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NL2036311B1 - Connector assembly - Google Patents

Connector assembly Download PDF

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Publication number
NL2036311B1
NL2036311B1 NL2036311A NL2036311A NL2036311B1 NL 2036311 B1 NL2036311 B1 NL 2036311B1 NL 2036311 A NL2036311 A NL 2036311A NL 2036311 A NL2036311 A NL 2036311A NL 2036311 B1 NL2036311 B1 NL 2036311B1
Authority
NL
Netherlands
Prior art keywords
connector assembly
signal line
dielectric layer
flexible planar
planar circuit
Prior art date
Application number
NL2036311A
Other languages
Dutch (nl)
Inventor
Jua Bosman Sal
De Groot Jesse
Martinus Gerard Bos Wouter
Original Assignee
Delft Circuits B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delft Circuits B V filed Critical Delft Circuits B V
Priority to NL2036311A priority Critical patent/NL2036311B1/en
Priority to PCT/EP2024/082699 priority patent/WO2025108880A1/en
Application granted granted Critical
Publication of NL2036311B1 publication Critical patent/NL2036311B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the printed circuit board [PCB] or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Summary The invention relates to a connector assembly for connecting to an electronic device, the connector assembly comprising: a support member (2) provided with a ridge (3), and a flexible planar circuit (4). The flexible planar circuit comprises a first dielectric layer (5) provided with a first signal line (6) in a first direction transverse to the ridge at a first side of the first dielectric layer directed away from the ridge. The flexible planar circuit further comprises a connection portion with a first portion of the signal line (3). The ridge is arranged to deform the planar flexible circuit to connect the first portion of the first signal line (6) to a 10 first contact (7) of the electronic device (8), When the connector assembly is connected to the electronic device. Fig. lb

Description

Connector assembly
Field of the invention
The invention relates to a connector assembly for connecting electronic devices.
Background
The known connector assembly can be applied for connecting an external electronic control device to a cryogenic electronic system. The cryogenic electronic system may comprise, for example, qubit devices, quantum processors, sensing and detector systems, quantum internet apparatus, medical devices, cryptographic devices, classical computing processors, and any other electronic devices.
However, there are many other applications using cryogenic electronic circuits, such as multi- pixel superconducting photon detectors used in astronomy and quantum communication applications.
Cryogenic cooling equipment is provided for maintaining the cryogenic electronic circuits at the required operating temperature of near zero Kelvin. This cryogenic cooling equipment is often built up from a stack of separated temperature stages, wherein each lower stage is cooled down to a lower temperature. Due to the fundamentals of thermodynamics, the power required to progressively cool down to lower temperatures increases exponentially. For example, a typical cryogenic cooling equipment consumes 20-30 kW for managing a thermal load of 12-18 uW at 100 mK.
The electronic control device is typically placed outside the cryogenic equipment to prevent their power dissipation from heating up the cryogenic equipment as a whole and thus the cryogenic circuits as well. Therefore, a communication path is required for exchanging signals between cryogenic circuits at the final stage of the cryogenic equipment, through the top of the cryogenic equipment to the outside control electronics. Such path is typically constructed from a cascade of semi rigid transmission lines, usually coax cables, to bridge the distance and to intercept mechanical tension and vibrations during the cooling down procedure and operation.
Cryogenic circuits, such as the qubit devices, require communication with the external control device for controlling the qubits and signaling back an actual state of each qubit to be to the control device. This requires also high frequency, HF, analogue signals. Typically, this signal can be in the range from low frequencies or DC to ultrahigh frequencies up to the infrared or visible wavelength ranges. 1
Recent cryogenic qubit devices have an increasing number of qubits. Each qubit requires individual communication to the control device outside the cryogenic device. This individual communication requires an increasing number of transmission lines for the qubits.
For example, the qubit device can comprise 96 qubits and requires at least 288 individual transmission lines that should be guided through subsequent thermal stages to the outside. The transmission lines may comprise several coax connectors, for example, for bridging the consecutive stages of the cryogenic equipment. So, when the number of transmission lines increases, the total number of coax connectors in the transmission lines to bridge each stage is also increasing and relatively more space in the subsequent stages is required to accommodate for this increased number of coax connectors and may become a limiting condition for a further increase in numbers of qubits. The coax cables can be replaced by the flexible planar circuit to reduce the volume of the connector. For example, eight coax cables can be replaced by a flexible planar circuit comprising a dielectric layer provided with eight channels or signal lines and a conducting layer or ground layer provided at one or opposite sides of the dielectric layer. The flexible planar circuit can be connected to the cryogenic device via known connectors, for example, SubMiniature version A, SubMiniature Push on, SMP, or
SubMiniature Push on Micro, SMPM. A problem may occur in that the dimensions of the connector having multiple SMA or SMPMs increases as the number of channels or signal lines increases. Reducing the dimensions of the connector may give rise to deterioration of the transmitted signals and crosstalk between signal lines. Another problem is that the characteristics of the signal lines may not be constant due to temperature changes of the connector assembly.
Summary of the invention
It is therefore an object of the invention to mitigate the above indicated problems.
According to the invention this and other objects are achieved by a connector assembly for connecting to an electronic device comprising a support member provided with a ridge, a flexible planar circuit comprising a first dielectric layer, a first signal line arranged in a first direction transverse to the ridge at a first side of the first dielectric layer directed away from the ridge, wherein a connection portion of the flexible planar circuit is provided with a first portion of the signal line and the ridge is arranged to deform the flexible planar circuit to connect the first portion of the first signal line to a first contact of the electronic device, when the connector assembly is connected to the electronic device. This arrangement allows a compact, flexible, and robust connection between the first signal line and the electronic 2 device. The ridge can be shaped such that the connecting portion of flexible planar circuit is folded around the ridge such that the first signal line is at the outer side of the flexible planar circuit with respect to the ridge and is connected to the first contact of the electronic device.
This arrangement enables a perpendicular arrangement of the connector assembly with respect to a plane of the electronic device comprising the first contact. Furthermore, this arrangement enables a compact extension of the number of signal lines in the connector assembly when multiple flexible planar circuits are applied and/or the flexible planar circuit comprises multiple first signal lines. For example, this connector assembly can be used to connect an 8x8 array of contacts of a 64 channel qubit device or a 32 x32 array of contacts for a Ik channel qubit device.
In an further embodiment of the connector assembly the flexible planar circuit further comprises a second dielectric layer at the first signal line and the first side of the first dielectric layer, wherein the flexible planar circuit is provided with a first opening at the connection portion through the second dielectric layer arranged to open the first portion of the first signal line. In this arrangement the first signal line is covered at both side with the first dielectric layer and the second dielectric layer.
In a further embodiment of the connector assembly the first opening is provided with a first via arranged to connect the first portion to the first contact of the electronic device. In this arrangement the contact surfaces of the electronic device can be about the same height or level. The first via can be a so called buried via. An advantage of the use of the first via is that it prevents delamination of the flexible planar circuit.
In a further embodiment of the connector assembly the flexible planar circuit further comprises a first conducting layer at a first side of the second dielectric layer, directed away from the first dielectric layer, the ridge is arranged to connect the first conducting layer to a second contact of the electronic device, when the connector assembly is connected to the electronic device. In this arrangement the flexible planar circuit comprises a microstrip formed by the first conducting layer, the first and/or second dielectric layer, that enables transfer of high frequency signals up to the infrared and visible wavelength ranges. The connector assembly connects the microstrip to the electronic device and enables transfer of high frequency signals up to the infrared and visible wavelength ranges.
In a further embodiment of the connector assembly, the flexible planar circuit comprises a second conducting layer at a second side of the first dielectric layer opposite to the first side and a second via through the first dielectric layer in the connection portion of the flexible planar circuit, the second via is arranged to connect the second conducting layer to 3 the second contact of the electronic device, when the connector assembly is connected to the electronic device. In this arrangement the flexible planar circuit comprises a microstrip formed by the second conducting layer, the first and/or second dielectric layer, that enables transfer of high frequency signals up to microwave frequencies.
Also, a strip line can be formed when the first and the second conducting layers are present. The stripline also enables transfer of high frequency signals up to the infrared and visible wavelength ranges. The stripline also enables improved transmission characteristics.
The advantage of this second via is that this second via also reduces delamination of the flexible planar circuit.
In a further embodiment of the connector assembly, the first signal line is arranged in a first end portion of the first dielectric layer, the first portion of the first signal line is an end portion of the first line at the connection portion, a second signal line (15) 1s provided, at the first side of the first dielectric layer in a second direction transverse to the ridge at another end portion of the first dielectric layer, opposite to the first end portion, an end portion of the second signal line is arranged in the connection portion, the end portion of the second signal line is separated at a distance d from the end portion of the first signal line, the ridge is further arranged to connect the end portion of the second signal line (15) to a third contact (16) of the electronic device, when the connector assembly is connected to the electronic device. In this arrangement the first signal line and the second signal lines start at opposite ends of the flexible planar circuit. In this arrangement the number of signal lines of the connector assembly can be further increased. In an embodiment the opening is arranged to open the end portion of the second signal line.
In a further embodiment the flexible planar circuit is provided with a third via in the second dielectric layer, the third via is connected to the end portion of the second signal line and the ridge is further arranged to connect the second signal line to the third contact of the electronic device through the third via, when the connector assembly is connected to the electronic device. The third via can also be a buried via.
In a further embodiment of the connector assembly the second via is located between the end portions of the first signal line and the second signal line. One or more second vias can be located between the end portions of the respective first and second signal line. The second vias can be located at a line perpendicular to a line between the end portions of the first and second signal lines.
This arrangement of second vias reduces electro- magnetic interference between the first signal line and second signal line. 4
In a further embodiment of the connector assembly, the ridge comprises a resilient member. The resilient member can be spring, for example a flat spring or a leaf spring.
Advantageously, the ridge and the spring can be made of a metal. For example, a beryllium copper alloy. Furthermore, the ridge and the spring can be integrally formed. This arrangement enables an economic manufacturing of the connector assembly.
In a further embodiment of the connector assembly the connector assembly further comprises a shield comprising an absorbing material to absorb ingressing radiation from the outside from DC to beyond visible light frequencies. This arrangement reduces ingressing radiation that may enter the electronic device.
In a further embodiment of the connector assembly the connector assembly comprises a magnetic field shield configured to shield a portion of the flexible planar circuit inside the connector. The magnetic field shield may comprise a u-metal or a superconducting material or alternating cascading of these materials. The magnetic field shield reduces magnetic disturbances on the flexible planar circuit in the connector and the connected electronic device.
In a further embodiment of the connector assembly the connector assembly is provided with a light photon barrier arranged to reduce light photon transport through the flexible planar circuit. Light photons may enter an electronic circuit comprising the qubits through the flexible planar circuit. The transferred light photons may negatively influence the qubits in the electronic device. The light photon barrier reduces transferred light photons through the flexible planar circuit to the qubits in the electronic device and thus may increase the coherence time of the qubits. The light photon barrier may comprise a bent portion of the flexible planar substrate. The bent portion transfers only a portion of light photons through the planar flexible transmission line, multiple bents or arches further reduces the amount of transferred light photons. The connector assembly can be provided with a channel to bend the flexible planar circuit.
The invention further relates to an electronic device comprising the connector assembly. The electronic device may comprise an electronic control circuit and a cryogenic electronic circuit. The connector assembly can be applied for communication between the electronic control circuit and the cryogenic circuit.
These and other features and effects of the present invention will be explained in more detail below with reference to drawings in which preferred and illustrative embodiments of the invention are shown. The person skilled in the art will realize that other alternatives and 5 equivalent embodiments of the invention can be conceived and reduced to practice without departing from the scope of the present invention.
Brief description of the drawings
Fig 1A shows a bottom view of a connector assembly according to an embodiment of this disclosure;
Fig. 1B shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 1C shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 2A shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 2B shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 2C shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 3A shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 3B shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 4A shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 4B shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 5 shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 6 shows a cross-section of a connector assembly according to an embodiment of this disclosure;
Fig. 7 shows a cross-section of a connector assembly according to an embodiment of this disclosure; and
Fig. 8 shows a cross-section of a connector assembly according to an embodiment of this disclosure.
Detailed description of embodiments 6
In the figures like numerals refer to similar components. The invention is explained with reference to Figs. 1-8.
The connector assembly can be used for connection of a flexible planar circuit to a cryogenic device, for example, a cryogenic electronic circuit at a temperature of about 1 mK.
The cryogenic electronic circuit can be a qubit device or an astronomic electronic circuit or other scientific instruments.
Fig. 1A shows diagrammatically a bottom view of a connector assembly 1 according to an embodiment of this disclosure. The bottom view shows a support member 2, a ridge 3 and a flexible planar circuit comprising a first dielectric layer 5 (not shown) and a first signal line 6 of the connector assembly 1.
Fig 1B shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 in Fig. 1A. The support member 2 can be made of a block of polyethene. The dimensions of the support member can be for example, 4 x 1 x0.2cm, L x Wx T. The ridge 3 can be machined on a short edge of the block. The ridge can have a semi- circular or rectangular section and can be adapted to a convenient shape for assembly and a sufficient electrical contact. In an embodiment the outer surface of the support member 2 and the ridge 3 can be provided with a metal layer, for example aluminum or silver. In an embodiment the support member can be made of metal, for example beryllium copper. In an embodiment the ridge comprises a resilient member. The resilient member can be a spring, for example, a flat spring or a leaf spring. Advantageously, the ridge and the spring can be made of a metal. For example, a beryllium copper alloy. Furthermore, the ridge and the spring can be integrally formed. This arrangement enables an economic manufacturing of the connector assembly.
The first signal line 6 is provided at a first side of the first dielectric layer 5 in a first direction transverse to the ridge 3, for example, along a longitudinal axis of the flexible planar circuit. The first signal line 6 has a width of e.g., 0.15 mm and a thickness of 0.002 mm. The first signal line 6 is made of silver Ag. Also, gold Au, copper Cu, Aluminum Al or platinum
Pt can be applied. A connection portion of the flexible planar circuit 4 is arranged at the ridge 3. The connection portion comprises a first end of the first signal line 6. In this embodiment the flexible planar circuit 4 is bent partially around the ridge 3, such that the first signal line 6 is facing away from the ridge. In this disclosure the connecting portion is the portion of the 7 flexible planar circuit that can be bent around the ridge 3 when the connector assembly is connected to the electronic device. The ridge 3 connects the first end portion of the first signal line 6 to the first contact 7 of the electronic device 8, when the connector assembly 1 is connected to the electronic device 8. The skilled person in the field will understand that the electrical connection can be formed by capacitive, inductive or galvanic coupling. In this embodiment the flexible planar circuit 4 is folded around the ridge 3. In embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance in the range between 300 pm and 1 mm, for example, 350 um on the first side of the first dielectric layer 5.
The flexible planar circuit can be provided with a second dielectric layer 9. In this arrangement a first opening is provided through the second dielectric layer 9 at the connection portion. The first opening is arranged to open the first portion of the first signal line 6. The dimensions of the opening are such that that the first signal line 6 can be connected to the first contact 7 of the electronic device 8. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3.
