[go: up one dir, main page]

NO20053151D0 - Fremgangsmate for a produsere mikrosystemer. - Google Patents

Fremgangsmate for a produsere mikrosystemer.

Info

Publication number
NO20053151D0
NO20053151D0 NO20053151A NO20053151A NO20053151D0 NO 20053151 D0 NO20053151 D0 NO 20053151D0 NO 20053151 A NO20053151 A NO 20053151A NO 20053151 A NO20053151 A NO 20053151A NO 20053151 D0 NO20053151 D0 NO 20053151D0
Authority
NO
Norway
Prior art keywords
microsystems
producing
producing microsystems
Prior art date
Application number
NO20053151A
Other languages
English (en)
Other versions
NO20053151L (no
Inventor
Reiner Gotzen
Original Assignee
Reiner Gotzen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reiner Gotzen filed Critical Reiner Gotzen
Publication of NO20053151D0 publication Critical patent/NO20053151D0/no
Publication of NO20053151L publication Critical patent/NO20053151L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H01L2224/16148—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked the bump connector connecting to a bonding area protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/7665—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0101—Neon [Ne]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Printing Methods (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
NO20053151A 2003-01-17 2005-06-28 Fremgangsmate for a produsere mikrosystemer. NO20053151L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10301612 2003-01-17
PCT/DE2003/000419 WO2004070835A1 (de) 2003-01-17 2003-02-13 Verfahren zur herstellung von mikrosystemen

Publications (2)

Publication Number Publication Date
NO20053151D0 true NO20053151D0 (no) 2005-06-28
NO20053151L NO20053151L (no) 2005-10-14

Family

ID=32841572

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20053151A NO20053151L (no) 2003-01-17 2005-06-28 Fremgangsmate for a produsere mikrosystemer.

Country Status (13)

Country Link
US (1) US8042267B2 (no)
EP (1) EP1586117B1 (no)
JP (1) JP4567466B2 (no)
KR (1) KR100756104B1 (no)
CN (1) CN100435331C (no)
AU (1) AU2003214001B2 (no)
CA (1) CA2513127C (no)
DE (1) DE10394193D2 (no)
IS (1) IS7981A (no)
NO (1) NO20053151L (no)
RU (1) RU2323504C2 (no)
TW (1) TWI221827B (no)
WO (1) WO2004070835A1 (no)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006008332B4 (de) * 2005-07-11 2009-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit
WO2008153674A1 (en) * 2007-06-09 2008-12-18 Boris Kobrin Method and apparatus for anisotropic etching
US8182982B2 (en) * 2008-04-19 2012-05-22 Rolith Inc Method and device for patterning a disk
US8518633B2 (en) 2008-01-22 2013-08-27 Rolith Inc. Large area nanopatterning method and apparatus
CN101911249A (zh) * 2008-01-22 2010-12-08 罗利诗公司 大面积纳米图案化方法和设备
US8192920B2 (en) 2008-04-26 2012-06-05 Rolith Inc. Lithography method
US20110210480A1 (en) * 2008-11-18 2011-09-01 Rolith, Inc Nanostructures with anti-counterefeiting features and methods of fabricating the same
AU2011293834A1 (en) 2010-08-23 2013-02-28 Rolith, Inc. Mask for near-field lithography and fabrication the same
US9398694B2 (en) 2011-01-18 2016-07-19 Sony Corporation Method of manufacturing a package for embedding one or more electronic components
US9763370B2 (en) 2013-03-15 2017-09-12 National Technology & Engineering Solutions Of Sandia, Llc Apparatus for assembly of microelectronic devices
RU2602835C9 (ru) * 2015-05-13 2017-02-02 Акционерное общество "Концерн радиостроения "Вега" Способ экранирования в электронном модуле

