AU2002257013A1 - Micro-electro-mechanical systems packaging - Google Patents

Micro-electro-mechanical systems packaging

Info

Publication number: AU2002257013A1
Authority: AU; Australia
Prior art keywords: electro; micro; mechanical systems; systems packaging; packaging
Prior art date: 2002-02-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2002257013A

Inventor

Aijay Babulal Alai

Venkata Pavanpratap Chemata

Glenn S. West

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NANO STORAGE Pte Ltd

Original Assignee

NANO STORAGE Pte Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-02-28

Filing date

2002-02-28

Publication date

2003-10-20

2002-02-28 Application filed by NANO STORAGE Pte Ltd filed Critical NANO STORAGE Pte Ltd

2003-10-20 Publication of AU2002257013A1 publication Critical patent/AU2002257013A1/en

Status Abandoned legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Computer Hardware Design (AREA)
Micromachines (AREA)

AU2002257013A 2002-02-28 2002-02-28 Micro-electro-mechanical systems packaging Abandoned AU2002257013A1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/US2002/006352 WO2003085732A1 (en)	2002-02-28	2002-02-28	Micro-electro-mechanical systems packaging

Publications (1)

Publication Number	Publication Date
AU2002257013A1 true AU2002257013A1 (en)	2003-10-20

Family

ID=28789599

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2002257013A Abandoned AU2002257013A1 (en)	2002-02-28	2002-02-28	Micro-electro-mechanical systems packaging

Country Status (2)

Country	Link
AU (1)	AU2002257013A1 (en)
WO (1)	WO2003085732A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1949770B1 (en)	2005-11-09	2018-12-12	Koninklijke Philips N.V.	Method of manufacturing a package carrier for enclosing at least one microelectronic element and method of manufacturing a diagnostic device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW373308B (en) *	1995-02-24	1999-11-01	Agere Systems Inc	Thin packaging of multi-chip modules with enhanced thermal/power management
US5977640A (en) *	1998-06-26	1999-11-02	International Business Machines Corporation	Highly integrated chip-on-chip packaging
US20020090749A1 (en) *	2001-01-09	2002-07-11	3M Innovative Properties Company	Hermetic package for mems devices with integrated carrier

2002
- 2002-02-28 AU AU2002257013A patent/AU2002257013A1/en not_active Abandoned
- 2002-02-28 WO PCT/US2002/006352 patent/WO2003085732A1/en not_active Ceased

Also Published As

Publication number	Publication date
WO2003085732A1 (en)	2003-10-16

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Legal Events

Date	Code	Title	Description
2004-11-18	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase