[go: up one dir, main page]

ATE396790T1 - Direkter auftrag von metallischen leitermustern auf isolierflächen - Google Patents

Direkter auftrag von metallischen leitermustern auf isolierflächen

Info

Publication number
ATE396790T1
ATE396790T1 AT03770492T AT03770492T ATE396790T1 AT E396790 T1 ATE396790 T1 AT E396790T1 AT 03770492 T AT03770492 T AT 03770492T AT 03770492 T AT03770492 T AT 03770492T AT E396790 T1 ATE396790 T1 AT E396790T1
Authority
AT
Austria
Prior art keywords
direct application
insulating surfaces
metallic particles
gas jet
metal conduct
Prior art date
Application number
AT03770492T
Other languages
English (en)
Inventor
Richard Gambino
Robert Greenlaw
Shaun Kubik
Jon Longtin
Joshua Margolies
Sanjay Sampath
Original Assignee
Univ New York State Res Found
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ New York State Res Found filed Critical Univ New York State Res Found
Application granted granted Critical
Publication of ATE396790T1 publication Critical patent/ATE396790T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Inorganic Insulating Materials (AREA)
AT03770492T 2002-12-17 2003-09-26 Direkter auftrag von metallischen leitermustern auf isolierflächen ATE396790T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43414102P 2002-12-17 2002-12-17

Publications (1)

Publication Number Publication Date
ATE396790T1 true ATE396790T1 (de) 2008-06-15

Family

ID=32713014

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03770492T ATE396790T1 (de) 2002-12-17 2003-09-26 Direkter auftrag von metallischen leitermustern auf isolierflächen

Country Status (6)

Country Link
US (1) US7208193B2 (de)
EP (1) EP1572377B1 (de)
AT (1) ATE396790T1 (de)
AU (1) AU2003278982A1 (de)
DE (1) DE60321381D1 (de)
WO (1) WO2004060579A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004047357A1 (de) * 2004-09-29 2006-04-06 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Elektrische Anordnung und Verfahren zum Herstellen einer elektrischen Anordnung
CN101479661B (zh) * 2005-03-23 2012-06-06 艾格瑞系统有限公司 利用压印光刻和直接写入技术制造器件的方法
CN100413598C (zh) * 2006-06-30 2008-08-27 华中科技大学 一种电子浆料雾化沉积直写装置
WO2009020804A1 (en) * 2007-08-06 2009-02-12 Olzak James M Method of depositing electrically conductive material onto a substrate
US20090214772A1 (en) * 2008-02-27 2009-08-27 Seoul National University Industry Foundation Method and apparatus for coating powder material on substrate
JP2010047825A (ja) * 2008-08-25 2010-03-04 Mitsubishi Heavy Ind Ltd 金属皮膜の形成方法及び航空宇宙構造部材
JPWO2010137286A1 (ja) * 2009-05-28 2012-11-12 パナソニック株式会社 焼成装置
US9023423B2 (en) * 2009-10-07 2015-05-05 General Electric Company Method of deposition of metallic coatings using atomized spray
EP2596152B1 (de) * 2010-07-15 2019-12-18 Commonwealth Scientific and Industrial Research Organisation Oberflächenbehandlung
CN102011123B (zh) * 2010-11-26 2012-07-04 华中科技大学 一种激光微熔覆专用设备
US8635767B2 (en) 2011-01-05 2014-01-28 Thoe Boeing Company System for depositing microwire
KR20140127802A (ko) * 2012-01-27 2014-11-04 엔디에스유 리서치 파운데이션 인쇄 마이크로 전자를 위한 마이크로 콜드 스프레이 직접 기록 시스템 및 방법
US9346550B2 (en) * 2012-12-05 2016-05-24 Mesoscribe Technologies, Inc. Ice detection and mitigation device
KR102866116B1 (ko) 2021-11-26 2025-09-30 삼성전자주식회사 반도체 패키지

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4931322A (en) * 1986-04-01 1990-06-05 Honda Giken Kogyo Kabushiki Method and apparatus for painting object
JP4248037B2 (ja) * 1997-02-04 2009-04-02 株式会社不二機販 金属被膜の形成方法
US6994894B2 (en) * 2000-04-20 2006-02-07 Vanderbilt University Method and system for thick-film deposition of ceramic materials
US6673386B2 (en) * 2000-06-29 2004-01-06 Matsushita Electric Industrial Co., Ltd. Method and apparatus for forming pattern onto panel substrate
US6592935B2 (en) * 2001-05-30 2003-07-15 Ford Motor Company Method of manufacturing electromagnetic devices using kinetic spray

Also Published As

Publication number Publication date
WO2004060579A1 (en) 2004-07-22
EP1572377B1 (de) 2008-05-28
EP1572377A1 (de) 2005-09-14
US20060068087A1 (en) 2006-03-30
AU2003278982A1 (en) 2004-07-29
US7208193B2 (en) 2007-04-24
DE60321381D1 (de) 2008-07-10
EP1572377A4 (de) 2006-03-15

Similar Documents

Publication Publication Date Title
ATE396790T1 (de) Direkter auftrag von metallischen leitermustern auf isolierflächen
EP1239717A3 (de) Platte zur elektromagnetischen Abschirmung und deren Herstellungsverfahren
WO2006131912A3 (en) Microelectrode, applications thereof and method of manufacturing
EA200501238A1 (ru) Способ изготовления электропроводящего рисунка
DE60238979D1 (de) Penningentladungsplasmaquelle
WO2002009484A3 (en) Electrical component assembly and method of fabrication
EP1344843A3 (de) Filmherstellungsmethode und Substrat
ATE369574T1 (de) Detektor zur erfassung von teilchenstrahlen und verfahren zur herstellung desselben
DE502004007078D1 (de) Dünnschichtanordnung und verfahren zum herstellen einer solchen dünnschichtanordnung
TW200516688A (en) Electrostatic holder for substrate stage, and the electrode used therein, and the processing system having the same
TW200518246A (en) Substrate and method for manufacturing the same
AU2003246887A8 (en) Application of a coating forming material onto at least one substrate
MY147419A (en) Apparatus for the removal of a metal oxide from a substrate and methods therefor
GB2369932A (en) Environmentally-sealed electronic assembly and method of making same
PL1641572T3 (pl) Laserowe usuwanie warstwy lub powłoki z podłoża
TWI340666B (en) Spray electrode
NO20053334D0 (no) Pulverbeleggingsapparat og metode.
GB2339726B (en) Marking diamond
JP2008515667A5 (de)
TWI263318B (en) An electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
CA2465195A1 (en) Electrode assembly for the removal of surface oxides by electron attachment
AU5888798A (en) New process for modification of surfaces
CA2454809A1 (en) Method and apparatus for initiating welding arc using plasma jet
SE9904318D0 (sv) Method and device for electrospray ionisation
DE69903506D1 (de) Verfahren für die Verbesserung der Haftung von metallischen Partikeln auf einen Kohlenstoffsubstrat

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties