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AU2001292110A1 - Method to detect surface metal contamination - Google Patents

Method to detect surface metal contamination

Info

Publication number
AU2001292110A1
AU2001292110A1 AU2001292110A AU9211001A AU2001292110A1 AU 2001292110 A1 AU2001292110 A1 AU 2001292110A1 AU 2001292110 A AU2001292110 A AU 2001292110A AU 9211001 A AU9211001 A AU 9211001A AU 2001292110 A1 AU2001292110 A1 AU 2001292110A1
Authority
AU
Australia
Prior art keywords
surface metal
metal contamination
detect surface
detect
contamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001292110A
Inventor
Victor Higgs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aoti Operating Co Inc
Original Assignee
Aoti Operating Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0024537A external-priority patent/GB0024537D0/en
Priority claimed from GB0028222A external-priority patent/GB0028222D0/en
Application filed by Aoti Operating Co Inc filed Critical Aoti Operating Co Inc
Publication of AU2001292110A1 publication Critical patent/AU2001292110A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/6489—Photoluminescence of semiconductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
AU2001292110A 2000-10-06 2001-10-05 Method to detect surface metal contamination Abandoned AU2001292110A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GB0024537A GB0024537D0 (en) 2000-10-06 2000-10-06 Detection method
GB0024537 2000-10-06
GB0028222 2000-11-18
GB0028222A GB0028222D0 (en) 2000-11-18 2000-11-18 Detection method
PCT/GB2001/004454 WO2002029883A1 (en) 2000-10-06 2001-10-05 Method to detect surface metal contamination

Publications (1)

Publication Number Publication Date
AU2001292110A1 true AU2001292110A1 (en) 2002-04-15

Family

ID=26245117

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001292110A Abandoned AU2001292110A1 (en) 2000-10-06 2001-10-05 Method to detect surface metal contamination

Country Status (8)

