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AU2001293159A1 - Direct heatpipe attachment to die using center point loading - Google Patents

Direct heatpipe attachment to die using center point loading

Info

Publication number
AU2001293159A1
AU2001293159A1 AU2001293159A AU9315901A AU2001293159A1 AU 2001293159 A1 AU2001293159 A1 AU 2001293159A1 AU 2001293159 A AU2001293159 A AU 2001293159A AU 9315901 A AU9315901 A AU 9315901A AU 2001293159 A1 AU2001293159 A1 AU 2001293159A1
Authority
AU
Australia
Prior art keywords
heatpipe
die
attachment
direct
center point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001293159A
Inventor
Eric Distefano
Kristopher Frutschy
Ravi Prasher
Ajit Sathe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2001293159A1 publication Critical patent/AU2001293159A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Resistance Heating (AREA)
  • Wire Bonding (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

An apparatus that includes a number of stacked computer components such as a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.
AU2001293159A 2000-09-29 2001-09-27 Direct heatpipe attachment to die using center point loading Abandoned AU2001293159A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/675,314 US6469893B1 (en) 2000-09-29 2000-09-29 Direct heatpipe attachment to die using center point loading
US09/675,314 2000-09-29
PCT/US2001/030367 WO2002027785A2 (en) 2000-09-29 2001-09-27 Direct heatpipe attachment to die using center point loading

Publications (1)

Publication Number Publication Date
AU2001293159A1 true AU2001293159A1 (en) 2002-04-08

Family

ID=24709934

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001293159A Abandoned AU2001293159A1 (en) 2000-09-29 2001-09-27 Direct heatpipe attachment to die using center point loading

Country Status (8)

Country Link
US (2) US6469893B1 (en)
EP (1) EP1356512B1 (en)
CN (1) CN1531754B (en)
AT (1) ATE352872T1 (en)
AU (1) AU2001293159A1 (en)
DE (1) DE60126341T2 (en)
MY (1) MY122824A (en)
WO (1) WO2002027785A2 (en)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6469893B1 (en) 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
DE10225993A1 (en) * 2002-06-12 2003-12-24 Bosch Gmbh Robert heatsink
JP3634825B2 (en) * 2002-06-28 2005-03-30 株式会社東芝 Electronics
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US6988535B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Channeled flat plate fin heat exchange system, device and method
EP1333492B1 (en) * 2002-11-08 2006-03-01 Agilent Technologies Inc. a Delaware Corporation Cooling a microchip on a circuit board
US6929057B1 (en) * 2002-12-19 2005-08-16 Beutler Corporation Building heating assembly
US6731505B1 (en) * 2002-12-20 2004-05-04 Tyco Electronics Corporation Integrated circuit mounting system with separate loading forces for socket and heat sink
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US20040233639A1 (en) * 2003-01-31 2004-11-25 Cooligy, Inc. Removeable heat spreader support mechanism and method of manufacturing thereof
WO2004093187A1 (en) * 2003-04-16 2004-10-28 Fujitsu Limited Electronic component package, electronic component package assembly and printed board unit
JP2004348650A (en) * 2003-05-26 2004-12-09 Toshiba Corp Electronics
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
EP1508916B1 (en) * 2003-08-07 2008-03-05 Harman Becker Automotive Systems GmbH Apparatus for cooling semiconductor devices attached to a printed circuit board
US20050083658A1 (en) * 2003-10-21 2005-04-21 Arima Computer Corporation Heat dissipating module of an integrated circuit of a portable computer
JP4387777B2 (en) * 2003-11-28 2009-12-24 株式会社東芝 Electronics
US6976525B2 (en) * 2004-02-24 2005-12-20 Asia Vital Component Co., Ltd. Fastening device for a radiator
US7071552B2 (en) * 2004-03-29 2006-07-04 Intel Corporation IC die with directly bonded liquid cooling device
JP2005315156A (en) * 2004-04-28 2005-11-10 Toshiba Corp Pump and electronic device equipped with pump
JP2005317797A (en) * 2004-04-28 2005-11-10 Toshiba Corp Pumps, electronics and cooling devices
JP2005315158A (en) * 2004-04-28 2005-11-10 Toshiba Corp Pumps, cooling devices, and electronics
JP4234635B2 (en) * 2004-04-28 2009-03-04 株式会社東芝 Electronics
JP2005317796A (en) * 2004-04-28 2005-11-10 Toshiba Corp Pump, cooling device and electronic equipment
US20050264998A1 (en) * 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
JP4343032B2 (en) * 2004-05-31 2009-10-14 株式会社東芝 Cooling structure and projection type image display device
JP2005344562A (en) * 2004-06-01 2005-12-15 Toshiba Corp Electronic device having pump, cooling device and cooling device
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
JP4928749B2 (en) * 2005-06-30 2012-05-09 株式会社東芝 Cooling system
DE102005033249B3 (en) * 2005-07-15 2006-10-05 Fujitsu Siemens Computers Gmbh Cooling arrangement for computer system, has retaining plate provided between base plate and system circuit board in area of processor, and cooling device movably connected with retaining plate by screws and springs
US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
TW200805042A (en) 2006-02-16 2008-01-16 Cooligy Inc Liquid cooling loops for server applications
US7450387B2 (en) * 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
TW200810676A (en) 2006-03-30 2008-02-16 Cooligy Inc Multi device cooling
US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
US20070227698A1 (en) * 2006-03-30 2007-10-04 Conway Bruce R Integrated fluid pump and radiator reservoir
US7388747B2 (en) * 2006-04-07 2008-06-17 Inventec Corporation Heat plate fixing structure
TW200739327A (en) * 2006-04-14 2007-10-16 Compal Electronics Inc Heat dissipating module
US20070256815A1 (en) * 2006-05-04 2007-11-08 Cooligy, Inc. Scalable liquid cooling system with modular radiators
US20080013278A1 (en) * 2006-06-30 2008-01-17 Fredric Landry Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles
CN101102655A (en) * 2006-07-07 2008-01-09 富准精密工业(深圳)有限公司 heat sink
US7782622B1 (en) * 2006-10-04 2010-08-24 Nvidia Corporation Attachment apparatus for electronic boards
CN200994225Y (en) * 2006-12-29 2007-12-19 帛汉股份有限公司 Circuit substrate structure
JP2008251687A (en) * 2007-03-29 2008-10-16 Toshiba Corp Printed circuit board and electronic device equipped with the same
WO2008137143A1 (en) * 2007-05-02 2008-11-13 Cooligy Inc. Micro-tube/multi-port counter flow radiator design for electronic cooling applications
TW200912621A (en) 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
CN101377706B (en) * 2007-08-31 2011-12-21 鸿富锦精密工业（深圳）有限公司 Back board combination of heat radiator for computer
US8520393B2 (en) * 2008-04-01 2013-08-27 Hewlett-Packard Development Company, L.P. Apparatuses and methods for dissipating heat from a computer component
US8302419B2 (en) * 2008-05-02 2012-11-06 Thermal Take Technology Co., Ltd. Computer cooling apparatus
US8159821B2 (en) * 2009-07-28 2012-04-17 Dsem Holdings Sdn. Bhd. Diffusion bonding circuit submount directly to vapor chamber
CN102845143B (en) 2009-08-18 2015-05-20 惠普发展公司，有限责任合伙企业 Device mounting system and method
US8908373B2 (en) * 2009-09-30 2014-12-09 Nec Corporation Cooling structure for an electronic component and electronic instrument
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
DE202010014108U1 (en) * 2010-10-08 2010-12-02 Congatec Ag Heat spreader with mechanically secured heat coupling element
DE202010014106U1 (en) * 2010-10-08 2010-12-16 Congatec Ag Heat spreader with flexibly mounted heat pipe
CN102655730A (en) * 2011-03-04 2012-09-05 鸿富锦精密工业（深圳）有限公司 Heat dissipation device
US20120267078A1 (en) * 2011-04-20 2012-10-25 Chun-Ming Wu Heat dissipation mechanism
CN103702544A (en) * 2012-09-27 2014-04-02 英业达科技有限公司 Electronic device and heat conduction member thereof
US9379037B2 (en) * 2014-03-14 2016-06-28 Apple Inc. Thermal module accounting for increased board/die size in a portable computer
US10359818B2 (en) 2015-08-17 2019-07-23 Microsoft Technology Licensing, Llc Device faraday cage
US10772190B2 (en) * 2017-09-29 2020-09-08 Apple Inc. Heat-removal assemblies with opposing springs
TWI745774B (en) * 2019-11-01 2021-11-11 宏碁股份有限公司 Remote heat exchanging module and composite thin-layered heat conduction structure
EP4097760A1 (en) * 2020-03-04 2022-12-07 Transport Phenomena Technologies, LLC Compliant thermal management devices, systems, and methods of fabrication thereof
WO2025160390A1 (en) * 2024-01-26 2025-07-31 MTS IP Holdings Ltd Method to transfer heat from small form factor pluggable connector to remote heat sink

