[go: up one dir, main page]

AU2001261402A1 - System for cutting brittle materials - Google Patents

System for cutting brittle materials

Info

Publication number
AU2001261402A1
AU2001261402A1 AU2001261402A AU6140201A AU2001261402A1 AU 2001261402 A1 AU2001261402 A1 AU 2001261402A1 AU 2001261402 A AU2001261402 A AU 2001261402A AU 6140201 A AU6140201 A AU 6140201A AU 2001261402 A1 AU2001261402 A1 AU 2001261402A1
Authority
AU
Australia
Prior art keywords
brittle materials
cutting brittle
cutting
materials
brittle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001261402A
Inventor
Thomas Michel
Dmitri Nikitin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PTG PRECISION TECHNOLOGY CENTER Ltd LLC
Original Assignee
PTG PREC TECHNOLOGY CT Ltd LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PTG PREC TECHNOLOGY CT Ltd LLC filed Critical PTG PREC TECHNOLOGY CT Ltd LLC
Publication of AU2001261402A1 publication Critical patent/AU2001261402A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mining & Mineral Resources (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
AU2001261402A 2000-05-11 2001-05-10 System for cutting brittle materials Abandoned AU2001261402A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US20328900P 2000-05-11 2000-05-11
US60203289 2000-05-11
US20411000P 2000-05-15 2000-05-15
US20409900P 2000-05-15 2000-05-15
US20410900P 2000-05-15 2000-05-15
US60204110 2000-05-15
US60204099 2000-05-15
US60204109 2000-05-15
PCT/US2001/015162 WO2001085387A1 (en) 2000-05-11 2001-05-10 System for cutting brittle materials

Publications (1)

Publication Number Publication Date
AU2001261402A1 true AU2001261402A1 (en) 2001-11-20

Family

ID=27498497

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001261402A Abandoned AU2001261402A1 (en) 2000-05-11 2001-05-10 System for cutting brittle materials

Country Status (4)

