[go: up one dir, main page]

ATE476753T1 - Electronische einrichtung, informationsprozessor und anordnung zum unterdrücken von elektromagnetischen störungen - Google Patents

Electronische einrichtung, informationsprozessor und anordnung zum unterdrücken von elektromagnetischen störungen

Info

Publication number
ATE476753T1
ATE476753T1 AT04735668T AT04735668T ATE476753T1 AT E476753 T1 ATE476753 T1 AT E476753T1 AT 04735668 T AT04735668 T AT 04735668T AT 04735668 T AT04735668 T AT 04735668T AT E476753 T1 ATE476753 T1 AT E476753T1
Authority
AT
Austria
Prior art keywords
electronic device
information processor
arrangement
circuit board
integrated circuit
Prior art date
Application number
AT04735668T
Other languages
English (en)
Inventor
Osamu Murasawa
Original Assignee
Sony Computer Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Computer Entertainment Inc filed Critical Sony Computer Entertainment Inc
Application granted granted Critical
Publication of ATE476753T1 publication Critical patent/ATE476753T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Near-Field Transmission Systems (AREA)
AT04735668T 2003-06-05 2004-06-01 Electronische einrichtung, informationsprozessor und anordnung zum unterdrücken von elektromagnetischen störungen ATE476753T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003160971A JP4469563B2 (ja) 2003-06-05 2003-06-05 電子機器、電磁波放射抑制部材
PCT/JP2004/007883 WO2004109800A1 (en) 2003-06-05 2004-06-01 Electronic device, information processor, and electromagnetic radiation suppressing member

Publications (1)

Publication Number Publication Date
ATE476753T1 true ATE476753T1 (de) 2010-08-15

Family

ID=33508588

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04735668T ATE476753T1 (de) 2003-06-05 2004-06-01 Electronische einrichtung, informationsprozessor und anordnung zum unterdrücken von elektromagnetischen störungen

Country Status (9)

