[go: up one dir, main page]

AU2001281178A1 - Controlled and programmed deposition of flux on a flip-chip die by spraying - Google Patents

Controlled and programmed deposition of flux on a flip-chip die by spraying

Info

Publication number
AU2001281178A1
AU2001281178A1 AU2001281178A AU8117801A AU2001281178A1 AU 2001281178 A1 AU2001281178 A1 AU 2001281178A1 AU 2001281178 A AU2001281178 A AU 2001281178A AU 8117801 A AU8117801 A AU 8117801A AU 2001281178 A1 AU2001281178 A1 AU 2001281178A1
Authority
AU
Australia
Prior art keywords
flip
flux
spraying
controlled
chip die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001281178A
Other languages
English (en)
Inventor
Maria G. Guardado
Mohammad Z. Khan
Raj N. Master
Ooi Tong Ong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001281178A1 publication Critical patent/AU2001281178A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU2001281178A 2000-08-24 2001-08-07 Controlled and programmed deposition of flux on a flip-chip die by spraying Abandoned AU2001281178A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
USNOTGIVEN 2000-05-23
US22728500P 2000-08-24 2000-08-24
US60227285 2000-08-24
US09/922,936 US6722553B2 (en) 2000-08-24 2001-08-07 Controlled and programmed deposition of flux on a flip-chip die by spraying
PCT/US2001/024843 WO2002016068A2 (fr) 2000-08-24 2001-08-07 Depot de flux programme et commande sur une plaquette de puce a protuberances

Publications (1)

Publication Number Publication Date
AU2001281178A1 true AU2001281178A1 (en) 2002-03-04

Family

ID=22852513

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001281178A Abandoned AU2001281178A1 (en) 2000-08-24 2001-08-07 Controlled and programmed deposition of flux on a flip-chip die by spraying

Country Status (4)

Country Link
US (1) US6722553B2 (fr)
AU (1) AU2001281178A1 (fr)
TW (1) TWI239090B (fr)
WO (1) WO2002016068A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040000704A1 (en) * 2002-07-01 2004-01-01 George Tsao Process for grid array assembly and electronic device made thereby
KR20070062927A (ko) * 2005-12-13 2007-06-18 신에쓰 가가꾸 고교 가부시끼가이샤 플립칩형 반도체 장치의 조립 방법 및 이 방법을 이용하여제조된 반도체 장치
EP1884305A1 (fr) 2006-08-04 2008-02-06 Harman Becker Automotive Systems GmbH Appareil pour appliquer un flux de soudage avec un aérographe ; Procédé d'application de flux de soudage sur la surface d'un objet utilisant un aérographe
US8215536B2 (en) * 2006-12-20 2012-07-10 Intel Corporation Rotational-flow spray nozzle and process of using same
US9426898B2 (en) * 2014-06-30 2016-08-23 Kulicke And Soffa Industries, Inc. Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
TWI567840B (zh) * 2015-04-30 2017-01-21 Fabrication process and its welding method
CN106571412B (zh) * 2015-10-12 2018-05-01 Lg电子株式会社 用于附接太阳能电池板的互连器的设备和方法
WO2019203048A1 (fr) * 2018-04-16 2019-10-24 住友ベークライト株式会社 Procédé de fabrication de dispositif électronique

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3741150A (en) * 1971-06-09 1973-06-26 Kahle Eng Co Automatic flux spray dispenser
JPH0428693Y2 (fr) * 1986-05-22 1992-07-13
US4848641A (en) * 1988-07-05 1989-07-18 Hughes Aircraft Company Flux dispenser
US5065692A (en) * 1990-04-30 1991-11-19 At&T Bell Laboratories Solder flux applicator
US5074455A (en) * 1990-10-09 1991-12-24 Motorola, Inc. Solder flux dispenser suitable for use in automated manufacturing
JPH04361871A (ja) * 1991-06-06 1992-12-15 Pioneer Electron Corp クリームハンダ塗布用ディスペンサー
FR2683114A1 (fr) 1991-10-28 1993-04-30 Brizais Jacqueline Installation pour le traitement de cartes de circuit imprime par un flux.
US5226962A (en) * 1991-11-08 1993-07-13 Electrovert U.S.A. Corp. Flux applicator system
DE69317277T2 (de) * 1992-03-31 1998-06-25 Union Carbide Chem Plastic Verfahren und vorrichtung zur verringerung eingeschlossener luft im spritzlackierverfahren
US5328085A (en) * 1992-08-18 1994-07-12 Precision Dispensing Equipment, Inc. Apparatus for applying flux
WO1994004305A1 (fr) * 1992-08-18 1994-03-03 Precision Dispensing Equipment, Inc. Procede et dispositif d'application de fondant
GB2275638B (en) 1993-03-05 1996-05-15 Invicta Contract Eng Ltd Improvements in sprayers
US5560537A (en) * 1995-04-11 1996-10-01 Vlt Corporation Automatic soldering
US5747102A (en) * 1995-11-16 1998-05-05 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
US6253957B1 (en) * 1995-11-16 2001-07-03 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
US5938848A (en) * 1996-06-27 1999-08-17 Nordson Corporation Method and control system for applying solder flux to a printed circuit
JPH10125618A (ja) * 1996-10-23 1998-05-15 Fujitsu Ltd 半導体装置の製造方法
US6098867A (en) * 1998-03-17 2000-08-08 Advanced Micro Devices, Inc. Automated brush fluxing system for application of controlled amount of flux to packages
US6399902B1 (en) * 2000-08-01 2002-06-04 Advanced Micro Devices, Inc. Inline flux measurement system

Also Published As

Publication number Publication date
TWI239090B (en) 2005-09-01
US6722553B2 (en) 2004-04-20
WO2002016068A2 (fr) 2002-02-28
WO2002016068A3 (fr) 2002-06-06
US20020031861A1 (en) 2002-03-14

Similar Documents

Publication Publication Date Title
AU2002246846A1 (en) Coating for implantable devices and a method of forming the same
AU2001238678A1 (en) Valve controlled spraying system
AU3187101A (en) Device for spraying a coating product
AU2002213939A1 (en) Process for coating a water-soluble package and package coated by that process
AU2001284184A1 (en) A method of manufacturing an inductor
AU2001281178A1 (en) Controlled and programmed deposition of flux on a flip-chip die by spraying
AU2001265014A1 (en) Appendage for a robot
AU2002212879A1 (en) Tool for a coil of a continuous object
AU2001280385A1 (en) A method for controlling the thickness of a galvanising coating on a metallic object
AU7439200A (en) A valve actuator
AU2002250784A1 (en) A spraying apparatus
AU2001247539A1 (en) Process for the deposition of a silver-tin alloy
AU2002333784A1 (en) Spray boom for a hydraulic descaling facility
AU2001277240A1 (en) Pattern-block flux deposition
HK1026928B (en) A method of depositing a metal on an article
AUPR551701A0 (en) A metal closure
PL341829A1 (en) Method of controlling operation of a magnetron-type atomising device
AU2002219305A1 (en) Method for real-time adjustment of a planisher
AUPQ658900A0 (en) A coating method
AU2001228183A1 (en) A coating method
AU2002350359A1 (en) A nozzle for coating surfaces
TW463557U (en) Intelligent device for controlling spraying time
HK1035473B (en) Top stop of a nylon zipper
AU2002321207A1 (en) Method for coating a transponder
AUPR447101A0 (en) A valve