Country Link
US (1) US20020006765A1 (en)
AU (1) AU2001261402A1 (en)
TW (1) TW521020B (en)
WO (1) WO2001085387A1 (en)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (en) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 Laser processing method and semiconductor chip manufacturing method
DE60335538D1 (en) 2002-03-12 2011-02-10 Hamamatsu Photonics Kk METHOD FOR CUTTING A PROCESSED OBJECT
CN100485902C (en) * 2002-03-12 2009-05-06 浜松光子学株式会社 Substrate dividing method
TWI326626B (en) * 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
US6744009B1 (en) * 2002-04-02 2004-06-01 Seagate Technology Llc Combined laser-scribing and laser-breaking for shaping of brittle substrates
KR20040046421A (en) * 2002-11-27 2004-06-05 주식회사 이오테크닉스 Apparatus and method for cutting brittle material using laser
TWI520269B (en) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
CN1758993B (en) * 2003-01-29 2012-03-21 三星宝石工业株式会社 Substrate cutting device and substrate cutting method
FR2852250B1 (en) * 2003-03-11 2009-07-24 Jean Luc Jouvin PROTECTIVE SHEATH FOR CANNULA, AN INJECTION KIT COMPRISING SUCH ANKLE AND NEEDLE EQUIPPED WITH SUCH ANKLE
AU2003220847A1 (en) 2003-03-12 2004-09-30 Hamamatsu Photonics K.K. Laser beam machining method
KR101119387B1 (en) * 2003-07-18 2012-03-07 하마마츠 포토닉스 가부시키가이샤 cutting method
JP4563097B2 (en) 2003-09-10 2010-10-13 浜松ホトニクス株式会社 Semiconductor substrate cutting method
CN1890188A (en) * 2003-12-05 2007-01-03 旭硝子株式会社 Method and device for cutting plate glass
JP4509578B2 (en) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP4598407B2 (en) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP4601965B2 (en) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
DE102004014276A1 (en) * 2004-03-22 2005-10-13 Grenzebach Maschinenbau Gmbh Longitudinal cutting of moving flat glass strips from float glass plates with warming of the plates by a laser beam followed by breakage of the strips off the plates
KR101043674B1 (en) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 Scribing Device and Method
DE102004035342B4 (en) * 2004-07-21 2007-12-27 Schott Ag Process for cutting sheets of non-metallic materials
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
US20060021977A1 (en) * 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
DE102005013783B4 (en) * 2005-03-22 2007-08-16 Jenoptik Automatisierungstechnik Gmbh Method for separating brittle materials by means of laser with unsymmetrical radiation density distribution
CN100443239C (en) * 2005-04-18 2008-12-17 深圳市大族激光科技股份有限公司 Method and workbench for cutting P/P board
US20060249553A1 (en) * 2005-05-06 2006-11-09 Ljerka Ukrainczyk Ultrasonic induced crack propagation in a brittle material
CN100445013C (en) * 2005-09-30 2008-12-24 富士迈半导体精密工业（上海）有限公司 laser cutting method
KR100972488B1 (en) * 2005-12-29 2010-07-26 엘지디스플레이 주식회사 Laser cutting device and cutting method using laser, manufacturing method of liquid crystal display device using the same
US8168514B2 (en) * 2006-08-24 2012-05-01 Corning Incorporated Laser separation of thin laminated glass substrates for flexible display applications
CA2560238A1 (en) * 2006-09-20 2008-03-20 Institut National D'optique Laser-based ablation method and optical system
US20080110952A1 (en) * 2006-11-15 2008-05-15 Marvin William Kemmerer Sheet separation through fluid impact
RU2333163C1 (en) * 2007-07-09 2008-09-10 Владимир Степанович Кондратенко Method of brittle nonmetalie materials cutting (versions)
CN101462822B (en) 2007-12-21 2012-08-29 鸿富锦精密工业（深圳）有限公司 Friable non-metal workpiece with through hole and method of processing the same
CN101468875A (en) 2007-12-24 2009-07-01 鸿富锦精密工业（深圳）有限公司 Friable non-metal base material and cutting method therefor
TWI382907B (en) * 2007-12-31 2013-01-21 Hon Hai Prec Ind Co Ltd Brittle non-metallic workpiece with a hole and mothod for making the same
WO2010048733A1 (en) * 2008-10-29 2010-05-06 Oerlikon Solar Ip Ag, Trübbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
JP5292068B2 (en) * 2008-11-20 2013-09-18 株式会社不二製作所 Abrasive injection / collection part structure in blasting method and blasting machine
US8347651B2 (en) * 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
CN102686354B (en) * 2009-03-20 2015-11-25 康宁股份有限公司 Precise laser indentation
DE102009023602B4 (en) 2009-06-02 2012-08-16 Grenzebach Maschinenbau Gmbh Device for the industrial production of elastically deformable large-area glass plates in large quantities
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
JP5620669B2 (en) * 2009-10-26 2014-11-05 東芝機械株式会社 Laser dicing method and laser dicing apparatus
WO2011056900A2 (en) * 2009-11-03 2011-05-12 Applied Materials, Inc. Multi-wavelength laser-scribing tool
JP5795000B2 (en) * 2009-11-30 2015-10-14 コーニング インコーポレイテッド Laser scribing and separation method for glass substrate
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US20110127242A1 (en) * 2009-11-30 2011-06-02 Xinghua Li Methods for laser scribing and separating glass substrates
US9669613B2 (en) 2010-12-07 2017-06-06 Ipg Photonics Corporation Laser lift off systems and methods that overlap irradiation zones to provide multiple pulses of laser irradiation per location at an interface between layers to be separated
CN102714150B (en) * 2009-12-07 2016-01-20 Ipg微系统有限公司 Laser lift-off system and method
FI20105011A0 (en) * 2010-01-08 2010-01-08 Lappeenrannan Teknillinen Ylio Process for processing materials by means of a laser device
TWI438162B (en) * 2010-01-27 2014-05-21 Wintek Corp Cutting method and preparatory cutting structure for reinforced glass
TWI513670B (en) 2010-08-31 2015-12-21 Corning Inc Methods of separating strengthened glass substrates
