ATE397275T1 - Transistoren und speicherkondensatoren enthaltend eine hfo2-zusammensetzung mit erhöhter dielektrizitätskonstante - Google Patents
Transistoren und speicherkondensatoren enthaltend eine hfo2-zusammensetzung mit erhöhter dielektrizitätskonstanteInfo
- Publication number
- ATE397275T1 ATE397275T1 AT03447146T AT03447146T ATE397275T1 AT E397275 T1 ATE397275 T1 AT E397275T1 AT 03447146 T AT03447146 T AT 03447146T AT 03447146 T AT03447146 T AT 03447146T AT E397275 T1 ATE397275 T1 AT E397275T1
- Authority
- AT
- Austria
- Prior art keywords
- hfo2
- composition
- transistors
- increased
- storage capacitors
- Prior art date
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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- H10D1/60—Capacitors
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/693—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
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- Metallurgy (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Memories (AREA)
- Formation Of Insulating Films (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
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- Inorganic Insulating Materials (AREA)
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38748702P | 2002-06-10 | 2002-06-10 |
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| Country | Link |
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| US (2) | US7183604B2 (de) |
| EP (1) | EP1372160B1 (de) |
| JP (1) | JP4614639B2 (de) |
| AT (1) | ATE397275T1 (de) |
| DE (1) | DE60321271D1 (de) |
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| JP6147480B2 (ja) | 2012-09-26 | 2017-06-14 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
| CN103065955B (zh) * | 2012-11-21 | 2015-11-18 | 中国科学院微电子研究所 | 一种利用ald制备栅介质结构的方法 |
| JP6067524B2 (ja) * | 2013-09-25 | 2017-01-25 | 株式会社東芝 | 半導体装置および誘電体膜 |
| US9331168B2 (en) | 2014-01-17 | 2016-05-03 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacuturing method of the same |
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| US9607842B1 (en) | 2015-10-02 | 2017-03-28 | Asm Ip Holding B.V. | Methods of forming metal silicides |
| US10727117B2 (en) * | 2017-11-20 | 2020-07-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Method for manufacturing semiconductor structure |
| US11555241B2 (en) * | 2018-07-03 | 2023-01-17 | Raytheon Technologies Corporation | Coating system having synthetic oxide layers |
| TW202200828A (zh) | 2020-06-24 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | 含鉬薄膜的氣相沉積 |
| CN115968501A (zh) * | 2020-07-16 | 2023-04-14 | 恩特格里斯公司 | 用于铁电存储器的无碳层压氧化铪/氧化锆膜 |
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| US3634113A (en) * | 1968-10-30 | 1972-01-11 | Larry L Fehrenbacher | Stabilized zirconium dioxide and hafnium dioxide compositions |
| WO1982003876A1 (en) * | 1981-04-29 | 1982-11-11 | Roy W Rice | Single-crystal partially stabilized zirconia and hafnia ceramic materials |
| DE3230216A1 (de) * | 1981-08-13 | 1983-08-04 | Ngk Spark Plug Co., Ltd., Nagoya, Aichi | Sinterkoerper mit hoher zaehigkeit |
| DE3905271A1 (de) * | 1989-02-21 | 1990-08-23 | Hoechst Ag | Siliziumnitrid-keramik und verfahren zu ihrer herstellung |
| KR20010030723A (ko) * | 1997-09-26 | 2001-04-16 | 인피니언 테크놀로지스 아게 | 연마제 및 반도체 기판을 평탄화하기 위한 그 용도 |
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| US6984591B1 (en) * | 2000-04-20 | 2006-01-10 | International Business Machines Corporation | Precursor source mixtures |
| US6528858B1 (en) * | 2002-01-11 | 2003-03-04 | Advanced Micro Devices, Inc. | MOSFETs with differing gate dielectrics and method of formation |
| US6645882B1 (en) * | 2002-01-17 | 2003-11-11 | Advanced Micro Devices, Inc. | Preparation of composite high-K/standard-K dielectrics for semiconductor devices |
| US6586349B1 (en) * | 2002-02-21 | 2003-07-01 | Advanced Micro Devices, Inc. | Integrated process for fabrication of graded composite dielectric material layers for semiconductor devices |
| US6693321B1 (en) * | 2002-05-15 | 2004-02-17 | Advanced Micro Devices, Inc. | Replacing layers of an intergate dielectric layer with high-K material for improved scalability |
-
2003
- 2003-06-10 DE DE60321271T patent/DE60321271D1/de not_active Expired - Lifetime
- 2003-06-10 US US10/459,360 patent/US7183604B2/en not_active Expired - Lifetime
- 2003-06-10 JP JP2003165399A patent/JP4614639B2/ja not_active Expired - Lifetime
- 2003-06-10 EP EP03447146A patent/EP1372160B1/de not_active Expired - Lifetime
- 2003-06-10 AT AT03447146T patent/ATE397275T1/de not_active IP Right Cessation
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2005
- 2005-05-06 US US11/124,303 patent/US20050202222A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US7183604B2 (en) | 2007-02-27 |
| JP4614639B2 (ja) | 2011-01-19 |
| DE60321271D1 (de) | 2008-07-10 |
| EP1372160A1 (de) | 2003-12-17 |
| US20050202222A1 (en) | 2005-09-15 |
| EP1372160B1 (de) | 2008-05-28 |
| JP2004161602A (ja) | 2004-06-10 |
| US20040028952A1 (en) | 2004-02-12 |
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