[go: up one dir, main page]

AU2001238190A1 - Apparatus and method for passive phase change thermal management - Google Patents

Apparatus and method for passive phase change thermal management

Info

Publication number
AU2001238190A1
AU2001238190A1 AU2001238190A AU3819001A AU2001238190A1 AU 2001238190 A1 AU2001238190 A1 AU 2001238190A1 AU 2001238190 A AU2001238190 A AU 2001238190A AU 3819001 A AU3819001 A AU 3819001A AU 2001238190 A1 AU2001238190 A1 AU 2001238190A1
Authority
AU
Australia
Prior art keywords
phase change
thermal management
change thermal
passive phase
passive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001238190A
Inventor
Terrance J. Dishongh
David H. Pullen
Damion T. Searls
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
DISHOHGH TERRANCE J
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DISHOHGH TERRANCE J, Intel Corp filed Critical DISHOHGH TERRANCE J
Publication of AU2001238190A1 publication Critical patent/AU2001238190A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/021—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material and the heat-exchanging means being enclosed in one container
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU2001238190A 2000-03-14 2001-02-13 Apparatus and method for passive phase change thermal management Abandoned AU2001238190A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09525173 2000-03-14
US09/525,173 US6672370B2 (en) 2000-03-14 2000-03-14 Apparatus and method for passive phase change thermal management
PCT/US2001/004565 WO2001069677A2 (en) 2000-03-14 2001-02-13 Apparatus and method for passive phase change thermal management

Publications (1)

Publication Number Publication Date
AU2001238190A1 true AU2001238190A1 (en) 2001-09-24

Family

ID=24092228

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001238190A Abandoned AU2001238190A1 (en) 2000-03-14 2001-02-13 Apparatus and method for passive phase change thermal management

Country Status (8)