WO2012169025A1 (en) * 2011-06-08 2012-12-13 日本電気硝子株式会社 Method for cutting plate-like glass, and cutting device therefor
US9472776B2 (en) * 2011-10-14 2016-10-18 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sealed structure including welded glass frits
US8677783B2 (en) * 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
US9938180B2 (en) * 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US20140084040A1 (en) * 2012-09-24 2014-03-27 Electro Scientific Industries, Inc. Method and apparatus for separating workpieces
DE102012110971B4 (en) * 2012-11-14 2025-03-20 Schott Ag Method for producing linearly arranged damage points in a transparent workpiece and method and device for separating a workpiece
US9212081B2 (en) * 2012-11-21 2015-12-15 Corning Incorporated Methods of cutting a laminate strengthened glass substrate
EP2781296B1 (en) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
CN103288340B (en) * 2013-05-20 2016-08-10 深圳市华星光电技术有限公司 The cutting splitting device of glass substrate and cutting splitting method thereof
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
WO2016007695A1 (en) * 2014-07-09 2016-01-14 Corning Incorporated Methods for separating a glass sheet
WO2016010954A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US10017411B2 (en) * 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
DE102015104801A1 (en) * 2015-03-27 2016-09-29 Schott Ag Method and apparatus for continuous separation of glass
JP6638514B2 (en) 2015-03-31 2020-01-29 日本電気硝子株式会社 Cutting method for brittle substrate
CN107636805B (en) * 2015-06-23 2020-12-11 三菱电机株式会社 Manufacturing method and manufacturing apparatus of semiconductor element
KR102499697B1 (en) 2015-07-10 2023-02-14 코닝 인코포레이티드 Method for continuously manufacturing holes in a flexible substrate sheet and articles related thereto
DE102015111490A1 (en) * 2015-07-15 2017-01-19 Schott Ag Method and device for laser-assisted separation of a section from a flat glass element
US10052713B2 (en) * 2015-08-20 2018-08-21 Ultex Corporation Bonding method and bonded structure
DE102015120156B4 (en) * 2015-11-20 2019-07-04 Semikron Elektronik Gmbh & Co. Kg Device for the material connection of connection partners of a Leistungselekronik component and use of such a device
WO2017091529A1 (en) * 2015-11-25 2017-06-01 Corning Incorporated Methods of separating a glass web
US10828800B2 (en) * 2016-03-08 2020-11-10 Arizona Board Of Regents On Behalf Of Arizona State University Sound-assisted crack propagation for semiconductor wafering
CN109311725B (en) 2016-05-06 2022-04-26 康宁股份有限公司 Laser cutting and removing profile shapes from transparent substrates
KR20190035805A (en) * 2016-07-29 2019-04-03 코닝 인코포레이티드 Apparatus and method for laser processing
JP6923284B2 (en) 2016-09-30 2021-08-18 コーニング インコーポレイテッド Equipment and methods for laser machining transparent workpieces using non-axisymmetric beam spots
JP7066701B2 (en) 2016-10-24 2022-05-13 コーニング インコーポレイテッド Substrate processing station for laser-based processing of sheet glass substrates
JP6831248B2 (en) * 2017-01-16 2021-02-17 株式会社ディスコ Wafer processing method and adhesive tape
JP6355001B2 (en) * 2017-03-29 2018-07-11 三星ダイヤモンド工業株式会社 Substrate break device
CN107953038B (en) * 2017-12-27 2023-10-20 常州英诺激光科技有限公司 Transparent brittle material processing equipment
CN110526569A (en) * 2018-05-25 2019-12-03 广西大学 The ultrasonic diamond composite cutter of glass-cutting
KR102209714B1 (en) * 2018-12-13 2021-01-29 (주)미래컴퍼니 A method of cutting a structure having brittle materials and its apparatus
WO2021009960A1 (en) 2019-07-16 2021-01-21 日東電工株式会社 Method for dividing composite material
DE102019129036A1 (en) * 2019-10-28 2021-04-29 Schott Ag Process for the production of glass panes and glass panes produced in accordance with the process and their use
TWI733604B (en) * 2020-06-10 2021-07-11 財團法人工業技術研究院 Laser processing system and method for glass workpiece
CN112209605B (en) * 2020-10-07 2022-04-29 日禺光学科技(苏州)有限公司 Accurate adjusting device of optical prism processing
CN112388181A (en) * 2020-11-06 2021-02-23 鹤山市鸿湶包装有限公司 Laser die cutting paperboard separating device
CN113185107A (en) * 2021-05-10 2021-07-30 深圳市吉祥云科技有限公司 Glass punching equipment and glass punching method
CN113798679B (en) * 2021-10-27 2024-01-05 佛山市南海区广工大数控装备协同创新研究院 Amorphous alloy functionalized surface preparation method based on laser microtexture
CN114420446B (en) * 2022-03-29 2022-08-16 绵阳聚贤自动化设备有限公司 Winding pin manufacturing process of network filter
CN118507594A (en) * 2024-05-28 2024-08-16 环晟光伏(江苏)有限公司 Method for reducing cutting loss of Topcon battery assembly and application thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132505A (en) * 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
RU2024441C1 (en) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Process of cutting of nonmetal materials
EP0613765B1 (en) * 1993-03-02 1999-12-15 CeramTec AG Innovative Ceramic Engineering Method for the manufacture of subdividable tiles from a brittle material
JPH10128567A (en) * 1996-10-30 1998-05-19 Nec Kansai Ltd Laser beam splitting method
CA2246084A1 (en) * 1998-08-28 2000-02-28 Todd William Simpson Method of patterning semiconductor materials and other brittle materials
US6102267A (en) * 1998-12-10 2000-08-15 Lucent Technologies, Inc. Method and apparatus for non-contact pulsating jet cleaving of a semiconductor material
US6267282B1 (en) * 1999-04-01 2001-07-31 Agere Systems Optoelectronics Guardian Corp. Method and apparatus for handling laser bars
US6274458B1 (en) * 1999-07-07 2001-08-14 Agere Systems Optoelectronics Guardian Corp. Method of gas cleaving a semiconductor product