Furthermore, in an embodiment the connector assembly comprises a shield (not shown) comprising absorbing material to absorb ingressing radiation from the outside from
DC to beyond visible light frequencies.
In an embodiment the connector assembly can comprise a magnetic field shield (not shown) to shield a portion of the connector assembly. The magnetic field shield can comprise u- metal or a superconductor. The superconductor can be, for example Niobium Nb, Niobium
Titanium NbTi, NiobiumTitantumnitride, NbTiN, or Indium, In. The planar flexible circuit 4 can have rectangular geometry with a length of e.g., 100 mm or 200 mm or 500 mm and a width of e.g., 4 mm. The first dielectric layer 5 can for example be polyimide or
Polytetrafluorethylene, PTFE, or Ethylene tetrafluoride ethylene, ETFE. The thickness of the first dielectric layer can be, for example, 0.15 mm.
Fig. 1C shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 of Fig. 1B according to an embodiment of this disclosure. In this embodiment the first opening is provided with a first via 12 in the connection portion of the flexible planar circuit. In this embodiment the ridge 3 connects the signal line 6 to the first contact 7 though the first via 12.
Fig. 2A shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 of Fig. 1B according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5 and the first signal line 6 of the 8 flexible planar circuit 4 are like those of the flexible planar circuit as described with reference the fig. 1B. Furthermore, the flexible planar circuit 4 is provided with a second dielectric layer 9 at the first signal line 6 and the first dielectric layer 5. The second dielectric layer 9 can be like the first dielectric layer 5. Furthermore, the flexible planar substrate is provided with a first conducting layer 10 at an opposite side of the second dielectric layer 9 facing away from the first side of the first dielectric layer 5. The first conducting layer 10 is made of silver Ag.
Also, gold Au, copper Cu, Aluminum or platinum Pt can be applied. The thickness of the first conducting layer is in the range from 100 nm to 18 um, for example 2 um for a silver-layer.
In an embodiment the first conducting layer 10 comprises a superconductor, for example one of Niobium Nb, Niobium Titanium NbTi, NiobiumTitaniumnitride, NbTiN, and Indium, In.
In an embodiment the first conducting layer comprise a resistive film, for example, one of
Nichrome, NiCr, Carbon C and IndiumTinOxide, ITO. The first opening in the second dielectric layer 9 is not covered with the first conducting layer 10. In this embodiment the flexible planar circuit 4 is bent partially around the ridge 3 such that the first signal line 6 and the first conducting layer 10 are faced away from the ridge when the connector assembly is connected to the electronic device. The ridge 3 of the connector assembly connects the first end portion of the first signal line 6 to the first contact 7 of the electronic device 8 and the first conducting layer 10 to a second contact 11 of the electronic device respectively, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3.
In embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance between 300 um and 1 mm, for example, 350 um on the first side of the first dielectric layer S. In this embodiment the flexible planar circuit comprises a microstrip formed by the first dielectric layer, the first signal line, the second dielectric layer and the first conducting layer. The connector assembly connects the microstrip to the electronic device and enables transfer of high frequency signals up to the infrared and visible ranges. The multiple first signal lines can be used either as signal lines or as grounding line. For example, such that each signal lines are separated by a grounding line.
Fig. 2B shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the second dielectric layer 9, the first conducting layer 10 and the first signal line 6 of the flexible planar circuit are like those of the flexible planar circuit is as described with reference to Fig. 2A. In this embodiment the first opening in the flexible planar circuit 4 comprises a first via 12 through the second 9 dielectric layer 9 at the connection portion of the flexible planar circuit and connected with the first signal line 6. This first via can be a well-known buried via. The first via 12 can have a diameter in the range between 10 and 100 um, for example 50 um. The ridge 3 connects respectively the first signal line 6 to the first contact 7 through the first via 12 and the first conducting layer 10 to the second contact 11, when the connector assembly is connected to the electronic device. In this arrangement a microstrip is formed by the first conducting layer 10, the signal line 6 and the first and second dielectric layers 5,9. The connector assembly connects the microstrip to the electronic device and enables transfer of high frequency signals up to infrared and visible wavelength ranges. An advantage of this arrangement is that the contact surfaces of the contacts 7,11 of the electronic device 8 can be about the same height or level. In embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance between 300 u and 1 mm on the first side of the first dielectric layer 5. For example, the number of signal lines can be 8, 16 or more.
In embodiments the flexible transmission circuits can have multiple first and second dielectric layers wherein the first signal lines are arranged between the first and second dielectric layer respectively.
Fig. 2C shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the second dielectric layer 9 and the first signal line 6 of the flexible planar circuit are like those of the flexible planar circuit is as described with reference to Fig. 2A. In this embodiment the flexible planar circuit 4 is provided with a second conducting layer 13 at a second side of the first dielectric layer 5 opposite to the first side. Furthermore, the flexible planar circuit comprises a second via 14 in the first dielectric layer 5 and the second dielectric layer 9 in the connection portion of the flexile planar circuit. The second via 14 is connected to the second conducting layer 13. The ridge 3 connects the first signal line 6 to the first contact 7 through the first opening and the second conducting layer 13 to the second contact 11 through the second via 14, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3.