Country Link
US (1) US7053295B2 (de)
EP (1) EP1634331B1 (de)
JP (1) JP4469563B2 (de)
KR (1) KR101099260B1 (de)
CN (1) CN1802747B (de)
AT (1) ATE476753T1 (de)
DE (1) DE602004028464D1 (de)
TW (1) TWI310673B (de)
WO (1) WO2004109800A1 (de)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6950310B2 (en) * 2003-12-31 2005-09-27 Texas Instruments Incorporated System and method for self-leveling heat sink for multiple height devices
JP2006251584A (ja) * 2005-03-14 2006-09-21 Funai Electric Co Ltd プロジェクタエンジン部構造
CN100463594C (zh) * 2005-06-18 2009-02-18 鸿富锦精密工业（深圳）有限公司 具有散热功能的电磁屏蔽装置
US7327577B2 (en) * 2005-11-03 2008-02-05 International Business Machines Corporation Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers
US7904647B2 (en) * 2006-11-27 2011-03-08 Lsi Corporation System for optimizing the performance and reliability of a storage controller cache offload circuit
JP4998900B2 (ja) * 2007-02-15 2012-08-15 日本電気株式会社 電子装置搭載機器とそのノイズ抑制方法
CN201104378Y (zh) * 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置
US20090032218A1 (en) * 2007-07-31 2009-02-05 Adc Telecommunications, Inc. Apparatus for transferring between two heat conducting surfaces
US8051896B2 (en) * 2007-07-31 2011-11-08 Adc Telecommunications, Inc. Apparatus for spreading heat over a finned surface
US8235094B2 (en) * 2007-07-31 2012-08-07 Adc Telecommunications, Inc. Apparatus for transferring heat in a fin of a heat sink
US7539019B2 (en) * 2007-07-31 2009-05-26 Adc Telecommunications, Inc. Apparatus for transferring heat from a heat spreader
JP2009060048A (ja) * 2007-09-03 2009-03-19 Toshiba Corp シールドケース装置および表示装置
US7672134B2 (en) * 2007-11-30 2010-03-02 Adc Telecommunications, Inc. Apparatus for directing heat to a heat spreader
JP4643703B2 (ja) * 2008-11-21 2011-03-02 株式会社東芝 半導体装置の固定具及びその取付構造
JP2010212612A (ja) * 2009-03-12 2010-09-24 Kyocera Corp 基地局装置の放熱構造
CN101907909A (zh) * 2009-06-05 2010-12-08 鸿富锦精密工业（深圳）有限公司 具有固定孔的主板
JP5371101B2 (ja) * 2009-06-11 2013-12-18 エヌイーシーコンピュータテクノ株式会社 冷却装置及びそれを用いたコンピュータ装置
DE102009054517B4 (de) * 2009-12-10 2011-12-29 Robert Bosch Gmbh Elektronisches Steuergerät
CN102645956A (zh) * 2011-02-21 2012-08-22 鸿富锦精密工业（深圳）有限公司 计算机装置
CN103025119A (zh) * 2011-09-22 2013-04-03 富瑞精密组件（昆山）有限公司 散热装置
CN103124488A (zh) * 2011-11-21 2013-05-29 鸿富锦精密工业（深圳）有限公司 散热组件
TWI465887B (zh) * 2012-01-05 2014-12-21 Acer Inc 電子裝置
US9169856B2 (en) * 2012-02-02 2015-10-27 Asia Vital Components Co., Ltd. Fastening structure for thermal module
US20140043768A1 (en) * 2012-08-09 2014-02-13 Advanced Micro Devices, Inc. Package retention frame
TWI486830B (zh) * 2012-10-11 2015-06-01 E Ink Holdings Inc 觸控感測器
GB2508402B (en) * 2012-11-30 2015-05-27 Control Tech Ltd A mount for electrical equipment
JP3184248U (ja) * 2013-04-08 2013-06-20 アルプス電気株式会社 電子回路モジュールのカバー構造
US10104758B2 (en) * 2014-02-21 2018-10-16 Ati Technologies Ulc Heat sink with configurable grounding
JP6256136B2 (ja) * 2014-03-24 2018-01-10 株式会社デンソー 空調装置
US9420734B2 (en) * 2014-04-01 2016-08-16 Advanced Micro Devices, Inc. Combined electromagnetic shield and thermal management device
EP2933833A1 (de) * 2014-04-16 2015-10-21 Thomson Licensing Elektromagnetische Abschirmungsvorrichtung
US9818669B2 (en) * 2014-08-06 2017-11-14 Honeywell International Inc. Printed circuit board assembly including conductive heat transfer
JP6421050B2 (ja) 2015-02-09 2018-11-07 株式会社ジェイデバイス 半導体装置
CN205389320U (zh) * 2016-03-23 2016-07-20 乐视控股（北京）有限公司 一种散热屏蔽装置
EP3440906B1 (de) * 2016-04-04 2021-07-21 Commscope Technologies LLC Systeme und verfahren zur wärmeverwaltung für emv-abgeschirmte elektronische vorrichtungen mit hoher leistungsdichte
US10306806B2 (en) 2017-01-12 2019-05-28 Samtec, Inc. Cage with an attached heatsink
US10236232B2 (en) 2017-01-19 2019-03-19 Advanced Micro Devices, Inc. Dual-use thermal management device
JP2018132700A (ja) * 2017-02-16 2018-08-23 住友電気工業株式会社 光トランシーバ
US10631438B2 (en) * 2017-12-23 2020-04-21 International Business Machines Corporation Mechanically flexible cold plates for low power components
WO2020206675A1 (en) * 2019-04-12 2020-10-15 Nokia Shanghai Bell Co., Ltd. Heat dissipation
US10674646B1 (en) * 2019-10-25 2020-06-02 Aliner Industries Inc. EMI shield with increased heat dissipating effect
CN116153882A (zh) * 2020-11-10 2023-05-23 华为技术有限公司 一种散热组件、电子设备及芯片封装结构
KR102515014B1 (ko) * 2020-12-02 2023-03-29 주식회사 텔레칩스 자연 대류 유도형 방열판 및 이를 구비한 반도체 패키지
US12464680B2 (en) * 2022-07-07 2025-11-04 Plume Design, Inc. Compact electronic device with a top heat spreader
JP7683969B1 (ja) * 2024-02-22 2025-05-27 Ｎｅｃプラットフォームズ株式会社 熱伝導部品および電子機器
US20250311180A1 (en) * 2024-03-29 2025-10-02 Intel Corporation Electromagnetic interference shield extending underneath memory modules

