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AU2001296630A1 - Semiconductor device with reduced line-to-line capacitance and cross talk noise - Google Patents

Semiconductor device with reduced line-to-line capacitance and cross talk noise

Info

Publication number
AU2001296630A1
AU2001296630A1 AU2001296630A AU9663001A AU2001296630A1 AU 2001296630 A1 AU2001296630 A1 AU 2001296630A1 AU 2001296630 A AU2001296630 A AU 2001296630A AU 9663001 A AU9663001 A AU 9663001A AU 2001296630 A1 AU2001296630 A1 AU 2001296630A1
Authority
AU
Australia
Prior art keywords
line
semiconductor device
cross talk
talk noise
reduced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001296630A
Inventor
Frederick N. Hause
Manfred Horstmann
Karsten Wieczorek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10056868A external-priority patent/DE10056868A1/en
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001296630A1 publication Critical patent/AU2001296630A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/671Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor having lateral variation in doping or structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • H01L21/28017Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28247Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon passivation or protection of the electrode, e.g. using re-oxidation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329Insulating materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H10D30/0227Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/601Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/258Source or drain electrodes for field-effect devices characterised by the relative positions of the source or drain electrodes with respect to the gate electrode

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
AU2001296630A 2000-11-16 2001-10-04 Semiconductor device with reduced line-to-line capacitance and cross talk noise Abandoned AU2001296630A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE10056868 2000-11-16
DE10056868A DE10056868A1 (en) 2000-11-16 2000-11-16 Semiconductor device with reduced line capacitance and reduced crosstalk noise
US09812372 2001-03-20
US09/812,372 US6555892B2 (en) 2000-11-16 2001-03-20 Semiconductor device with reduced line-to-line capacitance and cross talk noise
PCT/US2001/031199 WO2002041405A1 (en) 2000-11-16 2001-10-04 Semiconductor device with reduced line-to-line capacitance and cross talk noise

Publications (1)

Publication Number Publication Date
AU2001296630A1 true AU2001296630A1 (en) 2002-05-27

Family

ID=26007680

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001296630A Abandoned AU2001296630A1 (en) 2000-11-16 2001-10-04 Semiconductor device with reduced line-to-line capacitance and cross talk noise

Country Status (5)

Country Link
EP (1) EP1334522A1 (en)
JP (1) JP2004514294A (en)
CN (1) CN1275331C (en)
AU (1) AU2001296630A1 (en)
WO (1) WO2002041405A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102456736A (en) * 2010-10-29 2012-05-16 上海宏力半导体制造有限公司 Channel-type field effect tube and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2560637B2 (en) * 1994-04-28 1996-12-04 日本電気株式会社 Field effect transistor and method of manufacturing the same
US5885871A (en) * 1997-07-31 1999-03-23 Stmicrolelectronics, Inc. Method of making EEPROM cell structure
US5882983A (en) * 1997-12-19 1999-03-16 Advanced Micro Devices, Inc. Trench isolation structure partially bound between a pair of low K dielectric structures
US6107667A (en) * 1998-09-10 2000-08-22 Advanced Micro Devices, Inc. MOS transistor with low-k spacer to suppress capacitive coupling between gate and source/drain extensions
US6271132B1 (en) * 1999-05-03 2001-08-07 Advanced Micro Devices, Inc. Self-aligned source and drain extensions fabricated in a damascene contact and gate process
US6124177A (en) * 1999-08-13 2000-09-26 Taiwan Semiconductor Manufacturing Company Method for making deep sub-micron mosfet structures having improved electrical characteristics
US6137126A (en) * 1999-08-17 2000-10-24 Advanced Micro Devices, Inc. Method to reduce gate-to-local interconnect capacitance using a low dielectric constant material for LDD spacer

Also Published As

Publication number Publication date
CN1475034A (en) 2004-02-11
WO2002041405A1 (en) 2002-05-23
CN1275331C (en) 2006-09-13
EP1334522A1 (en) 2003-08-13
JP2004514294A (en) 2004-05-13

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