In this arrangement a microstrip is formed by the second conducting layer 13, the signal line 6 and the first and second dielectric layers 5,9. The connector assembly connects the microstrip to the electronic device and enables transfer of high frequency signals up to infrared and visible wavelength ranges. 10
In embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance between 300 u and 1 mm on the first side of the first dielectric layer 5. For example, the number of signal lines can be 8, 16 or more.
Fig. 2D shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the second dielectric layer 9, the first signal line 6, the second conducting layer 13 and the second via’s 14 of the flexible planar circuit are like those of the flexible planar circuit is as described with reference to Fig. 2C. Furthermore, in this embodiment the flexible planar circuit 4 comprises a first conducting layer 10. In this embodiment the first opening comprises the first via 12 provided in the second dielectric layer 9 at the connection portion of the flexible planar circuit. The second conducting layer 13 is connected to the first conducting layer 10 through the second via 14.
The ridge 3 connects respectively the first signal line 6 to the first contact 7 via the first via 12 and the second conducting layer 13 to the second contact 11 via the second via 14, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3.
An advantage of this arrangement is that the contact surfaces of the contacts 7,11 of the electronic device 8 can be about the same height or level.
In embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance between 300 um and 1 mm, for example, 350 um on the first side of the first dielectric layer 5. In this embodiment the flexible planar circuit comprises a microstrip formed by the first dielectric layer, the firs signal line, the second dielectric layer and the first conducting layer. The connector assembly connects the microstrip to the electronic device and enables transfer of high frequency signals up to infrared and visible wavelength ranges. The multiple first signal lines can be used either as signal lines or as grounding line. For example, such that each signal lines are separated by a grounding line.
Fig. 3A shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the second dielectric layer 9, the second conducting layer 13, the signal line 6 and the second via’s 14 are like those of the flexible planar circuit as described with reference to Fig. 2C. Furthermore, in this embodiment the flexible planar circuit is also provided with the first conducting layer 10 at a first side of the second dielectric layer 9 directed away from the first dielectric layer 5. The first opening in the second dielectric layer 9 at the connection portion is not covered with the first 11 conducting layer 10. The ridge 3 connects respectively the first signal line 6 to the first contact 7 of the electronic device 8, the first conducting layer 10 and the second conducting layer 13 to the second contact 11 of the electronic device through the second via 14, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3.
In this embodiment the flexible planar circuit comprises a stripline formed by the two conducting layers 10,13, the signal line 6 and the first and second dielectric layer 5,9. This stripline enables transfer of high frequency signals up to the infrared and visible wavelength ranges. Furthermore, in embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance in the range between 300 u and 1 mm, for example, 350 um on the first side of the first dielectric layer 5. The multiple first signal lines can be used either as a signal line or as grounding line. In an embodiment the signal lines and the groundlines are alternately arranged besides each other.
Fig. 3B shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the second dielectric layer 9, the first conducting layer 10, the second conducting layer 13 and the signal line 6 and the second vias 14 are like those of the flexible planar circuit as described with reference to Fig. 3A.
Furthermore, the first opening in the second dielectric layer 9 is provided with the first via 12 in the connection portion. The ridge 3 connects respectively the first signal line 6 to the first contact 7 of the electronic device 8 through the first via 12, and the first conducting layer 10 and the second conducting layer 13 to the second contact 11 of the electronic device through the second via 14, when the connector assembly is connected to the electronic device.
Also, in this embodiment the flexible planar circuit comprises a stripline formed by the two conducting layers 10,13, the signal line 6 and the first and second dielectric layer 5,9. The connector assembly connects the stripline to the electronic device and enables transfer of high frequency signals up to infrared and visible wavelength ranges.
An advantage of this arrangement is that the contact surfaces of the contacts 7,11 of the electronic device 8 can be about the same height or level. Furthermore, in embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance in the range between 300 um and 1 mm, for example, 350 um on the first side of the first dielectric layer 5. The multiple first signal lines can be used either as a signal line or as grounding line.
In an embodiment the signal lines and the groundlines are alternately arranged besides each other. 12
Fig. 4A shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5 is like the first dielectric layer as described with reference to Fig. 1B. Furthermore, in this embodiment the first signal line 6 is arranged at the first side of the first dielectric layer in a first end portion of the first dielectric layer 5. Furthermore, a second signal line 15 is provided at the first side of the first dielectric layer 5 in a second direction transverse to the ridge 3 at the other end portion at the first side of the first dielectric layer, opposite to the first end portion. In this embodiment the first signal line 6 is in line with the second signal line 15. The end portion of the first signal line 6 is in the connection portion of the flexible planar circuit and an end portion of the second signal line 15 is also located in the connecting portion. The end portion of the second signal line15 is separated at a distance d from the end portion of first signal line 6. Furthermore, the ridge 3 connects respectively the first signal line 6 to the first contact 7 and the second signal line 15 to a third contact 16 of the electronic device 8, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3.
An advantage of this arrangement is that the number of signal lines on the flexible substrate can be further increased.
