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AU2001260142A1 - High molecular weight epoxy resin and resinous composition for printed circuit board - Google Patents

High molecular weight epoxy resin and resinous composition for printed circuit board

Info

Publication number
AU2001260142A1
AU2001260142A1 AU2001260142A AU6014201A AU2001260142A1 AU 2001260142 A1 AU2001260142 A1 AU 2001260142A1 AU 2001260142 A AU2001260142 A AU 2001260142A AU 6014201 A AU6014201 A AU 6014201A AU 2001260142 A1 AU2001260142 A1 AU 2001260142A1
Authority
AU
Australia
Prior art keywords
circuit board
molecular weight
printed circuit
epoxy resin
high molecular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001260142A
Other languages
English (en)
Inventor
Takao Fukuzawa
Takayoshi Hirai
Tetsuso Imura
Yoshinobu Ohnuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shell Internationale Research Maatschappij BV
Original Assignee
Shell Internationale Research Maatschappij BV
Resolution Research Nederland BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Internationale Research Maatschappij BV, Resolution Research Nederland BV filed Critical Shell Internationale Research Maatschappij BV
Publication of AU2001260142A1 publication Critical patent/AU2001260142A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/93—Reaction product of a polyhydric phenol and epichlorohydrin or diepoxide, having a molecular weight of over 5,000, e.g. phenoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
AU2001260142A 2000-03-21 2001-03-21 High molecular weight epoxy resin and resinous composition for printed circuit board Abandoned AU2001260142A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000077492A JP2001261789A (ja) 2000-03-21 2000-03-21 高分子量エポキシ樹脂及びプリント配線板用樹脂組成物
JP2000-77492 2000-03-21
PCT/EP2001/003246 WO2001070843A2 (fr) 2000-03-21 2001-03-21 Resine époxyde de poids moleculaire eleve et composition resineuse pour plaquettes de ci

Publications (1)

Publication Number Publication Date
AU2001260142A1 true AU2001260142A1 (en) 2001-10-03

Family

ID=18595050

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001260142A Abandoned AU2001260142A1 (en) 2000-03-21 2001-03-21 High molecular weight epoxy resin and resinous composition for printed circuit board

Country Status (4)

Country Link
US (1) US6451878B1 (fr)
JP (1) JP2001261789A (fr)
AU (1) AU2001260142A1 (fr)
WO (1) WO2001070843A2 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194274A (ja) * 2000-10-20 2002-07-10 Kansai Paint Co Ltd 塗料組成物
JP2002206017A (ja) * 2001-01-10 2002-07-26 Kansai Paint Co Ltd エポキシ樹脂組成物
US6680158B2 (en) * 2001-07-31 2004-01-20 Chi Mei Corporation Radiation-sensitive resin composition for spacer
US7592067B2 (en) 2003-09-22 2009-09-22 Hexion Specialty Chemicals, Inc. Epoxy resin compositions, processes utilizing same and articles made therefrom
US20070177331A1 (en) * 2005-01-10 2007-08-02 Endicott Interconnect Technologies, Inc. Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate
JP5127160B2 (ja) * 2006-05-19 2013-01-23 日本化薬株式会社 エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
JP5127164B2 (ja) * 2006-06-13 2013-01-23 日本化薬株式会社 変性エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
JP2008150495A (ja) * 2006-12-18 2008-07-03 Dic Corp ビルドアップフィルム絶縁層用樹脂組成物、その硬化物、及びビルドアップフィルム
JP2008231428A (ja) * 2008-04-03 2008-10-02 Japan Epoxy Resin Kk 高分子量エポキシ樹脂、電気積層板用樹脂組成物及び電気積層板
JP5326157B2 (ja) * 2009-01-20 2013-10-30 住友電工ウインテック株式会社 自己融着性絶縁電線、及び圧縮機駆動用モータ
JP5660783B2 (ja) * 2010-01-18 2015-01-28 新日鉄住金化学株式会社 スルホン基含有ポリヒドロキシポリエーテル樹脂、該樹脂を含有する樹脂組成物、該樹脂を含有する硬化性樹脂組成物、及びそれらから得られるフィルム
PL2558543T3 (pl) 2010-04-16 2018-01-31 Swimc Llc Kompozycja powłokowa do wyrobów opakowaniowych i sposoby powlekania
JP5610168B2 (ja) * 2010-11-17 2014-10-22 日産化学工業株式会社 レジスト下層膜形成組成物及びそれを用いたレジストパターンの形成方法
CA2825377C (fr) 2011-02-07 2021-03-02 Valspar Sourcing, Inc. Compositions de revetement pour contenants et autres articles, et procedes de revetement
JP5951962B2 (ja) * 2011-11-07 2016-07-13 旭化成株式会社 エポキシ樹脂の製造方法及び該製造方法を用いて得られたエポキシ樹脂
JP5951963B2 (ja) * 2011-11-07 2016-07-13 旭化成株式会社 エポキシ樹脂の製造方法及び該製造方法を用いて得られたエポキシ樹脂
JP5360285B2 (ja) * 2012-01-26 2013-12-04 東レ株式会社 感光性導電ペースト
EP3483227B1 (fr) 2012-08-09 2020-12-16 Swimc, LLC Compositions pour récipients et autres articles et leurs procédés d'utilisation
JP6746501B2 (ja) 2014-04-14 2020-08-26 ヴァルスパー・ソーシング・インコーポレーテッド 容器及び他の物品のための組成物の調製方法並びにその使用方法
JP6409487B2 (ja) * 2014-10-15 2018-10-24 三菱ケミカル株式会社 エポキシ樹脂及びその製造方法、エポキシ樹脂含有組成物並びに硬化物
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
JP2017115055A (ja) * 2015-12-25 2017-06-29 日立化成株式会社 フェノキシ樹脂
JP7277126B2 (ja) 2018-12-21 2023-05-18 日鉄ケミカル＆マテリアル株式会社 フェノキシ樹脂、その樹脂組成物、その硬化物、およびその製造方法。
JP7496731B2 (ja) * 2020-08-05 2024-06-07 株式会社日本触媒 硬化性樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL110481C (fr) * 1959-06-15 1900-01-01 Shell Int Research
US3733305A (en) * 1971-02-03 1973-05-15 Witco Chemical Corp Curable low softening epoxy resins containing bisphenol s
JP2534296B2 (ja) * 1988-02-15 1996-09-11 日東電工株式会社 半導体装置
US5310854A (en) * 1989-08-23 1994-05-10 The Dow Chemical Company Epoxy resin composition and process therefor
JPH05295090A (ja) 1992-04-15 1993-11-09 Hitachi Chem Co Ltd エポキシ樹脂組成物
JPH06128461A (ja) 1992-10-19 1994-05-10 Matsushita Electric Works Ltd 積層板用樹脂組成物
JPH08127651A (ja) * 1994-10-28 1996-05-21 Kureha Chem Ind Co Ltd フェノキシ樹脂の製造方法
JP3084351B2 (ja) 1995-09-01 2000-09-04 住友ベークライト株式会社 多層プリント配線板用層間絶縁接着剤

Also Published As

Publication number Publication date
WO2001070843A2 (fr) 2001-09-27
US6451878B1 (en) 2002-09-17
WO2001070843A3 (fr) 2002-02-28
JP2001261789A (ja) 2001-09-26

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