AU2001292823A1 - Electrostatic deposition of high temperature, high performance thermoplastics - Google Patents
Electrostatic deposition of high temperature, high performance thermoplasticsInfo
- Publication number
- AU2001292823A1 AU2001292823A1 AU2001292823A AU9282301A AU2001292823A1 AU 2001292823 A1 AU2001292823 A1 AU 2001292823A1 AU 2001292823 A AU2001292823 A AU 2001292823A AU 9282301 A AU9282301 A AU 9282301A AU 2001292823 A1 AU2001292823 A1 AU 2001292823A1
- Authority
- AU
- Australia
- Prior art keywords
- electrostatic deposition
- high temperature
- performance thermoplastics
- high performance
- thermoplastics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004924 electrostatic deposition Methods 0.000 title 1
- 229920006258 high performance thermoplastic Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
- C09K19/3804—Polymers with mesogenic groups in the main chain
- C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23407100P | 2000-09-20 | 2000-09-20 | |
| US60234071 | 2000-09-20 | ||
| PCT/US2001/029345 WO2002024791A2 (en) | 2000-09-20 | 2001-09-20 | Electrostatic deposition of high temperature, high performance thermoplastics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001292823A1 true AU2001292823A1 (en) | 2002-04-02 |
Family
ID=22879771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001292823A Abandoned AU2001292823A1 (en) | 2000-09-20 | 2001-09-20 | Electrostatic deposition of high temperature, high performance thermoplastics |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6761834B2 (en) |
| AU (1) | AU2001292823A1 (en) |
| WO (1) | WO2002024791A2 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040040651A1 (en) * | 2002-08-28 | 2004-03-04 | Kuraray Co., Ltd. | Multi-layer circuit board and method of making the same |
| JP3968068B2 (en) * | 2003-09-30 | 2007-08-29 | 株式会社クラレ | Method for producing liquid crystal polymer film |
| DE10352752B3 (en) * | 2003-11-12 | 2004-11-11 | Ticona Gmbh | Continuous production of liquid crystal polymer film, as conductor paths or a barrier film, involves supplying powder to a heated calender roller and passing the melted mass between polishing and structured rollers |
| JP2006137011A (en) * | 2004-11-10 | 2006-06-01 | Kuraray Co Ltd | Metal-clad laminate and manufacturing method thereof |
| TW200714666A (en) * | 2005-07-29 | 2007-04-16 | Sumitomo Chemical Co | Laminate of liquid crystalline polyester with copper foil |
| US9145469B2 (en) | 2012-09-27 | 2015-09-29 | Ticona Llc | Aromatic polyester containing a biphenyl chain disruptor |
| DE102012223157A1 (en) * | 2012-12-14 | 2014-07-03 | Hilti Aktiengesellschaft | Pull-out tester for a setting tool |
| TWI574836B (en) * | 2014-10-29 | 2017-03-21 | 財團法人工業技術研究院 | Gas barrier composite film |
| JP6729718B2 (en) * | 2016-12-05 | 2020-07-22 | 株式会社村田製作所 | Black liquid crystal polymer film and multilayer substrate |
| US11879041B2 (en) | 2019-02-15 | 2024-01-23 | Sumitomo Chemical Company, Limited | Film and laminate |
| WO2020255871A1 (en) * | 2019-06-17 | 2020-12-24 | 株式会社クラレ | Method for producing metal clad laminate |
| CN110408249B (en) * | 2019-07-22 | 2021-06-08 | 佛山宜可居新材料有限公司 | Preparation method of polymer composite film |
Family Cites Families (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4394498A (en) * | 1981-08-24 | 1983-07-19 | Celanese Corporation | Method for providing particulates of liquid crystal polymers and particulates produced therefrom |