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4966226A (en) * 1989-12-29 1990-10-30 Digital Equipment Corporation Composite graphite heat pipe apparatus and method
US5162974A (en) 1991-04-15 1992-11-10 Unisys Corporation Heat sink assembly for cooling electronic components
US5224918A (en) 1991-06-27 1993-07-06 Cray Research, Inc. Method of manufacturing metal connector blocks
FR2679729B1 (en) * 1991-07-23 1994-04-29 Alcatel Telspace HEATSINK.
US5424918A (en) * 1994-03-31 1995-06-13 Hewlett-Packard Company Universal hybrid mounting system
US5549155A (en) * 1995-04-18 1996-08-27 Thermacore, Inc. Integrated circuit cooling apparatus
US6021044A (en) * 1998-08-13 2000-02-01 Data General Corporation Heatsink assembly
US6031716A (en) 1998-09-08 2000-02-29 International Business Machines Corporation Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity
DE69921695T2 (en) 1998-12-15 2005-08-11 Parker-Hannifin Corp., Cleveland METHOD FOR ATTACHING A THERMAL PHASE-RECHARGEABLE COMPOUND MATERIAL
US6347036B1 (en) * 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US6469893B1 (en) 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
US6381135B1 (en) * 2001-03-20 2002-04-30 Intel Corporation Loop heat pipe for mobile computers

Also Published As

Publication number Publication date
EP1356512B1 (en) 2007-01-24
CN1531754B (en) 2010-05-26
US6469893B1 (en) 2002-10-22
DE60126341D1 (en) 2007-03-15
EP1356512A2 (en) 2003-10-29
WO2002027785A3 (en) 2003-08-14
US6625022B2 (en) 2003-09-23
CN1531754A (en) 2004-09-22
WO2002027785A2 (en) 2002-04-04
MY122824A (en) 2006-05-31
DE60126341T2 (en) 2007-11-15
HK1058104A1 (en) 2004-04-30
ATE352872T1 (en) 2007-02-15
US20020051341A1 (en) 2002-05-02

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