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
SE9401203L (sv) * 1994-04-11 1995-10-12 Ellemtel Utvecklings Ab Skärm och kylare
US5796170A (en) * 1996-02-15 1998-08-18 Northern Telecom Limited Ball grid array (BGA) integrated circuit packages
US6144557A (en) * 1999-04-09 2000-11-07 Lucent Technologies, Inc. Self-locking conductive pin for printed wiring substrate electronics case
US6205026B1 (en) * 2000-01-31 2001-03-20 Intel Corporation Heat sink retention components and system
US6430043B1 (en) * 2000-10-30 2002-08-06 Intel Corporation Heat sink grounding unit
US20030067757A1 (en) * 2001-10-05 2003-04-10 Richardson Patrick J. Apparatus and method for shielding a device

Also Published As

Publication number Publication date
CN1802747A (zh) 2006-07-12
US7053295B2 (en) 2006-05-30
DE602004028464D1 (de) 2010-09-16
KR101099260B1 (ko) 2011-12-28
CN1802747B (zh) 2010-07-21
TWI310673B (en) 2009-06-01
US20040257786A1 (en) 2004-12-23
JP2004363385A (ja) 2004-12-24
TW200505327A (en) 2005-02-01
EP1634331B1 (de) 2010-08-04
EP1634331A1 (de) 2006-03-15
KR20060008996A (ko) 2006-01-27
JP4469563B2 (ja) 2010-05-26
WO2004109800A1 (en) 2004-12-16

Similar Documents

Publication Publication Date Title
ATE476753T1 (de) Electronische einrichtung, informationsprozessor und anordnung zum unterdrücken von elektromagnetischen störungen
ATE348350T1 (de) Erdung von einer gedruckten schaltung eingestellt in einen armband elektronischen gerät
DE602008003166D1 (de) Abschirmungs- und wärmeableitungsvorrichtung
SE9702923L (sv) Monteringsstruktur för en effekttransistormodul
RU2007114033A (ru) Полевой прибор с печатной платой в сборе в качестве экрана для защиты от воздействий окружающей среды и от эмп/радиопомех
WO2004077898A3 (en) Methods and devices for connecting and grounding an emi shield to a printed circuit board
DE602005018255D1 (de) Signalmodul mit verminderter rückstrahlung
TW200618689A (en) Circuit device and manufacture method for circuit device
ZA202310015B (en) Electronic device including heat dissipation structure
MY134550A (en) Electronic circuit device for fishing equipment
ATE327102T1 (de) Abschirmelement für elektromagnetische wellen und aufzeichnungsgerät mit einer solchen einrichtung
ATE474279T1 (de) Einrichtung zur abschirmung vor störungen aus elektrischen geräten
ATE383711T1 (de) Kommunikationsvorrichtung mit abgeschirmten mikrophon
ATE230554T1 (de) Elektrisches bauteil und elektrischer schaltungsmodul mit verbundenen erdungsflächen
SE9702027D0 (sv) A Shielding housing and methods of producing a shielding housing
FI20035178A7 (fi) Häiriösuojattu matkaviestin sekä vastaava menetelmä ja järjestely matkaviestimen häiriösuojauksessa
TW572584U (en) EMI suppression device
ATE411765T1 (de) Staubsauger mit einer spannungsfrei gehaltenen leiterplatte
TW200607411A (en) Wiring board and method of manufacturing wiring board
TW200601956A (en) Emi shielding electronic device
SE9900429D0 (sv) Arrangement for an electric apparatus
DE502004001565D1 (de) Elektronisches Gerät mit einer abgeschirmten Kammer
TW200721707A (en) Electromagnetic shield for an electronic device
SE0302208D0 (sv) Internal Antenna Arrangement
TW200709777A (en) Electronic devices and heat sink for preventing electromagnetic interference thereof

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties