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AU2001277122A1 - Fluid distribution system and process, and semiconductor fabrication facility utilizing same - Google Patents

Fluid distribution system and process, and semiconductor fabrication facility utilizing same

Info

Publication number
AU2001277122A1
AU2001277122A1 AU2001277122A AU7712201A AU2001277122A1 AU 2001277122 A1 AU2001277122 A1 AU 2001277122A1 AU 2001277122 A AU2001277122 A AU 2001277122A AU 7712201 A AU7712201 A AU 7712201A AU 2001277122 A1 AU2001277122 A1 AU 2001277122A1
Authority
AU
Australia
Prior art keywords
distribution system
fluid distribution
semiconductor fabrication
fabrication facility
utilizing same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001277122A
Inventor
James A. Dietz
Terry A. Tabler
Luping Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Technology Materials Inc
Original Assignee
Advanced Technology Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Technology Materials Inc filed Critical Advanced Technology Materials Inc
Publication of AU2001277122A1 publication Critical patent/AU2001277122A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00—Pipe-line systems
    • F17D1/02—Pipe-line systems for gases or vapours
    • F17D1/04—Pipe-line systems for gases or vapours for distribution of gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C11/00—Use of gas-solvents or gas-sorbents in vessels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C13/00—Details of vessels or of the filling or discharging of vessels
    • F17C13/04—Arrangement or mounting of valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
    • F17C2205/01—Mounting arrangements
    • F17C2205/0123—Mounting arrangements characterised by number of vessels
    • F17C2205/013—Two or more vessels
    • F17C2205/0134—Two or more vessels characterised by the presence of fluid connection between vessels
    • F17C2205/0146—Two or more vessels characterised by the presence of fluid connection between vessels with details of the manifold
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
    • F17C2205/03—Fluid connections, filters, valves, closure means or other attachments
    • F17C2205/0302—Fittings, valves, filters, or components in connection with the gas storage device
    • F17C2205/0323—Valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
    • F17C2205/03—Fluid connections, filters, valves, closure means or other attachments
    • F17C2205/0302—Fittings, valves, filters, or components in connection with the gas storage device
    • F17C2205/0338—Pressure regulators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2221/00—Handled fluid, in particular type of fluid
    • F17C2221/05—Ultrapure fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
    • F17C2223/01—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the phase
    • F17C2223/0146—Two-phase
    • F17C2223/0153—Liquefied gas, e.g. LPG, GPL
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
    • F17C2223/03—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the pressure level
    • F17C2223/033—Small pressure, e.g. for liquefied gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2250/00—Accessories; Control means; Indicating, measuring or monitoring of parameters
    • F17C2250/03—Control means
    • F17C2250/032—Control means using computers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2250/00—Accessories; Control means; Indicating, measuring or monitoring of parameters
    • F17C2250/06—Controlling or regulating of parameters as output values
    • F17C2250/0605—Parameters
    • F17C2250/0626—Pressure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2250/00—Accessories; Control means; Indicating, measuring or monitoring of parameters
    • F17C2250/06—Controlling or regulating of parameters as output values
    • F17C2250/0605—Parameters
    • F17C2250/0636—Flow or movement of content
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2265/00—Effects achieved by gas storage or gas handling
    • F17C2265/01—Purifying the fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2270/00—Applications
    • F17C2270/05—Applications for industrial use
    • F17C2270/0518—Semiconductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4673—Plural tanks or compartments with parallel flow
    • Y10T137/4807—Tank type manifold [i.e., one tank supplies or receives from at least two others]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/6416—With heating or cooling of the system
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/86187—Plural tanks or compartments connected for serial flow

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
AU2001277122A 2000-07-24 2001-07-23 Fluid distribution system and process, and semiconductor fabrication facility utilizing same Abandoned AU2001277122A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09624478 2000-07-24
US09/624,478 US6453924B1 (en) 2000-07-24 2000-07-24 Fluid distribution system and process, and semiconductor fabrication facility utilizing same
PCT/US2001/023191 WO2002007861A1 (en) 2000-07-24 2001-07-23 Fluid distribution system and process, and semiconductor fabrication facility utilizing same

Publications (1)

Publication Number Publication Date
AU2001277122A1 true AU2001277122A1 (en) 2002-02-05

