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AU2001275010A1 - Brazeable metallizations for diamond components - Google Patents

Brazeable metallizations for diamond components

Info

Publication number
AU2001275010A1
AU2001275010A1 AU2001275010A AU7501001A AU2001275010A1 AU 2001275010 A1 AU2001275010 A1 AU 2001275010A1 AU 2001275010 A AU2001275010 A AU 2001275010A AU 7501001 A AU7501001 A AU 7501001A AU 2001275010 A1 AU2001275010 A1 AU 2001275010A1
Authority
AU
Australia
Prior art keywords
brazeable
metallizations
diamond components
diamond
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001275010A
Inventor
Ronald R. Petkie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diamonex Inc
Original Assignee
Diamonex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diamonex Inc filed Critical Diamonex Inc
Publication of AU2001275010A1 publication Critical patent/AU2001275010A1/en
Abandoned legal-status Critical Current

Links

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    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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  • Chemical & Material Sciences (AREA)
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  • Ceramic Engineering (AREA)
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  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
AU2001275010A 2000-05-30 2001-05-30 Brazeable metallizations for diamond components Abandoned AU2001275010A1 (en)

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US09/584,762 US6531226B1 (en) 1999-06-02 2000-05-30 Brazeable metallizations for diamond components
PCT/US2001/017345 WO2001092185A1 (en) 2000-05-30 2001-05-30 Brazeable metallizations for diamond components

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Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6830780B2 (en) * 1999-06-02 2004-12-14 Morgan Chemical Products, Inc. Methods for preparing brazeable metallizations for diamond components
US7011134B2 (en) * 2000-10-13 2006-03-14 Chien-Min Sung Casting method for producing surface acoustic wave devices
US7132309B2 (en) * 2003-04-22 2006-11-07 Chien-Min Sung Semiconductor-on-diamond devices and methods of forming
US6815052B2 (en) * 2000-12-01 2004-11-09 P1 Diamond, Inc. Filled diamond foam material and method for forming same
EP1410437A2 (en) * 2001-01-22 2004-04-21 Morgan Chemical Products, Inc. Cvd diamond enhanced microprocessor cooling system
US6794605B2 (en) * 2001-08-02 2004-09-21 Skc Co., Ltd Method for fabricating chemical mechanical polshing pad using laser
US20030152773A1 (en) * 2002-02-14 2003-08-14 Chrysler Gregory M. Diamond integrated heat spreader and method of manufacturing same
CN1620491A (en) * 2002-02-20 2005-05-25 六号元素(控股)公司 Coated diamond particles
DE10235277B4 (en) * 2002-08-02 2005-12-29 Leonhardy Gmbh Method for attaching non-solderable components to electronic circuit boards
CN100550359C (en) * 2003-06-06 2009-10-14 霍尼韦尔国际公司 Heat transfer material and method of forming a heat transfer material
US6924170B2 (en) * 2003-06-30 2005-08-02 Intel Corporation Diamond-silicon hybrid integrated heat spreader
WO2005006945A2 (en) * 2003-07-03 2005-01-27 The Salk Institute For Biological Studies Methods for treating neural disorders and compounds useful therefor
WO2005078040A1 (en) * 2004-01-15 2005-08-25 Element Six Limited Coated abrasives
US20050276992A1 (en) * 2004-06-09 2005-12-15 Tung-Hsin Wu Method for metallizing a non-metallic surface and the metallized surface structure thereof
RU2285977C1 (en) * 2005-03-21 2006-10-20 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" (ФГУП НПП "Исток") Metal-plated diamond wafer and its manufacturing process
US8105693B2 (en) * 2007-08-29 2012-01-31 Sp3, Inc. Multilayered structures and methods thereof
US8378357B2 (en) 2007-08-29 2013-02-19 Sp3, Inc. Multilayered structures and methods of making multilayered structures
US7846767B1 (en) 2007-09-06 2010-12-07 Chien-Min Sung Semiconductor-on-diamond devices and associated methods
JP2014520757A (en) * 2011-07-20 2014-08-25 ダイヤモンド イノベイションズ インコーポレーテッド Brazed coated diamond-containing material
US9238349B2 (en) * 2013-08-12 2016-01-19 The United States Of America, As Represented By The Secretary Of The Navy Thin diamond film bonding providing low vapor pressure at high temperature
AU2015337848B2 (en) * 2014-10-28 2020-04-16 The University Of Melbourne A method of forming an enclosure
GB201421259D0 (en) 2014-12-01 2015-01-14 Element Six Technologies Ltd Bonding scheme for diamond components which has low thermal barrier resistance in high power density applications
CN113084176B (en) * 2021-04-09 2023-08-18 武汉工程大学 A self-supporting diamond film/Cu composite heat sink material and its preparation method