Country Link
US (3) US6672370B2 (en)
EP (1) EP1264343B1 (en)
KR (2) KR100757614B1 (en)
CN (1) CN1244959C (en)
AU (1) AU2001238190A1 (en)
HK (1) HK1050761B (en)
MY (1) MY137459A (en)
WO (1) WO2001069677A2 (en)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6672370B2 (en) * 2000-03-14 2004-01-06 Intel Corporation Apparatus and method for passive phase change thermal management
US20030131476A1 (en) * 2001-09-28 2003-07-17 Vlad Ocher Heat conduits and terminal radiator for microcircuit packaging and manufacturing process
DE10157671A1 (en) * 2001-11-24 2003-06-05 Merck Patent Gmbh Optimized use of PCM in cooling devices
US6621702B2 (en) * 2002-01-25 2003-09-16 Lockheed Martin Corporation Method and apparatus for absorbing thermal energy
US7126822B2 (en) 2003-03-31 2006-10-24 Intel Corporation Electronic packages, assemblies, and systems with fluid cooling
KR100608730B1 (en) * 2003-12-20 2006-08-04 엘지전자 주식회사 Case of mobile terminal with heat dissipation
US20050280987A1 (en) * 2004-06-07 2005-12-22 Kwitek Benjamin J Phase change materials as a heat sink for computers
WO2006073914A2 (en) * 2005-01-07 2006-07-13 Bay Materials, Llc Thermally-responsive materials and devices comprising such materials
US20070032610A1 (en) * 2005-08-08 2007-02-08 General Electric Company Energy responsive composition and associated method
WO2007075130A1 (en) * 2005-12-27 2007-07-05 Abb Ab Device and method for cooling a power device
US20070171615A1 (en) * 2006-01-24 2007-07-26 Wan-Lin Xia Heat dissipation device
JP4872511B2 (en) * 2006-08-02 2012-02-08 株式会社日立製作所 Temperature adjustment member
US7433190B2 (en) * 2006-10-06 2008-10-07 Honeywell International Inc. Liquid cooled electronic chassis having a plurality of phase change material reservoirs
JP4657226B2 (en) * 2007-02-01 2011-03-23 トヨタ自動車株式会社 Heat storage device
US7983373B2 (en) * 2007-02-07 2011-07-19 Vintomie Networks B.V., Llc Clock distribution for 10GBase-T analog front end
US8082978B2 (en) * 2007-08-07 2011-12-27 Georgia Tech Research Corporation Fluid-to-fluid spot-to-spreader heat management devices and systems and methods of managing heat
WO2009031100A1 (en) 2007-09-07 2009-03-12 International Business Machines Corporation Method and device for cooling a heat generating component
US20090154113A1 (en) * 2007-12-12 2009-06-18 Inter Corporation Thermal energy storage for mobile computing thermal management
US7810965B2 (en) 2008-03-02 2010-10-12 Lumenetix, Inc. Heat removal system and method for light emitting diode lighting apparatus
US9102857B2 (en) * 2008-03-02 2015-08-11 Lumenetix, Inc. Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled
US8219857B2 (en) * 2008-06-26 2012-07-10 International Business Machines Corporation Temperature-profiled device fingerprint generation and authentication from power-up states of static cells
US8631855B2 (en) * 2008-08-15 2014-01-21 Lighting Science Group Corporation System for dissipating heat energy
FR2943731A1 (en) * 2009-03-25 2010-10-01 Faurecia Sys Echappement EXHAUST LINE OF A MOTOR VEHICLE WITH A CLOSED CYCLE FOR RECOVERING THE THERMAL ENERGY OF THE EXHAUST GAS, AND METHOD OF CONTROLLING THE SAME
US8130496B2 (en) * 2009-04-01 2012-03-06 Intel Corporation Device and method for mitigating radio frequency interference
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US8123389B2 (en) 2010-02-12 2012-02-28 Lumenetix, Inc. LED lamp assembly with thermal management system
DE102010009762A1 (en) 2010-03-01 2011-09-01 Lewin Industries Gmbh Flat-mounting vaporization cooling body for dissipating waste heat of e.g. electronic part of blade server, has main heat dissipation path running from fluid space towards heat dissipating element that is arranged at narrow side of body
US8218321B2 (en) * 2010-04-14 2012-07-10 Sony Mobile Communications Ab Self-cooling electrical device
KR101800437B1 (en) * 2011-05-02 2017-11-22 삼성전자주식회사 Semiconductor Package
WO2012157521A1 (en) * 2011-05-17 2012-11-22 シャープ株式会社 Heat-transfer device
US20130118715A1 (en) * 2011-11-10 2013-05-16 Troy W. Livingston Heat transfer system applying boundary later penetration
US9326422B2 (en) * 2011-12-13 2016-04-26 Intel Corporation Techniques for computing device cooling using a self-pumping fluid
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
WO2014161065A1 (en) 2013-04-03 2014-10-09 Sigma Energy Storage Inc. Compressed air energy storage and recovery
EP2998673A4 (en) * 2013-05-17 2017-04-05 IHI Corporation Heat storage system
TW201510459A (en) * 2013-09-05 2015-03-16 Univ Nat Central Cooling apparatus using solid-liquid phase change material
US9618274B2 (en) * 2014-03-11 2017-04-11 Asia Vital Components Co., Ltd. Thermal module with enhanced assembling structure
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
TWI542277B (en) * 2014-09-30 2016-07-11 旭德科技股份有限公司 Heat dissipation module
US20190008859A1 (en) 2015-08-21 2019-01-10 Acerta Pharma B.V. Therapeutic Combinations of a MEK Inhibitor and a BTK Inhibitor
FR3042309B1 (en) 2015-10-09 2017-12-15 Commissariat Energie Atomique IMPROVED DBC STRUCTURE WITH SUPPORT INTEGRATING PHASE CHANGE MATERIAL
US10344816B2 (en) 2016-02-11 2019-07-09 Abb Schweiz Ag Pressure plate with phase change material
US10415474B2 (en) 2017-01-31 2019-09-17 General Electric Company Method and system for phase change material component cooling
US10866038B2 (en) * 2018-10-25 2020-12-15 United Arab Emirates University Heat sinks with vibration enhanced heat transfer for non-liquid heat sources
US11181323B2 (en) * 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements
CN109935559A (en) * 2019-02-25 2019-06-25 南京航空航天大学 Reinforcing radiator and method containing PCM encapsulation particle
US10985085B2 (en) * 2019-05-15 2021-04-20 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method for manufacturing the same
CN112635418A (en) * 2019-10-08 2021-04-09 全亿大科技（佛山）有限公司 Liquid cooling radiator
US11031317B2 (en) 2019-10-09 2021-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Direct bonded metal substrates with encapsulated phase change materials and electronic assemblies incorporating the same
US11754343B2 (en) 2019-11-05 2023-09-12 Toyota Motor Engineering & Manufacturing North America, Inc. Phase change heat-storing mechanisms for substrates of electronic assemblies
US11598589B2 (en) * 2020-01-15 2023-03-07 Sanjay K Roy Rotor cooling system
EP4125611B1 (en) 2020-03-30 2024-10-02 Koninklijke Philips N.V. Heat-dissipating arrangements for medical devices and associated devices, and systems
CN114423236B (en) * 2022-01-19 2023-08-18 中国电子科技集团公司第十研究所 Preparation method of phase change heat reservoir of electronic equipment