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3712735A (en) * 1970-09-25 1973-01-23 Amp Inc Apparatus for photo etching
US4069916A (en) * 1976-06-01 1978-01-24 Western Electric Co., Inc. Tape for holding electronic articles
US4383363A (en) * 1977-09-01 1983-05-17 Sharp Kabushiki Kaisha Method of making a through-hole connector
DE3925455A1 (de) * 1989-08-01 1991-02-14 Robert Hanus Belichtungsvorrichtung zum belichten eines metallkaschierten basismaterials
RU2012090C1 (ru) * 1991-05-22 1994-04-30 Научно-исследовательский институт физических проблем им.Ф.В.Лукина Способ формирования межсоединений в матрице трехмерных полупроводниковых элементов
DE4223371A1 (de) * 1992-07-16 1994-01-20 Thomson Brandt Gmbh Verfahren und Platine zur Montage von Bauelementen
JPH06140461A (ja) * 1992-10-29 1994-05-20 Fujitsu Ltd 半導体チップの実装方法および実装構造体
DE4420996C2 (de) 1994-06-16 1998-04-09 Reiner Dipl Ing Goetzen Verfahren und Vorrichtung zur Herstellung von mikromechanischen und mikrooptischen Bauelementen
JP3726985B2 (ja) * 1996-12-09 2005-12-14 ソニー株式会社 電子部品の製造方法
US5869395A (en) * 1997-01-22 1999-02-09 Lsi Logic Corporation Simplified hole interconnect process
DE19721170A1 (de) * 1997-05-21 1998-11-26 Emtec Magnetics Gmbh Verfahren und Vorrichtung zum Herstellen eines Films oder einer Schicht mit beidseitiger Oberflächenstruktur
US6833613B1 (en) * 1997-12-18 2004-12-21 Micron Technology, Inc. Stacked semiconductor package having laser machined contacts
US6160714A (en) 1997-12-31 2000-12-12 Elpac (Usa), Inc. Molded electronic package and method of preparation
AU733522B2 (en) * 1998-01-28 2001-05-17 Thin Film Electronics Asa A method for generating electrical conducting and/or semiconducting structures in three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
DE19826971C2 (de) * 1998-06-18 2002-03-14 Reiner Goetzen Verfahren zum mechanischen und elektrischen Verbinden von Systembauteilen
DE19847088A1 (de) * 1998-10-13 2000-05-18 Ksw Microtec Ges Fuer Angewand Flächig ausgebildeter Träger für Halbleiter-Chips und Verfahren zu seiner Herstellung
FI990862L (fi) * 1999-04-16 2000-10-17 Jorma Kalevi Kivilahti Uusi elektroniikan juotteeton valmistusmenetelmä
JP2001237512A (ja) * 1999-12-14 2001-08-31 Nitto Denko Corp 両面回路基板およびこれを用いた多層配線基板ならびに両面回路基板の製造方法
JP3553043B2 (ja) * 2001-01-19 2004-08-11 松下電器産業株式会社 部品内蔵モジュールとその製造方法
DE10144579C2 (de) 2001-08-07 2003-12-04 Reiner Goetzen Verfahren und Vorrichtung zur Herstellung von Fein- bis Mikrostrukturen und/oder komplexen Mikrosystemen
WO2010144579A2 (en) 2009-06-10 2010-12-16 Baker Hughes Incorporated Source compensated formation density measurement method by using a pulsed neutron generator

Also Published As

Publication number Publication date
RU2323504C2 (ru) 2008-04-27
TWI221827B (en) 2004-10-11
EP1586117B1 (de) 2014-06-18
JP4567466B2 (ja) 2010-10-20
CA2513127A1 (en) 2004-08-19
EP1586117A1 (de) 2005-10-19
NO20053151L (no) 2005-10-14
TW200413245A (en) 2004-08-01
KR20050091785A (ko) 2005-09-15
JP2006513581A (ja) 2006-04-20
RU2005126055A (ru) 2006-01-10
IS7981A (is) 2005-08-15
AU2003214001B2 (en) 2007-08-02
US8042267B2 (en) 2011-10-25
CN1735965A (zh) 2006-02-15
CA2513127C (en) 2010-03-30
CN100435331C (zh) 2008-11-19
US20060072295A1 (en) 2006-04-06
KR100756104B1 (ko) 2007-09-05
AU2003214001A1 (en) 2004-08-30
WO2004070835A1 (de) 2004-08-19
DE10394193D2 (de) 2005-12-01

Similar Documents

Publication Publication Date Title
ITBO20030403A1 (it) Macchina ginnica.
FI20031904L (fi) Menetelmä lignoselluloosatuotteen muokkaamiseksi
ITMI20030803A1 (it) Procedimento per piegare un pezzo in lavorazione.
IS2979B (is) Aðferð til að framleiða N-útskipt 2-sýanópýrrólídín
FI20031558L (fi) Menetelmä käyttäjän autentikoimiseksi
DE50212441D1 (de) Produktionsmaschine
NO20053151D0 (no) Fremgangsmate for a produsere mikrosystemer.
FI20030383L (fi) Menetelmä katalyytin valmistamiseksi
FI20031903L (fi) Menetelmä kuitutuotteen valmistamiseksi
FI20030288A0 (fi) Menetelmä aaltopahvin valmistamiseksi
ITRA20030024A1 (it) Macchina ginnica.
NO20040634D0 (no) En smiprosess
ITMO20030004A0 (it) Macchina utensile.
BR0305250B1 (pt) mÁquina operada a motor.
ITTO20040422A1 (it) Punzonatrice per oggetti piani
DE10394362D2 (de) Method for the operation of a technical system
ES1055752Y (es) Maquina envasadora de palillos.
NO20034790L (no) Fremgangsmate for a forbedre produksjon for en bronn
SG116494A1 (en) Process for producing w-mercaptoalkylpyridine.
IS8088A (is) Aðferð til að framleiða imídasópýridín-8-ón
FI20021421A0 (fi) Valmistusmenetelmä
ITVI20020225A1 (it) Procedimento per realizzare un appendino bimateriale.
ITPD20030185A1 (it) Macchina multifunzionale particolarmente per vivaismo.
DK2324979T3 (da) Fremgangsmåde til fremstilling af en præform
FI20020805A0 (fi) Menetelmä antrasykliinien tuottamiseksi

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application