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AU2001294664A1 - Optical inspection system having integrated component learning - Google Patents

Optical inspection system having integrated component learning

Info

Publication number
AU2001294664A1
AU2001294664A1 AU2001294664A AU9466401A AU2001294664A1 AU 2001294664 A1 AU2001294664 A1 AU 2001294664A1 AU 2001294664 A AU2001294664 A AU 2001294664A AU 9466401 A AU9466401 A AU 9466401A AU 2001294664 A1 AU2001294664 A1 AU 2001294664A1
Authority
AU
Australia
Prior art keywords
inspection system
optical inspection
integrated component
component learning
learning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001294664A
Inventor
Eric L. Aldrich
John Burnett Jr.
Richard Pye
Douglas W. Raymond
Lyle Sherwood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of AU2001294664A1 publication Critical patent/AU2001294664A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
AU2001294664A 2000-10-02 2001-09-24 Optical inspection system having integrated component learning Abandoned AU2001294664A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/677,290 2000-10-02
US09677290 2000-10-02
US09/677,290 US6621566B1 (en) 2000-10-02 2000-10-02 Optical inspection system having integrated component learning
PCT/US2001/029824 WO2002029383A2 (en) 2000-10-02 2001-09-24 Optical inspection system having integrated component learning

Publications (1)

Publication Number Publication Date
AU2001294664A1 true AU2001294664A1 (en) 2002-04-15

Family

ID=24718096

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001294664A Abandoned AU2001294664A1 (en) 2000-10-02 2001-09-24 Optical inspection system having integrated component learning

Country Status (6)

Country Link
US (1) US6621566B1 (en)
JP (1) JP2004510975A (en)
CN (1) CN100395540C (en)
AU (1) AU2001294664A1 (en)
IL (1) IL155151A0 (en)
WO (1) WO2002029383A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003058601A (en) * 2001-08-14 2003-02-28 Matsushita Electric Ind Co Ltd Method and system for delivering teaching data for image processing apparatus
US7151850B2 (en) * 2001-10-30 2006-12-19 Matsushita Electric Industrial Co., Ltd. Apparatus and method for setting teaching data, teaching data providing system over network
US6781687B2 (en) * 2002-09-26 2004-08-24 Orbotech Ltd. Illumination and image acquisition system
US20060086773A1 (en) * 2004-10-27 2006-04-27 Sanftleben Henry M Technique for optical inspection system verification
JP4654022B2 (en) * 2004-12-24 2011-03-16 株式会社サキコーポレーション Substrate visual inspection device
US7355689B2 (en) * 2005-01-31 2008-04-08 Applied Materials, Inc. Automatic optical inspection using multiple objectives
US20110175997A1 (en) * 2008-01-23 2011-07-21 Cyberoptics Corporation High speed optical inspection system with multiple illumination imagery
CN101398462B (en) * 2008-07-04 2012-07-25 深圳市达鑫自动化有限公司 Plaster bonding wire automatic detection system
CN102047096A (en) 2008-07-10 2011-05-04 诺信公司 Automated fillet inspection systems with closed loop feedback and methods of use
WO2011043734A1 (en) * 2009-10-07 2011-04-14 Manufacturing Integration Technology Ltd Laser scribing of thin-film solar cell panel
JP5522065B2 (en) * 2011-01-18 2014-06-18 オムロン株式会社 Board inspection system
CN103475812B (en) * 2013-07-30 2016-05-25 宁波迪吉特电子科技发展有限公司 A kind of video camera array
US11132787B2 (en) * 2018-07-09 2021-09-28 Instrumental, Inc. Method for monitoring manufacture of assembly units
CN106570858B (en) * 2016-10-17 2019-05-07 浙江理工大学 Automatic generation of AOI component detection frame method based on PCB coordinate transformation
JP6450815B1 (en) * 2017-08-24 2019-01-09 Ckd株式会社 Appearance inspection device and blister packaging machine
US11314220B2 (en) * 2018-04-26 2022-04-26 Liberty Reach Inc. Non-contact method and system for controlling an industrial automation machine
US11442098B2 (en) 2019-06-20 2022-09-13 Teradyne, Inc. Generating a waveform based on digital pulses
EP3996482B1 (en) * 2019-07-04 2024-08-07 Fuji Corporation Component mounting system
CN113378665B (en) * 2019-11-27 2024-11-15 奥特斯科技(重庆)有限公司 Method for processing a component carrier, optical inspection device and computer-readable medium
CN112551126A (en) * 2020-10-30 2021-03-26 佛山市坦斯盯科技有限公司 Push plate device of AOI equipment
US12254383B2 (en) * 2021-03-30 2025-03-18 Accenture Global Solutions Limited Intelligent real-time defect prediction, detection, and AI driven automated correction solution

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62247478A (en) * 1986-04-21 1987-10-28 Hitachi Ltd Pattern inspection instrument
JPH0770879B2 (en) * 1986-10-17 1995-07-31 三菱電機株式会社 Electronic component inspection device
EP0687901B1 (en) 1988-05-09 2003-08-13 Omron Corporation Apparatus for and method of displaying results of printed circuit board inspection
JPH0325304A (en) * 1989-06-23 1991-02-04 Nippon Steel Corp Pattern aligning method
US5204912A (en) * 1990-02-26 1993-04-20 Gerber Systems Corporation Defect verification and marking system for use with printed circuit boards
GB9004246D0 (en) 1990-02-26 1990-04-18 Automation Tooling Syst Vision system for inspection of electronic components
CN1055997A (en) * 1990-04-25 1991-11-06 哈尔滨工业大学 Printed circuit board solder joint laser hologram detection method and device
EP0985991A3 (en) 1991-11-07 2000-05-31 Omron Corporation Apparatus and method for automatically correcting soldering
US5564183A (en) 1992-09-30 1996-10-15 Matsushita Electric Industrial Co., Ltd. Producing system of printed circuit board and method therefor
JP3264020B2 (en) * 1993-02-10 2002-03-11 オムロン株式会社 Inspection data creation method and mounted component inspection device
JPH06265324A (en) * 1993-03-16 1994-09-20 Citizen Watch Co Ltd Electronic component mounting apparatus and inspecting method for electronic component mounting state
TW401008U (en) 1993-04-21 2000-08-01 Omron Tateisi Electronics Co Visual inspection support device and substrate inspection device
US5555325A (en) * 1993-10-22 1996-09-10 Lockheed Martin Federal Systems, Inc. Data capture variable priority method and system for managing varying processing capacities
JP3472443B2 (en) * 1997-06-23 2003-12-02 沖電気工業株式会社 Mounted parts inspection equipment
JP3447572B2 (en) * 1998-07-31 2003-09-16 株式会社山武 Inspection method for component connection

Also Published As

Publication number Publication date
CN1571923A (en) 2005-01-26
JP2004510975A (en) 2004-04-08
WO2002029383A3 (en) 2002-07-11
US6621566B1 (en) 2003-09-16
IL155151A0 (en) 2003-10-31
CN100395540C (en) 2008-06-18
WO2002029383A2 (en) 2002-04-11

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