[go: up one dir, main page]

AU2001279297A1 - Method and apparatus for evaluating integrated circuit packages having three dimensional features - Google Patents

Method and apparatus for evaluating integrated circuit packages having three dimensional features

Info

Publication number
AU2001279297A1
AU2001279297A1 AU2001279297A AU7929701A AU2001279297A1 AU 2001279297 A1 AU2001279297 A1 AU 2001279297A1 AU 2001279297 A AU2001279297 A AU 2001279297A AU 7929701 A AU7929701 A AU 7929701A AU 2001279297 A1 AU2001279297 A1 AU 2001279297A1
Authority
AU
Australia
Prior art keywords
integrated circuit
dimensional features
circuit packages
evaluating integrated
evaluating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001279297A
Inventor
Frank Evans
Patrick F. Leonard
Victor Scarpine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/680,342 external-priority patent/US7034272B1/en
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of AU2001279297A1 publication Critical patent/AU2001279297A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
AU2001279297A 2000-10-05 2001-07-06 Method and apparatus for evaluating integrated circuit packages having three dimensional features Abandoned AU2001279297A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/680,342 2000-10-05
US09/680,342 US7034272B1 (en) 1999-10-05 2000-10-05 Method and apparatus for evaluating integrated circuit packages having three dimensional features
PCT/US2001/041293 WO2002029357A2 (en) 2000-10-05 2001-07-06 Method and apparatus for evaluating integrated circuit packages having three dimensional features

Publications (1)

Publication Number Publication Date
AU2001279297A1 true AU2001279297A1 (en) 2002-04-15

Family

ID=24730702

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001279297A Abandoned AU2001279297A1 (en) 2000-10-05 2001-07-06 Method and apparatus for evaluating integrated circuit packages having three dimensional features

Country Status (2)

Country Link
AU (1) AU2001279297A1 (en)
WO (1) WO2002029357A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002046713A2 (en) 2000-12-08 2002-06-13 Cyberoptics Corporation Automated system with improved height sensing
US7555831B2 (en) 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7239399B2 (en) 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US7559134B2 (en) 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
DE112006002473T5 (en) 2005-09-14 2008-08-14 Cyberoptics Corp., Golden Valley Pick and place machine with improved component pickup image identification processing
DE102006018558B4 (en) * 2006-04-21 2022-10-06 QUISS Qualitäts-Inspektionssysteme und Service GmbH Method for automatically applying or creating and monitoring a structure applied to a substrate with determination of geometric dimensions
US8050486B2 (en) * 2006-05-16 2011-11-01 The Boeing Company System and method for identifying a feature of a workpiece
US9052294B2 (en) 2006-05-31 2015-06-09 The Boeing Company Method and system for two-dimensional and three-dimensional inspection of a workpiece
DE102012104745B4 (en) * 2012-06-01 2015-03-19 SmartRay GmbH Test method and suitable test head
EP3115742B1 (en) 2015-07-10 2020-04-15 Hexagon Technology Center GmbH 3d measuring machine
CN105423949B (en) * 2015-12-15 2018-06-19 北京康拓红外技术股份有限公司 One kind ties up imaging method and device based on structure light 4
CN114641796A (en) 2019-10-31 2022-06-17 康宁股份有限公司 Method and apparatus for high resolution measurement of a workpiece
CN114952173A (en) * 2022-05-31 2022-08-30 熵智科技(深圳)有限公司 Method, device and equipment for extracting outer contour of circular ring in tube plate welding and storage medium

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0471196A3 (en) * 1990-08-13 1994-09-07 Siemens Ag Image analysis method

Also Published As

Publication number Publication date
WO2002029357A3 (en) 2004-04-08
WO2002029357A2 (en) 2002-04-11

Similar Documents

Publication Publication Date Title
EP1308992A4 (en) Device and method for processing substrate
EP1130626A3 (en) Method and apparatus for manufacturing semiconductor device
AU2001268872A1 (en) Method and apparatus for testing high performance circuits
SG112893A1 (en) Component mounting apparatus and method
AU2001250908A1 (en) Integrated circuit and method for signal decryption
AUPR157300A0 (en) An apparatus and method (bin03)
WO2002021254A8 (en) Mechanism and method for dynamic question handling through an electronic interface
AU2001247753A1 (en) Method and apparatus for integrated-battery devices
AUPR157600A0 (en) An apparatus and method (bin04)
AU2001238644A1 (en) Electronic supports and methods and apparatus for forming apertures in electronic supports
AUPR157400A0 (en) An apparatus and method (bin01)
AU2001282704A1 (en) Method and apparatus for well testing
AU2002227965A1 (en) Method and device for determining the properties of an integrated circuit
AU2001293574A1 (en) System and method for testing integrated circuit devices
AU2002216742A1 (en) Packaging apparatus and method
AU2002330002A1 (en) Methods and apparatus for testing electronic circuits
AU2001279297A1 (en) Method and apparatus for evaluating integrated circuit packages having three dimensional features
AU2002219222A1 (en) Device and method for changing lines
AU2001246591A1 (en) Method and device for transporting cars
AU2001259609A1 (en) Method and apparatus for sorting semiconductor devices
AU2002352861A1 (en) Packaged integrated circuit and method therefor
SG101949A1 (en) Method and apparatus for testing an integrated circuit
AU2001241660A1 (en) Electronic supports and methods and apparatus for forming apertures in electronic supports
AU2002218092A1 (en) Vddq integrated circuit testing system and method
AU2001251189A1 (en) Method and apparatus for electronic device feature access