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AU2001280676A1 - High temperature circuit structures - Google Patents

High temperature circuit structures

Info

Publication number
AU2001280676A1
AU2001280676A1 AU2001280676A AU8067601A AU2001280676A1 AU 2001280676 A1 AU2001280676 A1 AU 2001280676A1 AU 2001280676 A AU2001280676 A AU 2001280676A AU 8067601 A AU8067601 A AU 8067601A AU 2001280676 A1 AU2001280676 A1 AU 2001280676A1
Authority
AU
Australia
Prior art keywords
high temperature
circuit structures
temperature circuit
structures
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001280676A
Inventor
James D. Parsons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heetronix Corp
Original Assignee
Hetron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24588800&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2001280676(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hetron filed Critical Hetron
Publication of AU2001280676A1 publication Critical patent/AU2001280676A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Thermistors And Varistors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
AU2001280676A 2000-08-24 2001-07-20 High temperature circuit structures Abandoned AU2001280676A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09645383 2000-08-24
US09/645,383 US6576972B1 (en) 2000-08-24 2000-08-24 High temperature circuit structures with expansion matched SiC, AlN and/or AlxGa1-xN(x>0.69) circuit device
PCT/US2001/023008 WO2002016897A2 (en) 2000-08-24 2001-07-20 High temperature circuit structures

Publications (1)

Publication Number Publication Date
AU2001280676A1 true AU2001280676A1 (en) 2002-03-04

Family

ID=24588800

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001280676A Abandoned AU2001280676A1 (en) 2000-08-24 2001-07-20 High temperature circuit structures

Country Status (8)

Country Link
US (3) US6576972B1 (en)
EP (1) EP1311815B1 (en)
JP (1) JP3796218B2 (en)
CN (2) CN1773231A (en)
AU (1) AU2001280676A1 (en)
DE (1) DE60139130D1 (en)
RU (1) RU2248538C2 (en)
WO (1) WO2002016897A2 (en)

