NL2027698B1 - Sensor module for insulating glazing structures - Google Patents
Sensor module for insulating glazing structures Download PDFInfo
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- NL2027698B1 NL2027698B1 NL2027698A NL2027698A NL2027698B1 NL 2027698 B1 NL2027698 B1 NL 2027698B1 NL 2027698 A NL2027698 A NL 2027698A NL 2027698 A NL2027698 A NL 2027698A NL 2027698 B1 NL2027698 B1 NL 2027698B1
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- glazing
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Classifications
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- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/66—Units comprising two or more parallel glass or like panes permanently secured together
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- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/66—Units comprising two or more parallel glass or like panes permanently secured together
- E06B3/663—Elements for spacing panes
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- Engineering & Computer Science (AREA)
- Civil Engineering (AREA)
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- Joining Of Glass To Other Materials (AREA)
Abstract
An inter-pane sensor module for an insulating glazing unit (IGU) is described wherein the module comprises: a support structure arranged to be fixated to the spacer 5 structure of the IGU; a first thermal contact structure connected to the support structure, the first thermal contact structure being configured to thermally connect an inner surface of a first glazing of the IGU with a first thermal sensor; a radio module arranged on the support structure to transmit sensor data to a receiver external to the IGU; and, a spring structure arranged to mechanically press the first thermal contact structure against the inner surface of 10 the first glazing of the IGU when the sensor module is arranged between the first glazing and a second glazing of the IGU.
Description
NL31428 — Vi/Td Sensor module for insulating glazing structures
FIELD OF THE INVENTION This disclosure relates to a sensor module, in particular to a sensor module for insulating glazing structures, an insulating glazing structure comprising such sensor modules, a spacer structure for an insulating glazing structure comprising such sensor modules and methods and systems for determining parameters of insulating glazing structures based on such sensor modules, and a computer program product for executing such methods.
BACKGROUND High-performance multi-pane insulating glazing units (IGUs) are currently deployed for realizing zero-energy buildings and smart building solutions. The production of IGUs require careful specification of each element in production process to accurately control characteristics such as heat gain losses, transparency (glare), shading, thermal comfort, acoustics, color effects, etc. so that high-performance of the glazing structure is guaranteed over a long period (e.g. 10 years or longer). Currently such IGUs are also provided with photovoltaic cells and sensors located between the windowpanes. For example, WO2019/081784 describes an example of a ‘smart’ IGU including photovoltaic and a sensor modules positioned between the glass panes and electronic connections to the outside for both power and data communication. A facade of such IGUs can e.g. be used to harvest energy, collect data and control a building, e.g. its climate, based on the collected data.
IGUs comprising various inter-pane sensors are known in the art. US2019/0243207 describes a network of self-contained electro-chromatic (EC) IGUS. A controller external to the IGU controls the EC IGU based on light sensors. The EC IGU may be self-powered using a photovoltaic cell or panel as a power source. Similarly, EP2341490 describes IGU structures comprising different sensors, such as a moisture sensor, pressure wave sensor and temperature sensor and evaluation electronics for evaluating sensor signals to determine if the integrity of an IGU is compromised because of a burglary or the like. These sensor configurations however are not suitable for measuring important parameters associated with an IGU for example thermal parameters such as the heat transfer coefficient (or thermal transmittance). The heat transfer coefficient is also known in the field as the “U-value” or the “R-value” (R-value = 1/ U-value), which defines the amount of heat that transfers through the IGU per unit of time per unit of surface area per unit of temperature difference between both sides of the object (in SI units W/(m?-K)). It provides an indication of resistance against heat flow of a glazing structure and thus a measure for its insulating properties. A lower U-value indicates better insulating properties.
Accurate determination of parameters associated with an IGU, such as the heat transfer through an IGU and the heat transfer coefficient for a particular IGU is challenging. The actual heat transfer coefficient of a window installed in a building's facade may differ from the heat transfer coefficient that is mentioned in the technical specifications of the window. Typically, a manufacturer measures the heat transfer coefficient of only a small selection of produced windows, in a laboratory setting. However, in situ, the circumstances are different and vary in. Additionally, the heat transfer coefficient of a window may also depend on the circumstances during the window's fabrication, the fabrication parameters and the installation of the IGU. For example, temperature variations during the fabrication of a batch of window structures may already cause the respective heat transfer coefficients of the window structures to differ from each other.