Also Published As

Publication number Publication date
WO2001085387A1 (en) 2001-11-15
TW521020B (en) 2003-02-21
US20020006765A1 (en) 2002-01-17

Similar Documents

Publication Publication Date Title
AU2001261402A1 (en) System for cutting brittle materials
AU2001278950A1 (en) Structural saw blade
AU2002224076A1 (en) Saw blade
EP1266125B8 (en) Rotatable cutting tool
AU4130300A (en) Cutting tool
AUPP846599A0 (en) Cutting device
AU2414101A (en) Messaging system
AU2001273259A1 (en) Differentially-pumped material processing system
AU2001255725A1 (en) Easy cutter
AU6595300A (en) Cutting apparatus
AU2001220281A1 (en) Rollerboard for road-skiing
AU4651100A (en) Cutting tool
AU2001252364A1 (en) Saw blades
AU2002359774A1 (en) Malpiece perforating/cutting system
AU2001262292A1 (en) Holding device for knives
AUPQ625900A0 (en) Cutting device
AU2002211092A1 (en) Cutting device
AU6905101A (en) Linear cutting blade
AU2001264122A1 (en) Cutting machine
AU2001264062A1 (en) Messaging system
EP1219371A3 (en) Saw blade
AU6648201A (en) Cutting tool
AU2001289683A1 (en) Blade
AUPR090900A0 (en) Cutter
AU2001293979A1 (en) Cutting device