Family

ID=24502164

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001277122A Abandoned AU2001277122A1 (en) 2000-07-24 2001-07-23 Fluid distribution system and process, and semiconductor fabrication facility utilizing same

Country Status (4)

Country Link
US (2) US6453924B1 (en)
AU (1) AU2001277122A1 (en)
TW (1) TW559854B (en)
WO (1) WO2002007861A1 (en)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW539918B (en) * 1997-05-27 2003-07-01 Tokyo Electron Ltd Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
CA2387341A1 (en) * 1999-11-02 2001-05-10 Tokyo Electron Limited Method and apparatus for supercritical processing of multiple workpieces
US6748960B1 (en) * 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
JP4724353B2 (en) * 2000-07-26 2011-07-13 東京エレクトロン株式会社 High pressure processing chamber for semiconductor substrates
US6762132B1 (en) 2000-08-31 2004-07-13 Micron Technology, Inc. Compositions for dissolution of low-K dielectric films, and methods of use
TW544797B (en) * 2001-04-17 2003-08-01 Kobe Steel Ltd High-pressure processing apparatus
US6620225B2 (en) * 2002-01-10 2003-09-16 Advanced Technology Materials, Inc. Adsorbents for low vapor pressure fluid storage and delivery
US7001468B1 (en) 2002-02-15 2006-02-21 Tokyo Electron Limited Pressure energized pressure vessel opening and closing device and method of providing therefor
AU2003215238A1 (en) * 2002-02-15 2003-09-09 Supercritical Systems Inc. Pressure enchanced diaphragm valve
US7387868B2 (en) 2002-03-04 2008-06-17 Tokyo Electron Limited Treatment of a dielectric layer using supercritical CO2
US6774019B2 (en) * 2002-05-17 2004-08-10 International Business Machines Corporation Incorporation of an impurity into a thin film
US6857447B2 (en) * 2002-06-10 2005-02-22 Advanced Technology Materials, Inc. Pressure-based gas delivery system and method for reducing risks associated with storage and delivery of high pressure gases
US6716271B1 (en) * 2002-10-29 2004-04-06 Advanced Technology Materials, Inc. Apparatus and method for inhibiting decomposition of germane
US6722642B1 (en) 2002-11-06 2004-04-20 Tokyo Electron Limited High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
US6991671B2 (en) 2002-12-09 2006-01-31 Advanced Technology Materials, Inc. Rectangular parallelepiped fluid storage and dispensing vessel
USD545393S1 (en) 2002-12-09 2007-06-26 Advanced Technology Materials, Inc. Rectangular parallelepiped fluid storage and dispensing vessel
US8002880B2 (en) 2002-12-10 2011-08-23 Advanced Technology Materials, Inc. Gas storage and dispensing system with monolithic carbon adsorbent
US6743278B1 (en) * 2002-12-10 2004-06-01 Advanced Technology Materials, Inc. Gas storage and dispensing system with monolithic carbon adsorbent
US7494530B2 (en) * 2002-12-10 2009-02-24 Advanced Technology Materials, Inc. Gas storage and dispensing system with monolithic carbon adsorbent
US6997202B2 (en) * 2002-12-17 2006-02-14 Advanced Technology Materials, Inc. Gas storage and dispensing system for variable conductance dispensing of gas at constant flow rate
US7021635B2 (en) 2003-02-06 2006-04-04 Tokyo Electron Limited Vacuum chuck utilizing sintered material and method of providing thereof
US7225820B2 (en) 2003-02-10 2007-06-05 Tokyo Electron Limited High-pressure processing chamber for a semiconductor wafer
US7077917B2 (en) * 2003-02-10 2006-07-18 Tokyo Electric Limited High-pressure processing chamber for a semiconductor wafer
US6868869B2 (en) * 2003-02-19 2005-03-22 Advanced Technology Materials, Inc. Sub-atmospheric pressure delivery of liquids, solids and low vapor pressure gases
US20040206239A1 (en) * 2003-02-20 2004-10-21 Laubacher Daniel B. Method for reducing gaseous contamination in a pressure vessel
WO2004088415A2 (en) * 2003-03-28 2004-10-14 Advanced Technology Materials Inc. Photometrically modulated delivery of reagents