WO2016/191408A1 discloses a heat flux sensor configured to generate a signal that is indicative of the heat flux through a laminated window pane based on a difference between a voltages generated by thermocouple junctions. A heat sensor is mounted on a thin flexible substrate and connected to two metal pads, one on each side of the flexible substrate. The flexible substrate is folded around a PVB laminate and this assembly is subsequently laminated between two glazings of a laminated glazing structure. The sensor requires a flexible substrate with metallized vias through the substrate and metal contact pads on both sides of the substrate. This design does not provide a reliable integrated in-situ heat flux sensor for an IGU which is compatible with the stringent production requirements of an IGU.
Hence, from the above there is a need for improved sensor modules for IGUs and IGUs comprising such sensor module for enabling smart window and building applications. In particular, there is a need in the art for IGUs comprising a heat transfer sensor that enable dynamic determination of heat flux and heat transfer coefficient of an insulating glazing structure.
SUMMARY It is an object of the invention to reduce or eliminate one or more drawbacks known from the prior art. In a first aspect, the invention relates to an inter-pane sensor module for an insulating glazing unit (IGU) wherein the IGU comprises a support structure arranged to be fixated to the spacer structure of the IGU; a first thermal contact structure connected to the support structure, the first thermal contact structure being configured to thermally connect an inner surface of a first glazing of the IGU with a first thermal sensor; a radio module arranged on the support structure to transmit sensor data to a receiver external to the IGU; and, a spring structure arranged to mechanically press the first thermal contact structure against the inner surface of the first glazing of the IGU when the sensor module is arranged between the first glazing and a second glazing of the IGU.
In an embodiment, the sensor module may further comprise: a second thermal contact structure connected to the support structure, the second thermal contact being configured to thermally connect an inner surface of the second glazing of the IGU with a second thermal sensor, wherein the spring structure is arranged to mechanically press the second thermal contact structure against the inner surface of the second glazing of the IGU.
Hence, the invention provides the sensor module allows accurate determination of thermal properties of an IGU, such as heat flux through the IGU and temperature differences between the inner and outer glazing of the IGU. Sensor data may be transmitted to a receiver, e.g. a gateway, external to the IGU.
In an embodiment, the support structure may have an elongated structure, eg. a elongated (flexible) strip, wherein the backside of the support structure may comprise fixating means to fixate the sensor module onto a spacer structure of the IGU. The sensor module may be implemented as narrow elongate strip comprising the sensor, the sensor electronics, the thermal contacts and a radio module.
In an embodiment, the fixating means includes a mechanical fixation structure to mechanically fixate the sensor module onto the spacer, preferably the mechanical fixation structure including one or more screws, a clamping or a click structure, a rivet nut structure, etc.; and/or, wherein the fixating means includes a chemical fixation structure, preferably the chemical fixation structure including e.g. a glue, adhesive, tape, etc.
In an embodiment, the sensor module may further comprise a processor arranged to control the radio module to transmit the sensor data to the receiver external to the IGU, preferably the radio module being a wireless radio communication module such as a RFID, Bluetooth, Zigbee, Wi-Fi or a LoRaWan module and/or a power line communication (PLC) module. radio modules of the sensor modules may form wireless nodes of a low power wireless data network, such as a long range wide area network (LoRaWan). These networks are particular suitable for low power data communication in machine-to-machine {Internet-of- Things) applications.
In an embodiment, the sensor module may further comprise an antenna structure, preferably a thin-film antenna structure arranged on a printed circuit board (PCB), connected to the radio module, the spring structure being arranged to press the antenna structure against an inner surface of the first and/or second glazing of the IGU.
In an embodiment, the sensor module may further comprise a power generating device, e.g. one or more photovoltaic cells and/or a power storage device, e.g.
one or more rechargeable (super)capacitors, arranged on the support structure, for providing power to the controller and the wireless radio module.
The sensor modules described with reference to the embodiments in this application are configured to be used inside the IGU, which typically is a vacuum sealed space which in many cases has no electrical wiring to the outside of the IGU. Hence, preferably, the sensor module for the IGU is configured to be self-supporting in terms of power and has means for wireless communication with a base station exterior to the IGU. To be self-supporting the sensor module may include a power generating device, e.g. one or more photo-voltaic cells that can be used to charge a rechargable capacitor or a battery. In an embodiment, so-called super capacitors or hybrid capacitors may be used for energy storage. Such capacitors are particularly suitable for use as a power source for a sensor module as described with reference to the embodiments in this application. These capacitors have an improved response to high temperatures when compared to conventional Lithium- lon batteries. Further, these capacitors have a longer lifetime, up to millions of cycles, compared to Lithium-lon batteries. Moreover, these capacitors are designed for quick energy bursts, which are needed for RF Wide-spectrum communication. Embodiments of the sensor modules, IGUs comprising a sensor module and methods for determining parameters using such sensor module are described hereunder in more detail.