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US7106167B2 (en) * 2002-06-28 2006-09-12 Heetronix Stable high temperature sensor system with tungsten on AlN
US6845664B1 (en) * 2002-10-03 2005-01-25 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration MEMS direct chip attach packaging methodologies and apparatuses for harsh environments
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US7049558B2 (en) 2003-01-27 2006-05-23 Arcturas Bioscience, Inc. Apparatus and method for heating microfluidic volumes and moving fluids
US7063097B2 (en) * 2003-03-28 2006-06-20 Advanced Technology Materials, Inc. In-situ gas blending and dilution system for delivery of dilute gas at a predetermined concentration
WO2004088415A2 (en) * 2003-03-28 2004-10-14 Advanced Technology Materials Inc. Photometrically modulated delivery of reagents
US7306967B1 (en) 2003-05-28 2007-12-11 Adsem, Inc. Method of forming high temperature thermistors
DE10328660B3 (en) * 2003-06-26 2004-12-02 Infineon Technologies Ag Determining temperature of semiconductor wafer at instant of contact with sensor, records varying sensor output over time, to deduce initial wafer temperature
US7187161B2 (en) 2003-07-11 2007-03-06 Wabash Magnetics, Llc Transient protection of sensors
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US7307425B2 (en) * 2003-11-18 2007-12-11 Halliburton Energy Services, Inc. Receiver electronics proximate antenna
JP2005203734A (en) * 2003-12-15 2005-07-28 Toshiba Ceramics Co Ltd Ceramics embedded in metal parts and method for manufacturing the same
US7812705B1 (en) 2003-12-17 2010-10-12 Adsem, Inc. High temperature thermistor probe
US7292132B1 (en) * 2003-12-17 2007-11-06 Adsem, Inc. NTC thermistor probe
DE102004017799A1 (en) * 2004-04-05 2005-10-20 Ego Elektro Geraetebau Gmbh Temperature sensor and method for adjusting such
US7361946B2 (en) * 2004-06-28 2008-04-22 Nitronex Corporation Semiconductor device-based sensors
US20060211253A1 (en) * 2005-03-16 2006-09-21 Ing-Shin Chen Method and apparatus for monitoring plasma conditions in an etching plasma processing facility
US20080006775A1 (en) * 2006-06-22 2008-01-10 Arno Jose I Infrared gas detection systems and methods
US7412881B2 (en) * 2006-07-31 2008-08-19 Chevron U.S.A. Inc. Fluid flowrate determination
DE202006017648U1 (en) * 2006-11-20 2007-02-15 Atlas Material Testing Technology Gmbh Device for draining liquid drops from a temperature sensor
US20080311360A1 (en) * 2006-12-18 2008-12-18 Koa Corporation Thick film circuit component and method for manufacturing the same
US8110899B2 (en) * 2006-12-20 2012-02-07 Intel Corporation Method for incorporating existing silicon die into 3D integrated stack
US8138027B2 (en) * 2008-03-07 2012-03-20 Stats Chippac, Ltd. Optical semiconductor device having pre-molded leadframe with window and method therefor
US20090251960A1 (en) * 2008-04-07 2009-10-08 Halliburton Energy Services, Inc. High temperature memory device
DE102008036837A1 (en) 2008-08-07 2010-02-18 Epcos Ag Sensor device and method of manufacture
FR2936097B1 (en) * 2008-09-12 2010-10-29 Alstom Transport Sa METHOD FOR ENCAPSULATING A SEMICONDUCTOR ELECTRONIC COMPONENT
RU2391638C1 (en) * 2009-02-09 2010-06-10 Сергей Петрович Черных Device for measurement of temperature
US7938016B2 (en) * 2009-03-20 2011-05-10 Freescale Semiconductor, Inc. Multiple layer strain gauge
RU2399064C1 (en) * 2009-04-24 2010-09-10 Общество с ограниченной ответственностью "ЭЛЕМ ИНФО" Heat-sensitive field device
KR101815717B1 (en) 2009-05-29 2018-01-05 엔테그리스, 아이엔씨. Tpir apparatus for monitoring tungsten hexafluoride processing to detect gas phase nucleation, and method and system utilizing same
TWI421477B (en) * 2010-08-30 2014-01-01 Emcom Technology Inc Temperature change sensing device and method thereof
US10346276B2 (en) 2010-12-16 2019-07-09 Microsoft Technology Licensing, Llc Kernel awareness of physical environment
JP2012189571A (en) * 2011-02-24 2012-10-04 Renesas Electronics Corp Semiconductor device and method of manufacturing the same
US9046426B1 (en) 2012-06-15 2015-06-02 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration Modular apparatus and method for attaching multiple devices
CN102842398B (en) * 2012-08-27 2015-08-26 华中科技大学 A kind of preparation method of chip Ceramic sensible devices and corresponding product thereof
DE102012109704A1 (en) * 2012-10-11 2014-04-17 Epcos Ag Ceramic component with protective layer and method for its production
JP1528936S (en) * 2015-01-14 2015-07-13
JP1528485S (en) * 2015-01-14 2015-07-13
JP1528484S (en) * 2015-01-14 2015-07-13
TWD190983S (en) * 2017-02-17 2018-06-11 三星電子股份有限公司 Ssd storage device
KR101923074B1 (en) 2017-03-21 2018-11-28 부경대학교 산학협력단 Gold nanoparticle-silicon composite material used for low temperature sensor
EP3406758A1 (en) * 2017-05-22 2018-11-28 Vishay Electronic GmbH Method of producing an ntcr sensor
DE112018006712T5 (en) * 2017-12-27 2020-09-10 Murata Manufacturing Co., Ltd. Thermometer of detention type
USD869470S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD937793S1 (en) * 2019-04-26 2021-12-07 The Noco Company Circuit board
US11371892B2 (en) * 2019-06-28 2022-06-28 Fluke Corporation Platinum resistance temperature sensor having floating platinum member
USD938374S1 (en) * 2019-09-09 2021-12-14 The Noco Company Circuit board
US11482449B2 (en) 2020-08-03 2022-10-25 General Electric Company Electrical component with a dielectric passivation stack
CN112798126B (en) * 2021-04-08 2021-07-02 成都蓉矽半导体有限公司 A highly sensitive silicon carbide integratable temperature sensor
CN114314503B (en) * 2021-12-31 2024-08-27 深圳市信为科技发展有限公司 Packaging method of pressure sensor with micro multi-lead
USD1050059S1 (en) * 2022-06-17 2024-11-05 Seiko Epson Corporation Circuit board for computer printers
USD1087043S1 (en) * 2022-09-06 2025-08-05 Marvell Asia Pte. Ltd. Integrated circuit substrate
TWI887570B (en) 2022-09-26 2025-06-21 力拓半導體股份有限公司 Temperature sensing device
USD1059314S1 (en) * 2022-10-20 2025-01-28 Canaan Creative Co., Ltd. Circuit board with heat sink
CA235064S (en) * 2022-10-20 2024-12-16 Canaan Creative Co Ltd Circuit board
USD1054391S1 (en) * 2023-03-14 2024-12-17 Shenzhen Fanttik Technology Circuit board

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WO1995014215A1 (en) * 1993-11-18 1995-05-26 Unisia Jecs Corporation Method and device for detecting suction air flow rate for an engine
US5668524A (en) * 1994-02-09 1997-09-16 Kyocera Corporation Ceramic resistor and electrostatic chuck having an aluminum nitride crystal phase
EP0878707A4 (en) * 1996-10-22 2000-06-28 Riken Kk HEATER TYPE SENSOR
US6025609A (en) * 1996-12-05 2000-02-15 Quick; Nathaniel R. Laser synthesized ceramic electronic devices and circuits and method for making
US6319757B1 (en) * 1998-07-08 2001-11-20 Caldus Semiconductor, Inc. Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
US6239432B1 (en) * 1999-05-21 2001-05-29 Hetron IR radiation sensing with SIC
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Also Published As

Publication number Publication date
WO2002016897A3 (en) 2002-05-02
EP1311815B1 (en) 2009-07-01
JP2004507728A (en) 2004-03-11
WO2002016897A2 (en) 2002-02-28
US6765278B2 (en) 2004-07-20
EP1311815A2 (en) 2003-05-21
DE60139130D1 (en) 2009-08-13
CN1773231A (en) 2006-05-17
US20030146502A1 (en) 2003-08-07
JP3796218B2 (en) 2006-07-12
CN1471632A (en) 2004-01-28
US6649994B2 (en) 2003-11-18
US6576972B1 (en) 2003-06-10
CN1256575C (en) 2006-05-17
US20020179992A1 (en) 2002-12-05
RU2248538C2 (en) 2005-03-20

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