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AU2001276844A1 - Polymer matrix composites - Google Patents

Polymer matrix composites

Info

Publication number
AU2001276844A1
AU2001276844A1 AU2001276844A AU7684401A AU2001276844A1 AU 2001276844 A1 AU2001276844 A1 AU 2001276844A1 AU 2001276844 A AU2001276844 A AU 2001276844A AU 7684401 A AU7684401 A AU 7684401A AU 2001276844 A1 AU2001276844 A1 AU 2001276844A1
Authority
AU
Australia
Prior art keywords
polymer matrix
matrix composites
composites
polymer
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001276844A
Inventor
Jeffrey A. Kerchner
David V. Miller
Sridhar Venigalla
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cabot Corp
Original Assignee
Cabot Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Corp filed Critical Cabot Corp
Publication of AU2001276844A1 publication Critical patent/AU2001276844A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Insulating Materials (AREA)
AU2001276844A 2000-07-18 2001-06-28 Polymer matrix composites Abandoned AU2001276844A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21923200P 2000-07-18 2000-07-18
US60219232 2000-07-18
PCT/US2001/020586 WO2002007190A2 (en) 2000-07-18 2001-06-28 Polymer matrix composites

Publications (1)

Publication Number Publication Date
AU2001276844A1 true AU2001276844A1 (en) 2002-01-30

Family

ID=22818429

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001276844A Abandoned AU2001276844A1 (en) 2000-07-18 2001-06-28 Polymer matrix composites

Country Status (3)

Country Link
US (1) US20020040085A1 (en)
AU (1) AU2001276844A1 (en)
WO (1) WO2002007190A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030059366A1 (en) * 2001-09-21 2003-03-27 Cabot Corporation Dispersible barium titanate-based particles and methods of forming the same
US20030215606A1 (en) * 2002-05-17 2003-11-20 Clancy Donald J. Dispersible dielectric particles and methods of forming the same
US20040052721A1 (en) * 2002-09-13 2004-03-18 Kerchner Jeffrey A. Dielectric particles having passivated surfaces and methods of forming same
US20040121153A1 (en) * 2002-12-20 2004-06-24 Sridhar Venigalla High tetragonality barium titanate-based compositions and methods of forming the same
KR100691437B1 (en) 2005-11-02 2007-03-09 삼성전기주식회사 Polymer-ceramic dielectric compositions, embedded capacitors and printed circuit boards using the same
US7741396B2 (en) * 2005-11-23 2010-06-22 General Electric Company Composites having tunable dielectric constants, methods of manufacture thereof, and articles comprising the same
CN105453201B (en) 2013-07-30 2018-10-02 京瓷株式会社 Dielectric film, membrane capacitance and electronic equipment
US20180315547A1 (en) * 2017-05-01 2018-11-01 Eestor, Inc. Capacitor and method of making
US11198263B2 (en) 2018-03-22 2021-12-14 Rogers Corporation Melt processable thermoplastic composite comprising a multimodal dielectric filler
EP4516391A3 (en) 2019-09-27 2025-08-27 SHPP Global Technologies B.V. Processes for making polymer-ceramic core-shell particle powders
US12391828B2 (en) * 2020-06-15 2025-08-19 Shpp Global Technologies B.V. Polymer-ceramic composite articles with low dissipation factor and high dielectric constant, and core-shell particle powders and processes for making such articles

Also Published As

Publication number Publication date
WO2002007190A2 (en) 2002-01-24
US20020040085A1 (en) 2002-04-04

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