In an embodiment, the first thermal sensor may be a heat flux sensor and/or the second thermal sensor may be a temperature sensor.
In an embodiment, the heat flux sensor may include a thermally insulating substrate, e.g. a polyamide, having a first and second side and a plurality of electrically connected thermocouple junctions provided on the first and second side, the spring structure being arrange to press one side of the thermally insulating substrate to the inner surface of the first glazing.
In an embodiment, the sensor module may be configured to determine one or more thermal parameters of the IGU, preferably an R-value or a U-value, based on a temperature difference between the first and second glazing and a heat flux transmitted through the IGU. In an embodiment, the sensor module may further include a light sensor, a humidity sensor, a pressure sensor, and/or an accelerometer.
In an aspect, the invention may relate to a spacer structure for an IGU comprising an inter-pane sensor module according to any of the embodiments described above. In an embodiment, at least part of the inter-pane sensor module may be integrated into the spacer structure.
In another aspect, the invention may relate to a system for processing sensor data of one or more insulating glass units (IGUs) comprising: a plurality of IGUs arranged in one or more facades of one or more buildings, wherein each or at least part of the IGUs may comprise an inter-pane sensor module according to any of the embodiments described above.
In an embodiment, the system may include one or more gateways configured to receive sensor data from the inter-pane sensor modules of the plurality of IGUs and to 5 send the sensor data to a server system configured to process the sensor data.
In an embodiment, the processing may include at least one of: determining a heat flow through one or more of the plurality of IGUs; determining a heat transfer coefficient, preferably the R or U value, of one or more of the plurality of IGUs; determining a pressure and/or moisture level for one or more of the plurality of IGUs; determining one or more thermal parameters, e.g. the heat flow and/or a heat transfer coefficient, associated with one or more of the plurality of IGUs and controlling a climate system of at least one of the one or more buildings based on the one or more thermal parameters.
In yet another aspect, the invention may related to an inter-pane sensor module for an IGU comprising: an elongated support structure arranged to be fixated to the spacer structure of the IGU; one or more sensors, a wireless radio module connected to an antenna structure, a power generating device, a power storage device and a sensor controller arranged on the support structure, the power generating device being configured to charge the power storage device, which is configured to power the sensor controller and the radio module configured to transmit sensor data generated by the sensor to a receiver external to the IGU.
In an embodiment, the support structure may further include a spring structure arranged to mechanically press the antenna structure, preferably a thin-film antenna structure, to an inner surface of a glazing of the IGU, when the sensor module is fixated on the spacer structure between the first and second glazing of the IGU.
In an embodiment, the support structure may further include an antenna support structure arranged to support the antenna structure to be substantial parallel to an inner surface of a glazing of the IGU, when the sensor module is fixated on the spacer structure between the first and second glazing of the IGU.
In an embodiment, the support structure may comprise an antenna structure arranged substantially perpendicular to surface of the support structure. In an embodiment, the support structure may include a raised edge, wherein the antenna structure is arranged against the raised edge.
In an embodiment, the one or more sensors may include at least one of: a thermal sensor, a heat flux sensor, a pressure sensor, a moisture sensor, an accelerometer, alight sensor.
Hence, if the spacer of the IGU is made out of a metal, the antenna, e.g. a dipole antenna or a patch antenna, of the radio module is arranged in an upright position away from the metal surface of the spacer. In some embodiment, the antenna structure can be arranged parallel to the window pane away from the metal spacer. In some embodiment, a spring structure may be used to arrange the antenna structure agains to the window pane in an upright position away from the metal spacer. This way, a self-supporting sensor module is realized which is capable of wireless transmitting sensor data to a receiver external to the IGU, without degradation of the antenna signal due to the close proximity of the metal surface of the spacer.
In a further aspect, the invention may relate to a system for processing sensor data of one or more insulating glass units (IGUs) comprising: a plurality of IGUs arranged in one or more facades of one or more buildings, each IGU comprising an inter-pane sensor module according to any of the embodiments described above.
In an embodiment, the one or more gateways may be configured to receive sensor data from the inter-pane sensor modules of the plurality of IGUs and to send the sensor data to a server system configured to process the sensor data.