Country Link
US (1) US6911347B2 (en)
EP (1) EP1323188A1 (en)
JP (1) JP2004511104A (en)
KR (1) KR100612399B1 (en)
CN (1) CN1233030C (en)
AU (1) AU2001292110A1 (en)
IL (2) IL155021A0 (en)
WO (1) WO2002029883A1 (en)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9618897D0 (en) 1996-09-10 1996-10-23 Bio Rad Micromeasurements Ltd Micro defects in silicon wafers
JP2003045928A (en) * 2001-07-31 2003-02-14 Shin Etsu Handotai Co Ltd METHOD FOR EVALUATING Cu CONTAMINATION IN SEMICONDUCTOR SILICON WAFER
US7619735B2 (en) * 2002-01-15 2009-11-17 Applied Materials, Israel, Ltd. Optical inspection using variable apodization
JP3729154B2 (en) * 2002-05-10 2005-12-21 株式会社日立製作所 Pattern defect inspection method and apparatus
GB0216620D0 (en) * 2002-07-17 2002-08-28 Aoti Operating Co Inc Detection method and apparatus
GB0308182D0 (en) * 2003-04-09 2003-05-14 Aoti Operating Co Inc Detection method and apparatus
JP4479657B2 (en) * 2003-10-27 2010-06-09 住友電気工業株式会社 Method for manufacturing gallium nitride based semiconductor substrate
CN100499056C (en) * 2004-06-09 2009-06-10 株式会社瑞萨科技 Process for fabricating semiconductor integrated circuit device
US7362448B1 (en) 2004-09-08 2008-04-22 Nanometrics Incorporated Characterizing residue on a sample
US7400390B2 (en) * 2004-11-29 2008-07-15 Applied Materials, Israel, Ltd. Inspection system and a method for aerial reticle inspection
US20070000434A1 (en) * 2005-06-30 2007-01-04 Accent Optical Technologies, Inc. Apparatuses and methods for detecting defects in semiconductor workpieces
TWI391645B (en) 2005-07-06 2013-04-01 Nanometrics Inc Differential wavelength photoluminescence for non-contact measuring of contaminants and defects located below the surface of a wafer or other workpiece
TWI439684B (en) 2005-07-06 2014-06-01 Nanometrics Inc Photoluminescence imaging with preferential detection of photoluminescence signals emitted from a specified material layer of a wafer or other workpiece
US20070008526A1 (en) * 2005-07-08 2007-01-11 Andrzej Buczkowski Apparatus and method for non-contact assessment of a constituent in semiconductor workpieces
TR201802704T4 (en) * 2005-10-11 2018-03-21 Bt Imaging Pty Ltd Method and system for monitoring the indirect band gap semiconductor structure.
JP5219334B2 (en) * 2005-11-30 2013-06-26 株式会社Ｓｕｍｃｏ Semiconductor substrate manufacturing method and quality evaluation method
US20070176119A1 (en) * 2006-01-30 2007-08-02 Accent Optical Technologies, Inc. Apparatuses and methods for analyzing semiconductor workpieces
US7517706B2 (en) * 2006-07-21 2009-04-14 Sumco Corporation Method for evaluating quality of semiconductor substrate and method for manufacturing semiconductor substrate
JP2011516374A (en) * 2008-03-31 2011-05-26 ビーティー イメージング ピーティーワイ リミテッド Wafer imaging and processing method and apparatus
DE102008044881A1 (en) * 2008-08-29 2010-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Measuring method for a semiconductor structure
US9122178B2 (en) 2009-08-04 2015-09-01 Asml Netherlands B.V. Object inspection systems and methods
US8330946B2 (en) * 2009-12-15 2012-12-11 Nanometrics Incorporated Silicon filter for photoluminescence metrology
DE102010011066B4 (en) * 2010-03-11 2020-10-22 Pi4_Robotics Gmbh Photovoltaic module or photovoltaic cell or semiconductor component identification method and photovoltaic module or photovoltaic cell or semiconductor component identification device
US8629411B2 (en) 2010-07-13 2014-01-14 First Solar, Inc. Photoluminescence spectroscopy
JP5722445B2 (en) 2010-08-16 2015-05-20 エーエスエムエル ネザーランズ ビー．ブイ． Inspection method for imprint lithography and apparatus therefor
US20130158383A1 (en) * 2010-08-20 2013-06-20 Purdue Research Foundation Bond-selective vibrational photoacoustic imaging system and method
US20120115398A1 (en) * 2010-11-09 2012-05-10 James Bopp Chemical-mechanical polishing wafer and method of use
CN103765567A (en) * 2011-06-24 2014-04-30 科磊股份有限公司 Method and apparatus for inspecting light emitting semiconductor devices using photoluminescence imaging
CN103165407B (en) * 2011-12-14 2016-04-06 有研半导体材料有限公司 A kind of for the surface treatment of silicon slice surface sample preparation and the technique of corrosion and device
US10036877B2 (en) 2013-02-05 2018-07-31 Vanderbilt University Microlens array for enhanced imaging of multiregion targets
CN103558221B (en) * 2013-11-04 2016-01-06 武汉理工大学 A kind of uniformity detection of infrared optical material and method
TWI544213B (en) * 2014-03-04 2016-08-01 All Ring Tech Co Ltd Object detection method and device
CN104078378A (en) * 2014-07-02 2014-10-01 武汉新芯集成电路制造有限公司 Method for detecting metal contamination
JP6476617B2 (en) * 2014-07-04 2019-03-06 株式会社Sumco Method for evaluating organic contamination on semiconductor substrate surface and use thereof
JP6696729B2 (en) 2015-03-18 2020-05-20 株式会社Sumco Semiconductor substrate evaluation method and semiconductor substrate manufacturing method
JP6704275B2 (en) * 2016-03-28 2020-06-03 株式会社ディスコ Device wafer evaluation method
US10551320B2 (en) * 2017-01-30 2020-02-04 Kla-Tencor Corporation Activation of wafer particle defects for spectroscopic composition analysis
CN107091822B (en) * 2017-03-14 2019-09-10 华东师范大学 The device and its detection method of double light source activation luminescence generated by light detection semiconductor defects
CN110044913A (en) * 2019-03-27 2019-07-23 易安基自动化设备(北京)有限公司 A kind of method and device of the surface cleanness of detection object
CN109916917B (en) * 2019-04-17 2021-07-13 湖北三环锻造有限公司 Penetrant flaw detection process
CN110544643B (en) * 2019-09-11 2022-06-28 东方日升（常州）新能源有限公司 Method for nondestructive and rapid judgment of burn-through depth of metal slurry
JP7336977B2 (en) * 2019-12-11 2023-09-01 株式会社ディスコ Laser beam spot shape correction method
DE102020210999A1 (en) 2020-09-01 2022-03-03 Forschungszentrum Jülich GmbH Method and system for evaluating solar cells
CN115910754A (en) * 2022-12-30 2023-04-04 西安奕斯伟材料科技有限公司 A cleaning method and device for edge of silicon wafer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06109718A (en) 1992-09-28 1994-04-22 Hitachi Ltd Method for analyzing metallic elements in semiconductor crystals
JPH07297246A (en) * 1994-04-27 1995-11-10 Hitachi Ltd Method for monitoring metal contamination of silicon semiconductor
GB9618897D0 (en) * 1996-09-10 1996-10-23 Bio Rad Micromeasurements Ltd Micro defects in silicon wafers
US5943552A (en) * 1997-02-06 1999-08-24 Seh America, Inc. Schottky metal detection method
JPH11330043A (en) 1998-05-18 1999-11-30 Shin Etsu Handotai Co Ltd Evaluation of silicon wafer
US6159859A (en) * 1998-06-09 2000-12-12 Air Products And Chemicals, Inc. Gas phase removal of SiO2 /metals from silicon
US6791099B2 (en) * 2001-02-14 2004-09-14 Applied Materials, Inc. Laser scanning wafer inspection using nonlinear optical phenomena
JP2003045928A (en) * 2001-07-31 2003-02-14 Shin Etsu Handotai Co Ltd METHOD FOR EVALUATING Cu CONTAMINATION IN SEMICONDUCTOR SILICON WAFER

Also Published As

Publication number Publication date
US6911347B2 (en) 2005-06-28
EP1323188A1 (en) 2003-07-02
JP2004511104A (en) 2004-04-08
CN1479944A (en) 2004-03-03
KR100612399B1 (en) 2006-08-16
US20040106217A1 (en) 2004-06-03
WO2002029883A1 (en) 2002-04-11
KR20030051684A (en) 2003-06-25
IL155021A0 (en) 2003-10-31
CN1233030C (en) 2005-12-21
IL155021A (en) 2006-12-10

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