| GB8400562D0 (en) * | 1984-01-10 | 1984-02-15 | Pharmindey Ltd | Electrostatic coating materials |
| US4863767A (en) | 1984-04-13 | 1989-09-05 | Hoechst Celanese Corporation | Method of adhesive bonding by use of thermotropic liquid crystal polymers |
| JPS61130046A (en) | 1984-11-28 | 1986-06-17 | ポリプラスチックス株式会社 | Manufacturing method of laminate film |
| US4973442A (en) | 1985-09-26 | 1990-11-27 | Foster Miller Inc. | Forming biaxially oriented ordered polymer films |
| JPH0629367B2 (en) | 1985-12-02 | 1994-04-20 | ポリプラスチックス株式会社 | Conductive resin composition |
| US4966806A (en) | 1986-12-16 | 1990-10-30 | Foster Miller, Inc. | Film-based structural components with controlled coefficient of thermal expansion |
| US4871595A (en) | 1986-12-16 | 1989-10-03 | Foster Miller, Inc. | Lyotropic liquid crystalline oriented polymer substrate for printed wire board |
| US4876120A (en) | 1987-04-21 | 1989-10-24 | General Electric Company | Tailorable multi-layer printed wiring boards of controlled coefficient of thermal expansion |
| DE3737922A1 (en) | 1987-11-07 | 1989-05-18 | Basf Ag | COMPOSITE MATERIAL FROM HIGH-TEMPERATURE-RESISTANT POLYMERS AND DIRECTLY APPLIED METAL LAYERS |
| DE3810598A1 (en) | 1988-03-29 | 1989-10-12 | Bayer Ag | COMPOSITIONS CONTAINING METAL FIBERS AND THE USE THEREOF FOR PRODUCING MOLDED PARTS FOR SHIELDING ELECTROMAGNETIC RADIATION |
| US4966807A (en) | 1988-06-13 | 1990-10-30 | Foster Miller, Inc. | Multiaxially oriented thermotropic polymer films and method of preparation |
| US4975312A (en) | 1988-06-20 | 1990-12-04 | Foster-Miller, Inc. | Multiaxially oriented thermotropic polymer substrate for printed wire board |
| US5164458A (en) | 1989-04-28 | 1992-11-17 | Synthetic Products Company | High performance engineering polymer compositions |
| US5288529A (en) | 1989-06-16 | 1994-02-22 | Foster-Miller Inc. | Liquid crystal polymer film |
| US5176775A (en) | 1989-10-20 | 1993-01-05 | Montsinger Lawrence V | Apparatus and method for forming fiber filled thermoplastic composite materials |
| DE69124193T2 (en) | 1990-11-07 | 1997-06-05 | Hoechst Celanese Corp | Reworking a liquid crystalline film by rolling |
| JP3245437B2 (en) | 1991-04-05 | 2002-01-15 | 株式会社クラレ | Manufacturing method of laminate |
| JP3090706B2 (en) | 1991-04-08 | 2000-09-25 | 株式会社クラレ | Method for producing film composed of liquid crystal polymer |
| JPH04367763A (en) | 1991-06-14 | 1992-12-21 | Mitsubishi Plastics Ind Ltd | Manufacturing method of synthetic resin coated metal plate |
| US5259110A (en) | 1992-04-03 | 1993-11-09 | International Business Machines Corporation | Method for forming a multilayer microelectronic wiring module |
| JPH0697614A (en) | 1992-09-10 | 1994-04-08 | Mitsubishi Shindoh Co Ltd | Multilayer board |
| US5681624A (en) | 1993-02-25 | 1997-10-28 | Japan Gore-Tex, Inc. | Liquid crystal polymer film and a method for manufacturing the same |
| US6027771A (en) * | 1993-02-25 | 2000-02-22 | Moriya; Akira | Liquid crystal polymer film and a method for manufacturing the same |
| US5863405A (en) | 1994-05-18 | 1999-01-26 | Polyplastics Co., Ltd. | Process for forming conductive circuit on the surface of molded article |
| JP2590435B2 (en) | 1994-06-06 | 1997-03-12 | 工業技術院長 | Method for producing liquid crystalline polymer microspheres |
| JP2939477B2 (en) | 1994-08-16 | 1999-08-25 | エイチエヌエイ・ホールディングス・インコーポレーテッド | Liquid crystal polymer-metal laminate and method for producing the laminate |