In an embodiment, the processing may include: determining the integrity of at least one of the plurality of IGUs, the integrity of at least one of the one or more facades and/or the integrity of at least one of the one or more buildings comprising the at least one of the plurality of IGUs.
One aspect of this disclosures relates to a non-transitory computer-readable storage medium storing at least one software code portion, the software code portion, when executed or processed by a computer, is configured to perform one or more of the methods described herein.
BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the invention will be explained in greater detail by reference to exemplary embodiments shown in the drawings, in which: Fig. 1A-1C depict schematic cross-sectional of parts of sensor modules according to various embodiments of the invention; FIG. 2A-2C depict an insulating glazing structure comprising an sensor module according to an embodiment of the invention; FIGs 3A-3B depict depict schematic cross-sectional of parts of sensor module according to another embodiment of the invention; FIG. 4A-4B depict an insulating glazing structure comprising a sensor module according to an embodiment of the invention; FIG. 5A-5C depict a spacer structure comprising a sensor module according to an embodiment of the invention; FIG. 6A-6B depict a spacer structure comprising a sensor module according to an embodiment of the invention;
FIG. 7A and 7B illustrate a system for monitoring an insulating glazing structure according to an embodiment of the invention; Fig. 8 depicts a frame for a TDMA protocol for reading sensor signals of a sensor module that is integrated in an insulating glazing structure according to an embodiment of the invention.
Fig. 9 depicts a schematic of controlling a building based on sensor data generated by an insulating glazing structure according to an embodiment of the invention.
DETAILED DESCRIPTION OF THE DRAWINGS Fig. 1A-1C depict schematic cross-sectional of parts of sensor modules according to various embodiments of the invention. The sensor module 1004 for a multi-pane insulating glazing unit (IGU) may comprise an elongated mounting structure 102 supporting including sensor elements. The mounting structure may have dimensions so that the sensor module can be mounted onto a spacer structure 100; of the IGU. In an embodiment, the mounting structure may be shaped as an elongated structure (extending e.g. in the y- direction) having a predetermined cross-sectional profile (in the z-x plane). The mounting structure may be implemented in different ways.. As will be described hereunder in more detail, different mounting structures may be used to fixate the sensor module to the spacer, for example a mounting structure may include an extruded structure having a certain profile that allows to mechanically fixate, e.g. clamp, the mounting structure to the spacer structure. In other embodiment, the mounting structure may be a longitudinal substrate, e.g. a flexible PCB, on which sensors and other electronics for processing the sensor signals can be mounted, wherein the substrate may be fixated to the spacer structure using an adhesive.
The spacer structure is not only used to keep both window panes at a predetermined distance, but also functions as a gastight seal. To maximize the insulating properties of the IGU, the spacer structure and the inter-pane space formed by the two window panes and the spacer structure is configured to have a very low thermal conductivity.
As shown in Fig. 1A the mounting part 102 of the sensor module may be adapted to be fixated onto the spacer, which includes a hollow base part 101. Fig. 1A illustrates a situation wherein the spacer and sensor module are in a disassembled state. As will be described hereunder in more detail, the spacer 101 may be configured to receive the mounting part 102, which so that the sensor module may be mounted and fixated onto the spacer. The sensor module may be configured to measure parameters associated with the IGU. For example, in an embodiment, the sensor module may be configured to thermal properties of the IGU. For example, it may be configured to measure the heat flux that radiates per time instance and per surface unit through the IGU and/or the thermal transmittance of the IGU. These thermal parameters of the IGU are particular suitable for dynamically determining the integrity of the IGU and to control for example climate management systems of a building comprising such IGUs. In further embodiments, the sensor module may be configured to measure parameters associated with structural integrity of the IGU and/or with the structural integrity of the facade or building in which the IGU is mounted. Sensors that can be used for this purpose include for example one or more accelerometers, pressure sensors and/or moisture sensors.
The sensor modules described with reference to the embodiments in this application are configured to be used inside the IGU, which typically is a vacuum sealed space which in many cases has no electrical wiring to the outside of the IGU. Hence, preferably, the sensor module for the IGU is configured to be self-supporting in terms of power and has means for wireless communication with a base station exterior to the IGU. To be self-supporting the sensor module may include a power generating device, e.g. one or more photo-voltaic cells that can be used to charge a rechargable capacitor or a battery. In an embodiment, so-called super capacitors or hybrid capacitors may be used for energy storage. Such capacitors are particularly suitable for use as a power source for a sensor module as described with reference to the embodiments in this application. These capacitors have an improved response to high temperatures when compared to conventional Lithium- lon batteries. Further, these capacitors have a longer lifetime, up to millions of cycles, compared to Lithium-Ion batteries. Moreover, these capacitors are designed for quick energy bursts, which are needed for RF Wide-spectrum communication. Embodiments of the sensor modules, IGUs comprising a sensor module and methods for determining parameters using such sensor module are described hereunder in more detail.