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1528494A (en) * 1922-08-25 1925-03-03 Electric Radiator & Engineerin Electric radiator
US3884295A (en) * 1970-02-24 1975-05-20 Nikolaus Laing Electric storage air heater
US3815575A (en) * 1971-12-17 1974-06-11 L Danis Cooking utensil
US4012770A (en) * 1972-09-28 1977-03-15 Dynatherm Corporation Cooling a heat-producing electrical or electronic component
LU66369A1 (en) * 1972-10-26 1973-01-23
US4223721A (en) * 1977-09-26 1980-09-23 Solar, Inc. Heat storage containers filled with the combination of a eutectic salt and a non-biodegradable filler material
US4312012A (en) * 1977-11-25 1982-01-19 International Business Machines Corp. Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
US4178727A (en) * 1978-02-01 1979-12-18 Architectural Research Corporation Heat absorbing panel
US4237023A (en) * 1979-03-20 1980-12-02 Massachusetts Institute Of Technology Aqueous heat-storage compositions containing fumed silicon dioxide and having prolonged heat-storage efficiencies
US4391267A (en) * 1981-04-15 1983-07-05 Kay Laboratories, Inc. Heat storage material
JPS58110994A (en) * 1981-12-24 1983-07-01 Furukawa Electric Co Ltd:The Rotary heat pipe
EP0087859B1 (en) * 1982-02-23 1986-04-30 Ciba Specialty Chemicals Water Treatments Limited Thermal energy storage compositions
US4579170A (en) * 1983-04-18 1986-04-01 The Dow Chemical Company Container for thermal energy storage materials
US4544028A (en) * 1983-04-20 1985-10-01 C. Mitchell Bedford Heat accumulator
US4602314A (en) 1983-10-14 1986-07-22 Intel Corporation Heat conduction mechanism for semiconductor devices
US5254380A (en) * 1985-11-22 1993-10-19 University Of Dayton Dry powder mixes comprising phase change materials
JPH01298753A (en) 1988-05-27 1989-12-01 Nec Corp Pin grid array integrated circuit package with heat sink
US4923077A (en) * 1989-02-14 1990-05-08 Pymah Corporation Modular heat sink package
US5007478A (en) * 1989-05-26 1991-04-16 University Of Miami Microencapsulated phase change material slurry heat sinks
US4982722A (en) * 1989-06-06 1991-01-08 Aladdin Synergetics, Inc. Heat retentive server with phase change core
EP0409179B1 (en) * 1989-07-19 1995-01-18 Showa Aluminum Corporation Heat pipe
US5370814A (en) * 1990-01-09 1994-12-06 The University Of Dayton Dry powder mixes comprising phase change materials
US5070933A (en) * 1991-01-22 1991-12-10 Zomeworks Corporation Temperature regulating system
JPH05218250A (en) 1992-02-06 1993-08-27 Mitsubishi Heavy Ind Ltd Heat dissipating apparatus with variable heat transfer rate
US6004662A (en) 1992-07-14 1999-12-21 Buckley; Theresa M. Flexible composite material with phase change thermal storage
US6227285B1 (en) * 1992-12-02 2001-05-08 Schümann Sasol Gmbh & Co. Kg Heat storage medium
FR2699365B1 (en) * 1992-12-16 1995-02-10 Alcatel Telspace System for dissipating the heat energy released by an electronic component.
US5315154A (en) * 1993-05-14 1994-05-24 Hughes Aircraft Company Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition
US5709914A (en) * 1994-01-18 1998-01-20 Hayes; Claude Q. C. Thermal storage and transfer device
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
TW307837B (en) * 1995-05-30 1997-06-11 Fujikura Kk
EP0851800B1 (en) * 1995-09-18 2002-06-05 Minnesota Mining And Manufacturing Company Thermoplastic lens blocking material
DE69726514T2 (en) * 1996-03-21 2004-09-23 Nippon Shokubai Co. Ltd. METHOD FOR THE PRODUCTION OF HEAT STORAGE MATERIALS
US5723059A (en) * 1996-05-21 1998-03-03 The United States Of America As Represented By The Secretary Of The Air Force Fluid density adjustment for functional fluids
ZA974977B (en) * 1996-06-12 1997-12-30 Univ Dayton Gel compositions for thermal energy storage.
US6395991B1 (en) * 1996-07-29 2002-05-28 International Business Machines Corporation Column grid array substrate attachment with heat sink stress relief
US6064572A (en) * 1996-11-27 2000-05-16 Remsburg; Ralph Thermosyphon-powered jet-impingement cooling device
US5895972A (en) 1996-12-31 1999-04-20 Intel Corporation Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug
US5940271A (en) * 1997-05-02 1999-08-17 Lsi Logic Corporation Stiffener with integrated heat sink attachment
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
US5945217A (en) * 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
US5924482A (en) 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
US5926367A (en) 1997-12-09 1999-07-20 Intel Corporation Method and apparatus for the thermal management of electronic devices
US5984953A (en) * 1998-05-21 1999-11-16 Tempra Technology, Inc. Self-regulating heat pack
US5986884A (en) * 1998-07-13 1999-11-16 Ford Motor Company Method for cooling electronic components
US6686003B2 (en) * 1998-11-13 2004-02-03 Fireking International, Inc. High performance fire-protection containers
US6202739B1 (en) * 1998-11-25 2001-03-20 Motorola, Inc. Apparatus including a heat-dissipating apparatus, and method for forming same
US6181558B1 (en) * 1999-08-24 2001-01-30 Cairns Advanced Tech. Inc. Heat absorber and combination electrical apparatus producing heat and heat absorber
US6672370B2 (en) * 2000-03-14 2004-01-06 Intel Corporation Apparatus and method for passive phase change thermal management