| DE4430474C1 (en) | 1994-08-27 | 1996-03-28 | Glyco Metall Werke | Plain bearing material and its use for the production of a composite layer material |
| US5719354A (en) | 1994-09-16 | 1998-02-17 | Hoechst Celanese Corp. | Monolithic LCP polymer microelectronic wiring modules |
| US5529740A (en) | 1994-09-16 | 1996-06-25 | Jester; Randy D. | Process for treating liquid crystal polymer film |
| US5585426A (en) * | 1994-10-05 | 1996-12-17 | Nexus Corporation | Process for imparting an electrostatic charge to powders to render them useful for coating application |
| DE69637180T2 (en) | 1995-06-09 | 2008-04-10 | Pbi Performance Products, Inc. | HIGH-FILLED FORMABLE POLYARYLETHERKETONE |
| WO1997019127A1 (en) | 1995-11-22 | 1997-05-29 | Hoechst Celanese Corporation | Liquid crystal polymer films |
| DE19604158A1 (en) | 1996-02-06 | 1997-08-07 | Hilti Ag | Device for testing holding force of fastening anchors etc. |
| EP0790279B2 (en) | 1996-02-19 | 2007-07-18 | Sumitomo Chemical Company, Limited | Liquid crystal polyester resin composition |
| DE19612974A1 (en) | 1996-04-01 | 1997-10-02 | Hoechst Ag | Powder coatings with a color impression depending on the viewing angle |
| DE19620746A1 (en) * | 1996-05-23 | 1997-11-27 | Hoechst Ag | Chiral cLCPs containing colored monomers |
| US5863666A (en) | 1997-08-07 | 1999-01-26 | Gould Electronics Inc. | High performance flexible laminate |
| JP2000044797A (en) | 1998-04-06 | 2000-02-15 | Kuraray Co Ltd | Liquid crystal polymer films and laminates, their manufacturing methods, and multilayer mounting circuit boards |
| CN1116164C (en) | 1998-04-09 | 2003-07-30 | 可乐丽股份有限公司 | Coating method using polymer film and coated body obtained therefrom |
| DE19816268A1 (en) * | 1998-04-11 | 1999-10-14 | Clariant Gmbh | Cholesteric liquid crystal polymers with increased weather stability |
| DE19825924A1 (en) | 1998-06-08 | 1999-12-09 | Clariant Gmbh | Process for the production of effect paints |
| CA2273542A1 (en) | 1998-06-23 | 1999-12-23 | Nelco International Corporation | Thin film laminates |
| JP2000070630A (en) | 1998-08-28 | 2000-03-07 | Nittetsu Mining Co Ltd | Heat resistant filter element |
| JP4216433B2 (en) | 1999-03-29 | 2009-01-28 | 株式会社クラレ | Method for producing metal-clad laminate for circuit board |
| JP3860679B2 (en) | 1999-03-30 | 2006-12-20 | 株式会社クラレ | Method for modifying thermoplastic liquid crystal polymer film |
| JP2001244630A (en) | 2000-02-25 | 2001-09-07 | Kuraray Co Ltd | Multilayer wiring circuit board and method of manufacturing the same |
| US6923919B2 (en) | 2000-07-18 | 2005-08-02 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
| US6403211B1 (en) | 2000-07-18 | 2002-06-11 | 3M Innovative Properties Company | Liquid crystal polymer for flexible circuits |
| EP1194020A3 (en) | 2000-09-27 | 2004-03-31 | Matsushita Electric Industrial Co., Ltd. | Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
-
2001
- 2001-09-20 WO PCT/US2001/029345 patent/WO2002024791A2/en not_active Ceased
- 2001-09-20 US US09/957,648 patent/US6761834B2/en not_active Expired - Fee Related
- 2001-09-20 AU AU2001292823A patent/AU2001292823A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002024791A3 (en) | 2002-06-13 |
| US20020104982A1 (en) | 2002-08-08 |
| WO2002024791A2 (en) | 2002-03-28 |
| US6761834B2 (en) | 2004-07-13 |
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