As shown in Fig. 1A, the substantially rectangular spacer structure 100; may include two side faces 1064; (parallel the y-z plane) which may be configured to receive and fixate an inner and an outer window pans, a bottom surface 107 and a top surface 108 {parallel to the x-y plane). In some embodiments, the spacer structure may further include one or more fastening members 1104; for removably mounting the mounting part onto the spacer structure. In an embodiment, the one or more fastening members may include (at least) two raised edges extending upwardly in the y-z plane parallel to the side faces of the base part. The raised edges and the top surface of the base part may form a U-shaped cross-sectional profile which is configured to receive and fixate the mounting part to the base part. The raised edges may include protrusions 11242 which coincide with ridges 1144, that are formed in the mounting part so that in the assembled state the mounting part is mechanically fixated to the base part. Fig. 1B depicts spacer structure and the associated sensor module in the assembled state. The side faces of the spacer structure and the outer surface of the ridges may form contact surfaces for receiving and bonding window panes of an IGU.
As shown in Fig. 1A, in some embodiment, the mounting part may be U- shaped so that the mounting part can be rigidly fixated to the spacer using mechanical sliding and/or clamping mechanisms. In other embodiments, the mounting parts may be fixated to the spacer using other means, e.g. one or more screws, clips, etc. The mounting part further includes a structure for fixating a substrate 116, e.g. a PCB board that includes the sensor elements and other electronics 103, e.g. processing unit, a (wireless) radio module, a power storage (e.g. a super capacitor or a rechargeable battery) and a power source, e.g. one or more photovoltaic (PV) cells or any other suitable power source, e.g. a power harvesting device that is configures to convert RF energy into a current for charging the power storage.
In an embodiment, the sensor module may include one or more sensors that are configured to accurately measure thermal properties of the IGU. To that end, the sensor module may include a thermal contact structure arranged at a first end of the mounting structure. The thermal contact structure may be configured to thermally connect an inner surface of a glazing of the IGU with a thermal sensor. The mounting structure may include a spring structure arranged to mechanically press the thermal contact against the inner surface of the first glazing of the IGU when the sensor module is arranged between the first and second glazing of the IGU.
Fig. 1C depicts an embodiment of a sensor module wherein the mounting part is a elongated substrate, e.g. a (flexible) PCB on which electronics 103 associated with the sensor module may be mounted. The elongated substrate may be fixated to a top surface of a conventional spacer using an adhesive or a (double-sided) adhesive tape 126.
As shown in Fig. 1A -1C, the spring structure may include one or more spring elements 10442 which extend upwardly along the edge of the mounting part. The spring elements may be shaped to extend outwardly from the spacer structure, so that when an insulating glazing structure is formed based on the spacer structure, a spring force presses the spring element against the window pane. This way, a stable thermal contact may be established between window pane of the IGU and the sensor module. The figure for example depicts a first spring element 1044 for contacting an inner window pane and second spring element 1044 for contacting an outer window pane.
In an embodiment, a thermal sensor 105.2, e.g. a thermistor or a thermocouple, may be fixated against the outer surface of the spring element, so that when the IGU is assembled the thermal sensor will be pressed against with the window pane by the spring element. This way, the thermal senor is in direct thermal contact with the window pane and thus will accurately translate a temperature of the window pane into an electrical signal that can be processed by the electronics of the sensor module. In another embodiment, the spring element may be made of or comprise a material with a high thermal conductivity, e.g. copper or aluminum. This way, a direct thermal contact may be established between the window pane and a thermal sensor that is mounted on the substrate of the sensor module. The use of a spring structure on the mounting part of the sensor module allows the establishment of a reliable thermal contact that is needed for accurately determining thermal parameters of the IGU. Additionally, the spring structure provides simple assembly of an IGU that comprises a sensor module that allows in-situ determination of thermal properties of the IGU, e.g. the U value of an IGU. The mounting part of the spacer structure may be adapted so that it can be mounted on any type of spacer and can optimized for its functions before assembling the individual parts in a spacer structure.