Also Published As

Publication number Publication date
CN1418373A (en) 2003-05-14
HK1050761A1 (en) 2003-07-04
US20020104641A1 (en) 2002-08-08
KR100539044B1 (en) 2005-12-27
CN1244959C (en) 2006-03-08
US20080066890A1 (en) 2008-03-20
HK1050761B (en) 2014-07-11
KR20050072154A (en) 2005-07-08
US20050051300A1 (en) 2005-03-10
US7316265B2 (en) 2008-01-08
EP1264343A2 (en) 2002-12-11
KR20020086923A (en) 2002-11-20
US7886809B2 (en) 2011-02-15
EP1264343B1 (en) 2014-01-22
KR100757614B1 (en) 2007-09-10
US6672370B2 (en) 2004-01-06
WO2001069677A2 (en) 2001-09-20
WO2001069677A3 (en) 2002-02-14
MY137459A (en) 2009-01-30

Similar Documents

Publication Publication Date Title
AU2001238190A1 (en) Apparatus and method for passive phase change thermal management
AU2001245275A1 (en) System and method for specification and exchange management
AU2001234748A1 (en) System and method for web browsing
AU2001247949A1 (en) Method and apparatus for research management
AU2001269886A1 (en) Method and system for product lifecycle management
AU2001268688A1 (en) Method and system for supplier relationship management
AU3871899A (en) Method and apparatus for asset management
WO2002050751A8 (en) System and method for project management and assessment
AU2002231002A1 (en) Method and system for account management
WO2002022264A8 (en) Method and apparatus for gradient generation
AU2002223659A1 (en) Method and system for intellectual property management
AU1941401A (en) Method and apparatus for risk management
AU2001266692A1 (en) System and method for licensing management
AU2002239249A1 (en) System and method for secure network mobility
AU2001250965A1 (en) Method and system for clinical knowledge management
AU2001221501A1 (en) Device and method for selecting network accesses
AU2002239239A1 (en) System and method for orthogonal inductance variation
AU2001261775A1 (en) Apparatus and method for secure object access
AU2001251563A1 (en) Method and system for managing credentials
AU2001277174A1 (en) High-efficiency computer thermal management apparatus and method
AU2002228762A1 (en) Method and device for wireless network access_
EP1146731A3 (en) Managing apparatus and method
AU2002227287A1 (en) Method and apparatus for relationship management
WO2002056232A8 (en) System and method for project management and assessment
AU2002230634A1 (en) System and method for managing application integration utilizing a network device