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3356473A (en) 1964-05-28 1967-12-05 Gen Electric Metal-bonded diamond abrasive body
US3351543A (en) 1964-05-28 1967-11-07 Gen Electric Process of coating diamond with an adherent metal coating using cathode sputtering
US3243498A (en) 1964-12-24 1966-03-29 Ibm Method for making circuit connections to internal layers of a multilayer circuit card and circuit card produced thereby
JPS5194771A (en) 1975-02-18 1976-08-19 Daiyamondono metaraizuhoho
US4117968A (en) 1975-09-04 1978-10-03 Jury Vladimirovich Naidich Method for soldering metals with superhard man-made materials
US4342632A (en) 1981-05-01 1982-08-03 The United States Of America As Represented By The Secretary Of The Army Method of metallizing a ceramic substrate
JPS6224647A (en) 1986-05-10 1987-02-02 Sumitomo Electric Ind Ltd Substrate for mounting semiconductor elements
US4776862A (en) 1987-12-08 1988-10-11 Wiand Ronald C Brazing of diamond
US4931363A (en) 1988-02-22 1990-06-05 General Electric Company Brazed thermally-stable polycrystalline diamond compact workpieces
US4899922A (en) 1988-02-22 1990-02-13 General Electric Company Brazed thermally-stable polycrystalline diamond compact workpieces and their fabrication
US5024680A (en) * 1988-11-07 1991-06-18 Norton Company Multiple metal coated superabrasive grit and methods for their manufacture
JPH02226749A (en) 1989-02-28 1990-09-10 Toshiba Corp Heat sink for high-output circuit component
US5126207A (en) * 1990-07-20 1992-06-30 Norton Company Diamond having multiple coatings and methods for their manufacture
US5348108A (en) * 1991-03-01 1994-09-20 Baker Hughes Incorporated Rolling cone bit with improved wear resistant inserts
US5239746A (en) 1991-06-07 1993-08-31 Norton Company Method of fabricating electronic circuits
US5250086A (en) 1992-03-25 1993-10-05 General Electric Company Multi-layer metal coated diamond abrasives for sintered metal bonded tools
US5234153A (en) 1992-08-28 1993-08-10 At&T Bell Laboratories Permanent metallic bonding method
US5328715A (en) 1993-02-11 1994-07-12 General Electric Company Process for making metallized vias in diamond substrates
US5324987A (en) 1993-04-14 1994-06-28 General Electric Company Electronic apparatus with improved thermal expansion match
US5804321A (en) 1993-07-30 1998-09-08 The United States Of America As Represented By The Secretary Of The Navy Diamond brazed to a metal
JPH0864724A (en) 1994-07-25 1996-03-08 General Electric Co <Ge> Electronic device with a compliant metal chip-substrate bonding layer
US5500248A (en) 1994-08-04 1996-03-19 General Electric Company Fabrication of air brazable diamond tool
US5529805A (en) 1994-09-22 1996-06-25 General Electric Company Method for manufacturing a diamond article
US5626909A (en) * 1994-12-07 1997-05-06 General Electric Company Fabrication of brazable in air tool inserts
US5849113A (en) 1996-09-27 1998-12-15 The Foundation: The Research Institute Of Electric And Magnetic Alloys Electrical resistant alloy having a high temperature coefficient of resistance
US5853888A (en) 1997-04-25 1998-12-29 The United States Of America As Represented By The Secretary Of The Navy Surface modification of synthetic diamond for producing adherent thick and thin film metallizations for electronic packaging

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