Fig. 2A-2C depict at least part of glazing assembly comprising sensor module according an embodiment of the invention. In particular, Fig. 2A and 2B depict a multi-pane glazing assembly 200 comprising a peripheral spacer structure 202 along the peripheral areas of a first and second glass pane 204, 206 (in Fig. 1A and 1B the surface plane of the glass panes coincides with the y-z plane).
The peripheral spacer structure may form an elongated peripheral spacer structure formed along the peripheral areas of all sides of the window panes in order to fixate the two glass panes at a predetermined distance from each other. The spacer structure may have a cross-sectional structure as described with reference to Fig. 1A and 1B or any other suitable cross-sectional profile. A sensor module 217 is mounted onto the spacer. To that end, the sensor module may include a mounting part 224 for mounting and fixating the module onto the spacer. The mounting part may further include different electronic parts including e.g. one or more photovoltaic cells connected to a rechargeable capacitor or battery 222, a radio module 220 connected to an antenna 221 and a processing unit 223 for controlling the sensor module. As shown in the figure, the sensor module may include a spring type structure 21642. e.g. in the form of spring elements, for pressing one or more sensor 218,219, such as thermal sensors, against the inner surface of the window panes so that a stable thermal contact of the thermal sensor against the window pane can be guaranteed under all circumstances.
In some embodiments, in case the spacer is made out of a metal, in that case, the spring structure may be used to fixate the antenna, e.g. a dipole antenna or a patch antenna, of the radio module against the window pane away from the metal spacer. In an embodiment, the antenna may be a patterned metallic layer onto a flexible PCB. Hence, in some embodiment, the invention may relate to a sensor module for an IGU comprising an elongated support structure arranged to be fixated to the surface of a metallic spacer structure of the IGU. One or more sensors, a wireless radio module, a photovoltaic cell, a capacitive power storage and a controller may be arranged on the support structure. The photovoltaic cell and the power storage are used to power the controller, which is configured to control the radio module to transmit data generated by the sensor to a receiver external to the IGU. In an embodiment, the spring structure may be used to mechanically press an antenna, such as thin-film dipole or patch antenna, of the radio module to an inner surface of a glazing of the IGU, when the sensor module is fixated on the spacer structure between the first and second glazing of the IGU.
In other embodiments, instead of the spring structure, other ways of positioning the antenna onto the mounting part may be used. For example, in an embodiment, an antenna support structure may be used to arrange the antenna structure in an upright position on the mounting part of the sensor module. This way, the antenna can be positioned substantially parallel to an inner surface of a glazing of the IGU and/or substantially perpendicular to the metal surface of the spacer, when the sensor module is fixated on the spacer structure between the first and second glazing of the IGU. In a further embodiment, the mounting part may comprise an antenna structure arranged substantially perpendicular to surface of the support structure. In yet another embodiment, the support structure may include a raised edge, wherein the antenna structure is fixated against the raised edge. Typically, the antenna structure may comprise a substrate, e.g. a PCB or Kapton sheet, and a thin-film metallic dipole or patch antenna arranged thereon.
This way, an self-supporting sensor module is realized which is capable of wireless transmitting sensor data to a receiver external to the IGU, without degradation of the antenna signal due to the close proximity of the metal surface of the spacer.
Different materials may be used to form the peripheral spacer structure. For example, in an embodiment, the spacer structure may be a hollow metal spacer structure. Suitable materials include e.g. aluminum, stainless steel, or galvanized steel. A metal spacer may be coated with a material that has a high thermal conductivity to improve the thermal insulation properties of the IGU. In another embodiment, a non-metal spacer structure may be used. Such non-metal spacer structure may provide improved thermal performance. Suitable materials for such non-metal spacer structure include a composite, a structural foam (e.g. EPDM or silicone foam) or a thermoplastic material. In further embodiments, the spacer structure may include both metal and non-metal materials.
The peripheral spacer structure may be configured to provide a spacing between at least two glass panes, a first (inner) glass pane 204 and a (second) outer glass pane 206. The spacer structure may include bonding surfaces, a first bonding surface 2104 for bonding an inner glass plane and a second bonding surface 210; for bonding an outer glass pane using a suitable bonding agent. The peripheral spacer structure may bond the glass panes at the peripheral area, e.g. the edges, of the (typically rectangular) glass panes.