Fig. 4B shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the first signal line 6 and second signal line 15 are like those as those of the flexible planar circuit as described with reference to Fig. 4A.
Furthermore, in this embodiment this flexible planar circuit is provided with a second dielectric layer 9 at the first side of the first dielectric layer, the second dielectric layer 9 is provided with a first opening in the connection portion. Furthermore, a first conducting layer 10 is provided at the second dielectric layer at a first side facing away from the first dielectric layer 9, a second conducting layer 13 is provided at the second side of the first dielectric layer 5 opposite to the first side and a second via 14 is provided through the first dielectric layer
Sand the second dielectric layer 9. The second via connects the first conducting layer 10 and the second conducting layer 13. The first opening comprises a first via 12 and a third via 17 in the connection portion of the second dielectric layer 9. The third via 17 can a buried via.
In this embodiment the ridge 3 connects respectively the first signal line 6 to the first contact 7 through the first via 12 and the second signal line 15 to a third contact 16 of the 13 electronic device 8 through the third via 17, and the first conducting layer 10 and the second conducting layer 13 to the second contacts 11 through the second vias 14, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit 4 1s folded around the ridge 3.
In this embodiment the flexible planar circuit comprises two striplines formed respectively by the two conducting layers 10,13, the signal lines 6 15 and the first and second dielectric layer 5,9. The connector assembly connects the striplines to the electronic device and enables transfer of high frequency signals up to infrared and visible wavelength ranges.
In embodiments multiple first signal lines 6 and second signal lines 15 can be arranged besides each other with a mutual distance in the range between 300 um and | mm, for example 350 um on the first side of the first dielectric layer 5. The multiple first signal lines 6 and second signal line 15 can be used either as a signal line or as grounding line. In an embodiment signal lines and groundline are alternately arranged besides each other.
Fig 5 shows diagrammatically a bottom view of the flexible planar circuit 4. In this embodiment the flexible planar is like the flexible planar circuit is as described with reference to Fig. 4B provided with a first signal line 6 and a second signal line 15. Furthermore, the first via 12 is connected to the end of the first signal line 6 and the third via 17 is connected to the end of the second signal line 15. Furthermore, the flexible planar circuit is provided with second vias 14 at both faces of the end of the first signal line 6 and the end of the second signal line 15 through the first dielectric layer and the second dielectric layer at the connection portion. The second via 14 connects the first conducting layer 12 and the second conducting layer 13. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3.
This arrangement of second vias reduces electro- magnetic interference with the first signal line.
Fig. 6 shows diagrammatically a bottom view of the flexible planar circuit 4 according to an embodiment of this disclosure. In this embodiment the flexible planar is like the flexible planar circuit is as described with reference to Fig. S. Furthermore, in this embodiment the flexible planar circuit is provided with four first signal lines 6 and four second signal lines 15.
Furthermore, in the connection portion the end of the first signal lines 6 are provided with first vias 12 and the ends of the second signals 15 are provided with third vias 17.
Furthermore, second vias 14 are provided between the ends of the first signal line 6 and the ends of the second signal lines 15 to connect the first conducting layer 10 and the second conducting layer 13. This arrangement of the second vias reduces crosstalk between the first signal lines and second signal lines. 14
Fig. 7 shows diagrammatically a side view of a connector assembly according to an embodiment of this disclosure. In this embodiment the support member 2 is provided with four ridges 3 and four flexible planar circuits 4. The flexible planar circuits are stacked beside each other in the connector assembly. The flexible planar circuits 4 are bent in a loop, so that the connecting portions are bent around the ridges 3. The ends of the first signal lines and the second signal lines of the flexible planar circuits 4 can be connected to control devices or other peripheral devices. Furthermore, each flexible planar circuits can be provided with multiple first signal lines and multiple second signal lines. The number of first signals lines are, for example, 8 and the number of second signal lines are, for example, 8. In this embodiment each flexible planar circuit comprises 16 signal lines and the connector assembly has 64 signal lines in total. The number of signals in the connector assembly can be further extended by either increasing of the number of flexible planar circuits or the number of signal lines per flexible planar circuits.
In an embodiment the connector assembly is provided with a shield 19 comprising an absorbing material arranged to absorb ingressing radiation from the outside from DC to beyond visible light frequencies. The absorbing material can be conducting particles, resistive particles or carbon powder in a binding material or thermo-setting material.
In an embodiment the connector assembly is provided with a magnetic field shield 20 arranged to magnetically shield the connector assembly. The magnetic field shield comprises a superconducting material or u-metal. The superconducting material can be one of Niobium
Nb, Niobium Titanium NbTi, NiobiumTitaniumnitride, NbTiN, and Indium, In.
Fig. 8 shows diagrammatically a side view of a connector assembly according to an embodiment of this disclosure. The connector assembly 1 comprises a support member 2 provided with a ridge 3 and a flexible planar circuit 4. Furthermore, the support member 2 comprises a light photon barrier. The light photon barrier is provided with a channel 18. The channel is provided with 4 corners. Furthermore, the flexible planar circuit 4 is folded in the channel 18 and around the ridge 3. In this embodiment the light photon barrier reduces EM radiation that may enter the flexible planar circuit 4 from the outside of the connector assembly and that is transferred through the flexible planar circuit to the electronic device.
