for preparing the same, and method of using |
| US5593344A (en) | 1994-10-11 | 1997-01-14 | Ontrak Systems, Inc. | Wafer polishing machine with fluid bearings and drive systems |
| US5908530A (en) | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
| US5762751A (en) | 1995-08-17 | 1998-06-09 | Semitool, Inc. | Semiconductor processor with wafer face protection |
| US5951373A (en) | 1995-10-27 | 1999-09-14 | Applied Materials, Inc. | Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning |
| US5961372A (en) | 1995-12-05 | 1999-10-05 | Applied Materials, Inc. | Substrate belt polisher |
| JP2830907B2 (en) * | 1995-12-06 | 1998-12-02 | 日本電気株式会社 | Semiconductor substrate polishing equipment |
| WO1997042005A1 (en) * | 1996-05-03 | 1997-11-13 | Minnesota Mining And Manufacturing Company | Nonwoven abrasive articles |
| US5951368A (en) * | 1996-05-29 | 1999-09-14 | Ebara Corporation | Polishing apparatus |
| US5770521A (en) | 1996-05-30 | 1998-06-23 | Cypress Semiconductor Corporation | Anti-shear method and system for semiconductor wafer removal |
| JPH09321001A (en) | 1996-05-31 | 1997-12-12 | Komatsu Electron Metals Co Ltd | Method for polishing semiconductor wafer |
| JPH1034514A (en) * | 1996-07-24 | 1998-02-10 | Sanshin:Kk | Surface polishing method and device therefor |
| US5951377A (en) * | 1996-08-01 | 1999-09-14 | Radtec, Inc. | Microfinishing machine |
| US5899801A (en) | 1996-10-31 | 1999-05-04 | Applied Materials, Inc. | Method and apparatus for removing a substrate from a polishing pad in a chemical mechanical polishing system |
| US5807165A (en) | 1997-03-26 | 1998-09-15 | International Business Machines Corporation | Method of electrochemical mechanical planarization |
| US6312319B1 (en) * | 1997-04-04 | 2001-11-06 | Timothy J. Donohue | Polishing media magazine for improved polishing |
| US6110025A (en) | 1997-05-07 | 2000-08-29 | Obsidian, Inc. | Containment ring for substrate carrier apparatus |
| US6113479A (en) | 1997-07-25 | 2000-09-05 | Obsidian, Inc. | Wafer carrier for chemical mechanical planarization polishing |
| US5899798A (en) | 1997-07-25 | 1999-05-04 | Obsidian Inc. | Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing |
| US6196896B1 (en) | 1997-10-31 | 2001-03-06 | Obsidian, Inc. | Chemical mechanical polisher |
| US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
| US6464571B2 (en) * | 1998-12-01 | 2002-10-15 | Nutool, Inc. | Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
| US6103628A (en) * | 1998-12-01 | 2000-08-15 | Nutool, Inc. | Reverse linear polisher with loadable housing |
| US6244935B1 (en) | 1999-02-04 | 2001-06-12 | Applied Materials, Inc. | Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
| EP1025955B1 (en) * | 1999-02-04 | 2005-04-13 | Applied Materials, Inc. | Chemical mechanical polishing with a moving polishing sheet |
| US6179709B1 (en) * | 1999-02-04 | 2001-01-30 | Applied Materials, Inc. | In-situ monitoring of linear substrate polishing operations |
| US6241583B1 (en) * | 1999-02-04 | 2001-06-05 | Applied Materials, Inc. | Chemical mechanical polishing with a plurality of polishing sheets |
| US6135859A (en) * | 1999-04-30 | 2000-10-24 | Applied Materials, Inc. | Chemical mechanical polishing with a polishing sheet and a support sheet |
| EP1052063A1 (en) | 1999-05-03 | 2000-11-15 | Applied Materials, Inc. | System for chemical mechanical planarization |
| US6520833B1 (en) * | 2000-06-30 | 2003-02-18 | Lam Research Corporation | Oscillating fixed abrasive CMP system and methods for implementing the same |
-
2000
- 2000-10-06 US US09/684,059 patent/US6468139B1/en not_active Expired - Lifetime
-
2001
- 2001-10-04 WO PCT/US2001/031423 patent/WO2002028595A1/en not_active Ceased
- 2001-10-04 AU AU2002211521A patent/AU2002211521A1/en not_active Abandoned
- 2001-10-05 TW TW090124741A patent/TW496811B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002028595A1 (en) | 2002-04-11 |
| TW496811B (en) | 2002-08-01 |
| US6468139B1 (en) | 2002-10-22 |
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