In an embodiment, the peripheral spacer structure may form or may be part of a sealing structure for sealing, preferably hermetically sealing, the inter-pane space, i.e. the space between the glass panes. In some embodiments, the space between the glass panes may be filled with a certain gas, e.g.
Argon or Krypton, in order to increase the thermal and/or acoustic insulation.
In an embodiment, the mounting part 202 of the sensor module may be structured as a longitudinal (extruded) structure having a predetermined cross-sectional profile as shown Fig. 1A and 1B, wherein the mounting part 210 is adapted to (removably) mount the sensor module 217. As shown in Fig. 2B, the mounting part of the sensor module may include one or more spring elements 21642 which are adapted to position and press a sensor or sensor contacts 218,219 against the inner window pane 206 and/or the outer window pane 204. Different thermal sensors may be mounted onto each of the spring elements.
For example, in an embodiment, a thermistor 219 may be mounted onto one of the spring elements so that the thermistor is kept in direct thermal contact with a window pane.
A thermistor will generate a sensor signal that correlates with the temperature.
Electrical wiring on the spring elements may be used to electrically contact the thermistor with the electronics of the sensor module 220. In another embodiment, a heat flux sensor 218 may be mounted on one of the spring elements.
An example of such heat flux sensor 218 is depicted in Fig. 2C.
Such sensors a known in the art and may include a planar thermally insulating substrate 224 (e.g. a polyamide) of a predetermined thickness t.
A plurality of electrically connected thermocouple junctions 22812 may be provided on both sides 2264; of the substrate.
When mounted into the IGU, the sensor module is capable of measuring a temperature difference between an inner temperature T; (represented by the temperature of the inner window pane 206) and the outer temperature T, (represented by the temperature of the outer window pane 204). A temperature difference may cause a net heat flux 200, i.e. the thermal energy per unit area, moving through the window panes of the IGU.
When mounting the heat flux sensor against a window pane of a IGU as e.g. depicted in Fig. 2B, junctions 228,0n one side 226, of the substrate exposed to a steady state heat flux will be at a first (high) temperature and the junctions 2282 on the other side 2262 of the substrate will have a second (low) temperature.
Due to this temperature difference a voltage difference between the two contact points 230 of the sensor will appear that is proportional to the heat flux g passing the substrate: g = k : AT /t , wherein g represents the heat flux (W/m?), k the thermal conductivity of the substrate (W/m K), AT the thermal difference across the substrate and ¢ the thickness of the substrate.
Many different variants exists for measuring the heat flux based on thermocouple junctions.
Any of these variants may be used as a heat flux sensor for the IGU.
The output of the thermal sensor and/or heat flux sensor may be connected via leads to the processing unit which is configured to process the output signals of the sensors and to convert the output signals into temperature values and/or heat flux values respectively.
In a further embodiment, one or more first spring contacts may be configured to bring at least a heat flux sensor and a first temperature sensor in thermal contact with a surface of a first window pane (e.g. the inner window pane) of the IGU and at least a second spring contact may be configured to bring at least a second temperature sensor in thermal contact with a second temperature sensor.
The sensor signals of the temperature sensors and the heat flux sensor may be collected by a data processor of the sensor module.
Further, the measured sensor signals may be transmitted by the wireless radio module to a base station external to the IGU.
In an embodiment, the processing unit may be configured to compute the thermal resistance (the R-value) or the thermal conductance (the U-value) of the IGU based on the measured sensor signals.
An R-value may be computed by computing: R = AT /q wherein AT is the temperature difference measured by the two temperature sensors AT = T, — T; and g is the heat flux measured by the heat flux sensor.
The thermal conductance is simply the reciprocal value of the thermal resistance R = 1/R.
The data processor may determine R (or U) values in time so that the thermal properties of the IGU can be monitored in time.
Alternatively, the processor may collect time series of sensor signals and transmit the data to the receiver outside the IGU.
This way, the measured data may be collected and processed by a computer, which may be part of a IGU monitoring and controlling system.
Examples of such system are described hereunder in more detail.
Fig. 3A and 3B depict cross-sectional views of parts of sensor module according to another embodiment of the invention.
The sensor module may be fixated on to a spacer structure that is identical or at least similar to the base part as described with reference to Fig. 1A and 1B.
The spacer may include a rectangular base part 301 having side faces 30612, a bottom surface 307, a top surface 30812. In some embodiment, the spacer may include fastening members 3104 for removably mounting and fixating the sensor module onto top surface of the spacer.