This EM-radiation can have a wavelength up to infra-red ranges and visible light ranges.
Although illustrative embodiments of the present invention have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to these embodiments. Various changes or modifications may be affected by one skilled in the art without departing from the scope or the spirit of the invention as defined in 15 the claims.
Accordingly, reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention.
Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment.
Furthermore, it is noted that the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
16

Claims (16)

ConclusiesConclusions 1. Een connectorsamenstel (1) voor het verbinden aan een elektronische inrichting omvattende: een steunlichaam (2) met een nok (3); een buigzame vlakke schakeling (4) omvattende een eerste diëlektrische laag (5); een eerste signaallijn (6) ingericht in een eerste richting dwars op de nok op een eerste zijde van de eerste diëlektrische laag gericht vanaf de nok; waarbij een verbindingsdeel van de buigzame vlakke schakeling is voorzien van een eerste deel van de signaallijn (3) en de nok is ingericht om de buigzame platte schakeling te vervormen om het eerste deel van de eerste signaallijn (6) te verbinden met een eerste contact (7) van een elektronische inrichting (8), wanneer het connectorsamenstel is verbonden met de elektronische inrichting. (Fig. 1B)1. A connector assembly (1) for connecting to an electronic device comprising: a support body (2) having a boss (3); a flexible planar circuit (4) comprising a first dielectric layer (5); a first signal line (6) arranged in a first direction transverse to the boss on a first side of the first dielectric layer directed from the boss; a connecting portion of the flexible planar circuit comprising a first portion of the signal line (3) and the boss being arranged to deform the flexible planar circuit to connect the first portion of the first signal line (6) to a first contact (7) of an electronic device (8), when the connector assembly is connected to the electronic device. (Fig. 1B) 2. Het connectorsamenstel volgens conclusie 1, waarbij de buigzame vlakke schakeling (4) verder een tweede diëlektrische laag (9) omvat op de eerste signaallijn (6) en de eerste zijde van de eerste diëlektrische laag (5), waarbij de tweede diëlektrische laag is voorzien van een eerste opening op het verbindingsdeel door de tweede diëlektrische laag ingericht om het eerste deel van de signaallijn open te leggen. (Fig. 2A)2. The connector assembly of claim 1, wherein the flexible planar circuit (4) further comprises a second dielectric layer (9) on the first signal line (6) and the first side of the first dielectric layer (5), the second dielectric layer having a first opening on the connecting portion through the second dielectric layer adapted to expose the first portion of the signal line. (Fig. 2A) 3. Het connectorsamenstel volgens conclusie 2, waarbij de eerste opening een eerste via (12) omvat ingericht on het eerste deel met het eerste contact (7) van de elektrische inrichting (8) te verbinden. (Flg. 2B)3. The connector assembly of claim 2, wherein the first opening comprises a first via (12) adapted to connect the first portion to the first contact (7) of the electrical device (8). (Fig. 2B) 4. Het connectorsamenstel volgens conclusie 2 of 3, waarbij de buigzame vlakke schakeling een eerste geleidende laag (10) omvat op een eerste zijde van de tweede diëlektrische laag (9), gericht vanaf de eerste diëlektrische laag (5), waarbij de nok(3) is ingericht om de eerste geleidende laag (10) te verbinden met een tweede contact (11) van de elektronische inrichting, wanneer het connectorsamenstel is verbonden met de elektronische schakeling. (Fig 2A,2B)4. The connector assembly according to claim 2 or 3, wherein the flexible planar circuit comprises a first conductive layer (10) on a first side of the second dielectric layer (9), facing away from the first dielectric layer (5), the boss (3) being adapted to connect the first conductive layer (10) to a second contact (11) of the electronic device, when the connector assembly is connected to the electronic circuit. (Fig 2A,2B) 5. Het connectorsamenstel volgens een van de conclusies 1-4, waarbij de buigzame vlakke schakeling een tweede geleidende laag (13) op een tweede zijde van de eerste diëlektrische laag (5) tegenover de eerste zijde en een tweede via (14) omvat door de eerste diëlektrische laag {5) in het verbindingsdeel van de buigzame vlakke schakeling, waarbij de tweede via is 17 ingericht om de tweede geleidende laag (13) te verbinden met een tweede contact (11) van de elektronische inrichting door de tweede via (14), wanneer het connectorsamenstel is verbonden met de elektronische schakeling. (Fig. 2C,2D,3A,3B)5. The connector assembly according to any of claims 1 to 4, wherein the flexible planar circuit comprises a second conductive layer (13) on a second side of the first dielectric layer (5) opposite the first side and a second via (14) through the first dielectric layer (5) in the connecting portion of the flexible planar circuit, the second via being adapted to connect the second conductive layer (13) to a second contact (11) of the electronic device through the second via (14), when the connector assembly is connected to the electronic circuit. (Fig. 2C,2D,3A,3B) 6. Het connectorsamenstel volgens een van de conclusies 1-4, waarbij de eerste signaallijn (6} is ingericht op een eerste einddeel van de eerste diëlektrische laag (5), waarbij het eerste deel van de eerste signaallijn een einddeel is van de eerste lijn op het verbindingsdeel, een tweede signaallijn (15) is voorzien