AU2001296630A1 - Semiconductor device with reduced line-to-line capacitance and cross talk noise - Google Patents
Semiconductor device with reduced line-to-line capacitance and cross talk noiseInfo
- Publication number
- AU2001296630A1 AU2001296630A1 AU2001296630A AU9663001A AU2001296630A1 AU 2001296630 A1 AU2001296630 A1 AU 2001296630A1 AU 2001296630 A AU2001296630 A AU 2001296630A AU 9663001 A AU9663001 A AU 9663001A AU 2001296630 A1 AU2001296630 A1 AU 2001296630A1
- Authority
- AU
- Australia
- Prior art keywords
- line
- semiconductor device
- cross talk
- talk noise
- reduced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/671—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor having lateral variation in doping or structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28247—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon passivation or protection of the electrode, e.g. using re-oxidation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/258—Source or drain electrodes for field-effect devices characterised by the relative positions of the source or drain electrodes with respect to the gate electrode
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10056868 | 2000-11-16 | ||
| DE10056868A DE10056868A1 (en) | 2000-11-16 | 2000-11-16 | Semiconductor device with reduced line capacitance and reduced crosstalk noise |
| US09812372 | 2001-03-20 | ||
| US09/812,372 US6555892B2 (en) | 2000-11-16 | 2001-03-20 | Semiconductor device with reduced line-to-line capacitance and cross talk noise |
| PCT/US2001/031199 WO2002041405A1 (en) | 2000-11-16 | 2001-10-04 | Semiconductor device with reduced line-to-line capacitance and cross talk noise |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001296630A1 true AU2001296630A1 (en) | 2002-05-27 |
Family
ID=26007680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001296630A Abandoned AU2001296630A1 (en) | 2000-11-16 | 2001-10-04 | Semiconductor device with reduced line-to-line capacitance and cross talk noise |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1334522A1 (en) |
| JP (1) | JP2004514294A (en) |
| CN (1) | CN1275331C (en) |
| AU (1) | AU2001296630A1 (en) |
| WO (1) | WO2002041405A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456736A (en) * | 2010-10-29 | 2012-05-16 | 上海宏力半导体制造有限公司 | Channel-type field effect tube and preparation method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2560637B2 (en) * | 1994-04-28 | 1996-12-04 | 日本電気株式会社 | Field effect transistor and method of manufacturing the same |
| US5885871A (en) * | 1997-07-31 | 1999-03-23 | Stmicrolelectronics, Inc. | Method of making EEPROM cell structure |
| US5882983A (en) * | 1997-12-19 | 1999-03-16 | Advanced Micro Devices, Inc. | Trench isolation structure partially bound between a pair of low K dielectric structures |
| US6107667A (en) * | 1998-09-10 | 2000-08-22 | Advanced Micro Devices, Inc. | MOS transistor with low-k spacer to suppress capacitive coupling between gate and source/drain extensions |
| US6271132B1 (en) * | 1999-05-03 | 2001-08-07 | Advanced Micro Devices, Inc. | Self-aligned source and drain extensions fabricated in a damascene contact and gate process |
| US6124177A (en) * | 1999-08-13 | 2000-09-26 | Taiwan Semiconductor Manufacturing Company | Method for making deep sub-micron mosfet structures having improved electrical characteristics |
| US6137126A (en) * | 1999-08-17 | 2000-10-24 | Advanced Micro Devices, Inc. | Method to reduce gate-to-local interconnect capacitance using a low dielectric constant material for LDD spacer |
-
2001
- 2001-10-04 EP EP01977517A patent/EP1334522A1/en not_active Withdrawn
- 2001-10-04 JP JP2002543706A patent/JP2004514294A/en not_active Withdrawn
- 2001-10-04 CN CNB018189377A patent/CN1275331C/en not_active Expired - Fee Related
- 2001-10-04 WO PCT/US2001/031199 patent/WO2002041405A1/en not_active Ceased
- 2001-10-04 AU AU2001296630A patent/AU2001296630A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1475034A (en) | 2004-02-11 |
| WO2002041405A1 (en) | 2002-05-23 |
| CN1275331C (en) | 2006-09-13 |
| EP1334522A1 (en) | 2003-08-13 |
| JP2004514294A (en) | 2004-05-13 |
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