US7063097B2 (en) * 2003-03-28 2006-06-20 Advanced Technology Materials, Inc. In-situ gas blending and dilution system for delivery of dilute gas at a predetermined concentration
US7270137B2 (en) 2003-04-28 2007-09-18 Tokyo Electron Limited Apparatus and method of securing a workpiece during high-pressure processing
US6909839B2 (en) * 2003-07-23 2005-06-21 Advanced Technology Materials, Inc. Delivery systems for efficient vaporization of precursor source material
US7163380B2 (en) 2003-07-29 2007-01-16 Tokyo Electron Limited Control of fluid flow in the processing of an object with a fluid
US20050034660A1 (en) * 2003-08-11 2005-02-17 Supercritical Systems, Inc. Alignment means for chamber closure to reduce wear on surfaces
US7186093B2 (en) 2004-10-05 2007-03-06 Tokyo Electron Limited Method and apparatus for cooling motor bearings of a high pressure pump
US7250374B2 (en) 2004-06-30 2007-07-31 Tokyo Electron Limited System and method for processing a substrate using supercritical carbon dioxide processing
US7307019B2 (en) 2004-09-29 2007-12-11 Tokyo Electron Limited Method for supercritical carbon dioxide processing of fluoro-carbon films
US20060065288A1 (en) * 2004-09-30 2006-03-30 Darko Babic Supercritical fluid processing system having a coating on internal members and a method of using
US20060065189A1 (en) * 2004-09-30 2006-03-30 Darko Babic Method and system for homogenization of supercritical fluid in a high pressure processing system
US7955797B2 (en) 2004-10-25 2011-06-07 Advanced Technology Materials, Inc. Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
US7491036B2 (en) 2004-11-12 2009-02-17 Tokyo Electron Limited Method and system for cooling a pump
US20060130966A1 (en) * 2004-12-20 2006-06-22 Darko Babic Method and system for flowing a supercritical fluid in a high pressure processing system
ES2381559T3 (en) * 2004-12-21 2012-05-29 Rhodia Chimie Composition that can form a gel comprising a copolymer, and useful copolymers
US7434590B2 (en) * 2004-12-22 2008-10-14 Tokyo Electron Limited Method and apparatus for clamping a substrate in a high pressure processing system
US7140393B2 (en) * 2004-12-22 2006-11-28 Tokyo Electron Limited Non-contact shuttle valve for flow diversion in high pressure systems
US20060135047A1 (en) * 2004-12-22 2006-06-22 Alexei Sheydayi Method and apparatus for clamping a substrate in a high pressure processing system
US20060134332A1 (en) * 2004-12-22 2006-06-22 Darko Babic Precompressed coating of internal members in a supercritical fluid processing system
US7435447B2 (en) * 2005-02-15 2008-10-14 Tokyo Electron Limited Method and system for determining flow conditions in a high pressure processing system
US7291565B2 (en) 2005-02-15 2007-11-06 Tokyo Electron Limited Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
US7343747B2 (en) * 2005-02-23 2008-03-18 Basf Aktiengesellschaft Metal-organic framework materials for gaseous hydrocarbon storage
US7380984B2 (en) 2005-03-28 2008-06-03 Tokyo Electron Limited Process flow thermocouple
US7767145B2 (en) 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
US7494107B2 (en) 2005-03-30 2009-02-24 Supercritical Systems, Inc. Gate valve for plus-atmospheric pressure semiconductor process vessels
CN102423665B (en) 2005-04-25 2015-04-15 高级技术材料公司 Liner-based liquid storage and dispensing systems with empty detection capability
US7789971B2 (en) 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
US7524383B2 (en) * 2005-05-25 2009-04-28 Tokyo Electron Limited Method and system for passivating a processing chamber
KR20110017462A (en) * 2005-06-06 2011-02-21 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 Fluid Storage and Dispensing Systems and Processes
TWI552797B (en) 2005-06-22 2016-10-11 恩特葛瑞斯股份有限公司 Apparatus and process for integrated gas blending
TW200722344A (en) * 2005-08-22 2007-06-16 Advanced Tech Materials Material containment system
