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ATE357058T1 - Vorrichtung und methode zur gehäuseverwerfungs- kompensation mit einem integrierten wärmeverteiler - Google Patents

Vorrichtung und methode zur gehäuseverwerfungs- kompensation mit einem integrierten wärmeverteiler

Info

Publication number
ATE357058T1
ATE357058T1 AT02778816T AT02778816T ATE357058T1 AT E357058 T1 ATE357058 T1 AT E357058T1 AT 02778816 T AT02778816 T AT 02778816T AT 02778816 T AT02778816 T AT 02778816T AT E357058 T1 ATE357058 T1 AT E357058T1
Authority
AT
Austria
Prior art keywords
integrated heat
heat spreader
distress
compensation
housing
Prior art date
Application number
AT02778816T
Other languages
English (en)
Inventor
Thomas Fitzgerald
Carl Deppisch
Fay Hua
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE357058T1 publication Critical patent/ATE357058T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Warping, Beaming, Or Leasing (AREA)
AT02778816T 2001-12-21 2002-11-07 Vorrichtung und methode zur gehäuseverwerfungs- kompensation mit einem integrierten wärmeverteiler ATE357058T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/023,720 US6848172B2 (en) 2001-12-21 2001-12-21 Device and method for package warp compensation in an integrated heat spreader

Publications (1)

Publication Number Publication Date
ATE357058T1 true ATE357058T1 (de) 2007-04-15

Family

ID=21816807

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02778816T ATE357058T1 (de) 2001-12-21 2002-11-07 Vorrichtung und methode zur gehäuseverwerfungs- kompensation mit einem integrierten wärmeverteiler

Country Status (8)

Country Link
US (3) US6848172B2 (de)
EP (1) EP1461831B1 (de)
CN (1) CN100397630C (de)
AT (1) ATE357058T1 (de)
AU (1) AU2002340453A1 (de)
DE (1) DE60218898T2 (de)
MY (1) MY138750A (de)
WO (1) WO2003058714A2 (de)

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JP2006522491A (ja) * 2003-04-02 2006-09-28 ハネウエル・インターナシヨナル・インコーポレーテツド 熱相互接続および界面システム、製造方法、およびその使用方法
JP2007527105A (ja) * 2003-06-06 2007-09-20 ハネウエル・インターナシヨナル・インコーポレーテツド 熱連結システムとその製造方法
EP1731002A4 (de) * 2004-03-30 2010-05-26 Honeywell Int Inc Wärmeverteilungskonstruktionen, integrierte schaltkreise, verfahren zur erzeugung von wärmeverteilungskonstruktionen und verfahren zur erzeugung integrierter schaltkreise
US7205651B2 (en) * 2004-04-16 2007-04-17 St Assembly Test Services Ltd. Thermally enhanced stacked die package and fabrication method
US7161122B2 (en) * 2004-06-24 2007-01-09 Intel Corporation Assembly packaging using induction heating
US20070001291A1 (en) * 2005-06-30 2007-01-04 Infineon Technologies Ag Anti-warp heat spreader for semiconductor devices
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US8395254B2 (en) * 2006-03-30 2013-03-12 Stats Chippac Ltd. Integrated circuit package system with heatspreader
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US8497162B1 (en) 2006-04-21 2013-07-30 Advanced Micro Devices, Inc. Lid attach process
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US7513035B2 (en) * 2006-06-07 2009-04-07 Advanced Micro Devices, Inc. Method of integrated circuit packaging
US7651938B2 (en) * 2006-06-07 2010-01-26 Advanced Micro Devices, Inc. Void reduction in indium thermal interface material
US20080124840A1 (en) * 2006-07-31 2008-05-29 Su Michael Z Electrical Insulating Layer for Metallic Thermal Interface Material
US7544542B2 (en) * 2006-08-07 2009-06-09 Advanced Micro Devices, Inc. Reduction of damage to thermal interface material due to asymmetrical load
US20080128897A1 (en) * 2006-12-05 2008-06-05 Tong Wa Chao Heat spreader for a multi-chip package
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US8297986B2 (en) * 2007-03-16 2012-10-30 Globalfoundries Inc. Integrated circuit socket
US7633151B2 (en) * 2007-03-16 2009-12-15 Advanced Micro Devices, Inc. Integrated circuit package lid with a wetting film
US8678271B2 (en) * 2007-06-26 2014-03-25 Globalfoundries Inc. Method for preventing void formation in a solder joint
US7737550B2 (en) * 2007-08-30 2010-06-15 International Business Machines Corporation Optimization of electronic package geometry for thermal dissipation
US8952511B2 (en) * 2007-12-18 2015-02-10 Intel Corporation Integrated circuit package having bottom-side stiffener
CN101500391B (zh) * 2008-01-29 2012-08-29 瑞鼎科技股份有限公司 散热组件、包含散热组件的芯片及芯片散热组件制备方法
US7928562B2 (en) * 2008-07-22 2011-04-19 International Business Machines Corporation Segmentation of a die stack for 3D packaging thermal management
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US9142480B2 (en) * 2008-08-15 2015-09-22 Intel Corporation Microelectronic package with high temperature thermal interface material
US7961469B2 (en) * 2009-03-31 2011-06-14 Apple Inc. Method and apparatus for distributing a thermal interface material
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US8567483B2 (en) * 2009-11-06 2013-10-29 International Business Machines Corporation Heatsink with flexible base and height-adjusted cooling fins
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Also Published As

Publication number Publication date
EP1461831A2 (de) 2004-09-29
US20070020813A1 (en) 2007-01-25
AU2002340453A1 (en) 2003-07-24
DE60218898D1 (de) 2007-04-26
WO2003058714A3 (en) 2003-10-16
US20050139998A1 (en) 2005-06-30
MY138750A (en) 2009-07-31
WO2003058714A2 (en) 2003-07-17
CN100397630C (zh) 2008-06-25
CN1620724A (zh) 2005-05-25
US20030115739A1 (en) 2003-06-26
DE60218898T2 (de) 2008-01-17
US7102226B2 (en) 2006-09-05
EP1461831B1 (de) 2007-03-14
US7256058B2 (en) 2007-08-14
US6848172B2 (en) 2005-02-01

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