op de eerste zijde van de eerste diëlektrische laag (5) in een tweede richting dwars op de nok op een ander einddeel van de eerste diëlektrische laag, tegenover het eerste einddeel, waarbij een einddeel van de tweede signaallijn is ingericht in het verbindingsdeel, waarbij het einddeel van de tweede signaallijn gescheiden is door een afstand d van het einddeel van de eerste signaallijn, waarbij de nok verder is ingericht om het einddeel van de tweede signaallijn (15) te verbinden met een derde contact (16} van de elektronische inrichting, wanneer het connectorsamenstel is verbonden met de elektronische schakeling. (Fig.4A)6. The connector assembly according to any of claims 1 to 4, wherein the first signal line (6} is arranged on a first end portion of the first dielectric layer (5), the first portion of the first signal line being an end portion of the first line on the connecting portion, a second signal line (15) is provided on the first side of the first dielectric layer (5) in a second direction transverse to the ridge on another end portion of the first dielectric layer, opposite to the first end portion, an end portion of the second signal line being arranged in the connecting portion, the end portion of the second signal line being separated by a distance d from the end portion of the first signal line, the ridge being further arranged to connect the end portion of the second signal line (15) to a third contact (16} of the electronic device, when the connector assembly is connected to the electronic circuit. (Fig. 4A) 7. Het connectorsamenstel volgens conclusie 6 wanneer deze naar een van de conclusies 2-4 refereert, waarbij het buigzame vlakke circuit is voorzien van een derde via (17) door de tweede diëlektrische laag, waarbij de derde via is ingericht om het einddeel van de tweede signaallijn te verbinden met het derde contact (16).7. The connector assembly of claim 6 when referring to any of claims 2 to 4, wherein the flexible planar circuit comprises a third via (17) through the second dielectric layer, the third via being adapted to connect the end portion of the second signal line to the third contact (16). 8. Het connectorsamenstel volgens conclusie 6 of 7 wanneer deze naar conclusie 5 refereert, waarbij de tweede via (14) is gelegen tussen de einddelen van de eerste signaallijn (6) en de tweede signaallijn (15).8. The connector assembly according to claim 6 or 7 when referring to claim 5, wherein the second via (14) is located between the end portions of the first signal line (6) and the second signal line (15). 9. Het connectorsamenstel volgens een van de conclusies 1-8, waarbij de nok een elastisch deel omvat,9. The connector assembly according to any of claims 1 to 8, wherein the cam comprises an elastic portion, 10. Het connectorsamenstel volgens een van de conclusies 1-9, welke verder een afscherming omvat dat een absorberend materiaal omvat dat is ingericht om inkomende straling van buiten af te absorberen vanaf DC tot voorbij zichtbaar licht frequenties.10. The connector assembly of any of claims 1 to 9, further comprising a shield comprising an absorbing material configured to absorb incoming external radiation from DC to beyond visible light frequencies. 11. Het connectorsamenstel volgens een van de conclusies 1-10, welke verder een magnetisch veld afscherming omvat ingericht om een deel van het connectorsamenstel magnetisch af te 18 schermen.11. The connector assembly of any of claims 1 to 10, further comprising a magnetic field shield configured to magnetically shield a portion of the connector assembly. 12. Het connectorsamenstel volgens conclusie 11, waarbij de magnetisch veld afscherming een supergeleidend materiaal omvat.12. The connector assembly of claim 11, wherein the magnetic field shield comprises a superconducting material. 13. Het connectorsamenstel volgens conclusie 12, waarbij de magnetisch veld afscherming u- metaal omvat.13. The connector assembly of claim 12, wherein the magnetic field shield comprises u-metal. 14. Het connectorsamenstel volgens een van de conclusies 1-13, welke verder een lichtfotonbarrière omvat ingericht om lichtfotontransport naar de elektronische inrichting te reduceren.14. The connector assembly of any of claims 1 to 13, further comprising a light photon barrier configured to reduce light photon transport to the electronic device. 15. Het connectorsamenstel volgens conclusie 14, waarbij de lichtfotonbarrière een gebogen deel omvat van de buigzame vlakke schakeling. 15. The connector assembly of claim 14, wherein the light photon barrier comprises a curved portion of the flexible planar circuit. 16, Een elektronisch systeem welke een connectorsamenstel volgens een van de conclusies 1-15 omvat 1916, An electronic system comprising a connector assembly according to any one of claims 1-15 19
NL2036311A 2023-11-20 2023-11-20 Connector assembly NL2036311B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5229916A (en) * 1992-03-04 1993-07-20 International Business Machines Corporation Chip edge interconnect overlay element
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US20210037646A1 (en) * 2019-07-30 2021-02-04 Wuhan China Star Optoelectronics Technology Co., Ltd. Flexible printed circuit board and display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5229916A (en) * 1992-03-04 1993-07-20 International Business Machines Corporation Chip edge interconnect overlay element
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US20210037646A1 (en) * 2019-07-30 2021-02-04 Wuhan China Star Optoelectronics Technology Co., Ltd. Flexible printed circuit board and display device

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