US7833353B2 (en) * 2007-01-24 2010-11-16 Asm Japan K.K. Liquid material vaporization apparatus for semiconductor processing apparatus
CN100567140C (en) * 2007-04-26 2009-12-09 大连立方化学技术有限公司 The preparation purification process of Selenium hydride
US8037894B1 (en) * 2007-12-27 2011-10-18 Intermolecular, Inc. Maintaining flow rate of a fluid
US9444622B2 (en) 2008-09-15 2016-09-13 Hewlett Packard Enterprise Development Lp Computing platform with system key
US8012876B2 (en) * 2008-12-02 2011-09-06 Asm International N.V. Delivery of vapor precursor from solid source
US20100160731A1 (en) 2008-12-22 2010-06-24 Marc Giovannini Ultrasound-visualizable endoscopic access system
US20100185651A1 (en) * 2009-01-16 2010-07-22 Google Inc. Retrieving and displaying information from an unstructured electronic document collection
US8858819B2 (en) 2010-02-15 2014-10-14 Air Products And Chemicals, Inc. Method for chemical mechanical planarization of a tungsten-containing substrate
US8679231B2 (en) 2011-01-19 2014-03-25 Advanced Technology Materials, Inc. PVDF pyrolyzate adsorbent and gas storage and dispensing system utilizing same
US8997775B2 (en) 2011-05-24 2015-04-07 Rohm And Haas Electronic Materials Llc Vapor delivery device, methods of manufacture and methods of use thereof
US8776821B2 (en) * 2011-05-24 2014-07-15 Rohm And Haas Electronic Materials Llc Vapor delivery device, methods of manufacture and methods of use thereof
RU2483239C1 (en) * 2012-03-15 2013-05-27 Федеральное государственное бюджетное учреждение науки Институт проблем управления им. В.А. Трапезникова РАН Compressed gas energy utilisation method
US9126139B2 (en) 2012-05-29 2015-09-08 Entegris, Inc. Carbon adsorbent for hydrogen sulfide removal from gases containing same, and regeneration of adsorbent
US9243325B2 (en) 2012-07-18 2016-01-26 Rohm And Haas Electronic Materials Llc Vapor delivery device, methods of manufacture and methods of use thereof
CN103277665B (en) * 2013-05-31 2015-12-09 国家电网公司 SF6 gas recoverable means of deflation
US9209120B2 (en) * 2014-03-11 2015-12-08 Freescale Semiconductor, Inc. Semiconductor package with lead mounted power bar
AU2014203400A1 (en) * 2014-06-23 2016-01-21 SMC Pneumatics (Australia) Pty Ltd Factory compressed air supplies
KR20220116567A (en) 2016-07-01 2022-08-23 인제비티 사우스 캐롤라이나, 엘엘씨 Method for enhancing volumetric capacity in gas storage and release systems
US10400955B2 (en) * 2016-07-11 2019-09-03 Boris David Kogon Solvent depressurization devices, system, and methods
CN110195822B (en) * 2019-06-21 2021-04-02 江苏准信化学工程有限公司 Device and method for automatically controlling chlorine liquefaction efficiency
WO2021232036A1 (en) * 2020-05-11 2021-11-18 Praxair Technology, Inc. Storage and delivery of antimony-containing materials to an ion implanter

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5518528A (en) 1994-10-13 1996-05-21 Advanced Technology Materials, Inc. Storage and delivery system for gaseous hydride, halide, and organometallic group V compounds
US5707424A (en) 1994-10-13 1998-01-13 Advanced Technology Materials, Inc. Process system with integrated gas storage and delivery unit
US5704967A (en) 1995-10-13 1998-01-06 Advanced Technology Materials, Inc. Fluid storage and delivery system comprising high work capacity physical sorbent
US5916245A (en) * 1996-05-20 1999-06-29 Advanced Technology Materials, Inc. High capacity gas storage and dispensing system
US5980608A (en) * 1998-01-07 1999-11-09 Advanced Technology Materials, Inc. Throughflow gas storage and dispensing system
US6101816A (en) * 1998-04-28 2000-08-15 Advanced Technology Materials, Inc. Fluid storage and dispensing system

Also Published As

Publication number Publication date
WO2002007861A1 (en) 2002-01-31
US6561213B2 (en) 2003-05-13
US20020007849A1 (en) 2002-01-24
US6453924B1 (en) 2002-09-24
TW559854B (en) 2003-11-01

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