In an embodiment, the fastening members may include (at least) two raised edges extending upwardly in the y-z plane parallel to the side faces of the base part.
Further, the raised edges and the top surface of the base part may form a U-shaped cross-sectional profile which is configured to receive and fixate the mounting part 302 to the base part.
The raised edges may include protrusions 31242 which coincide with ridges 3144 that are formed in the mounting part.
As already described above, many different ways exits to mount and fixate the sensor module onto the spacer, including mechanical (e.g. screw, clips, clamps) or chemical {adhesive or glue) manners to fixate the sensor module on the spacer.
In the example of Fig. 3B, the mounting part may be shaped to be rigidly fixated to the base part using mechanical sliding and/or clamping mechanisms.
The raised edges of the based part may include protrusions 3124; which coincide with ridges 31442 that are formed in the mounting part so that in the assembled state the mounting part is mechanically fixated to the base part.
The mounting part further includes a structure for holding a substrate 316, e.g. a PCB board or the like.
The mounting part may be configured to fixate PV cells of the sensor module in a tilted position towards the outer glass pane.
The PV cells may include (an array of) photovoltaic cells mounted on a printed circuit board (PCB). Further, electronic components associated with the PV cells, e.g. bypass diodes and other discharge protection electronics, may be mounted on the PCB as well.
The tilt angle allows the light receiving areas of the PV cells to be oriented towards the incoming sun light.
The PCB board may further electronics similar to those described with reference to Fig. 1 and 2, including a rechareble capacitor or battery, a radio module connected to an antenna structure, different sensors including e.g. one or more accelerometers and a processing unit.
The sensor module sensor module may include a thermal contact structure arranged at a first end of the mounting structure.
The thermal contact structure may be configured to thermally connect an inner surface of a glazing of the IGU with a thermal sensor.
The mounting structure may include a spring structure arranged to mechanically press the thermal contact against the inner surface of the first glazing of the IGU when the sensor module is arranged between the first and second glazing of the IGU.
Additionally, in case the spacer structure is made out of a metal, the spring structure may also be configured to press the antenna structure of the radio module to the inner surface of one of the glazings.
This way, the antenna can be kept away from the metal surface of the spacer.
In this example, the spring structure may include one or more spring elements 304, which extend upwardly along both edges of the mounting part.
The spring elements may be shaped to extend outwardly from the spacer structure, so that when an insulating glazing structure is formed based on the spacer structure, a spring force keeps the spring element against the window point.
One or more thermal sensors (one or more thermal contacts of one or more thermal sensors), a heat flux sensor and/or a radio antenna of the radio module may be mounted onto the spring elements in a similar way as described with reference to Fig. 1 and 2. Fig. 4A and 4B depict at least part of glazing assembly comprising a sensor module as described with reference to Fig. 3A and 3B.
In particular, Fig. 4A and 4B depict a multi-pane IGU 400 comprising a peripheral spacer structure 402 along the peripheral areas of a first and second glass pane 404, 406. In this embodiment, the glazing assembly represents a power-generating multi-pane glazing assembly comprising a thermal sensor module that is capable of in-situ measuring thermal properties of the IGU.
The peripheral spacer structure may form an elongated peripheral spacer structure formed along the peripheral areas of all sides of the window panes in order to fixate the glass panes at a predetermined distance from each other.
The peripheral spacer structure includes a mounting part 412 for positioning both one or more sensor modules and PV cell modules 408 along (at least part of) the peripheral area of the multi-pane glazing assembly.
The mounting members are configured to position the PV cell modules so that the light receiving areas of the PV cells are tilted towards the outer glass pane.
The spacer structure is configured to provide a spacing between at least two glass panes, a first (inner) glass pane 404 and a (second) outer glass pane 406 in a similar way as the spacer structure of Fig. 2A-2C. The spacer structure may include bonding surfaces, a first bonding surface 410: for bonding an inner glass plane and a second bonding surface 410; for bonding an outer glass pane using a suitable bonding agent. The tilt angle may be selected to have a value so that the light-receiving surface of the PV cells are tilted towards the outer glass pane in order to optimize the reception of solar light and to avoid shading effects. In an embodiment, the tilt angle may be selected based on the geographical location, e.g. the latitude, of the building in which the glazing assemblies are used. In a further embodiment, the tilt angle of the spacer structure at one side of the glazing assembly may differ from the tilt angel of the glazing assembly of another side of the glazing assembly. This way glazing assemblies may be optimized for use in different orientations, e.g. on the north side or south side of a building. The PV cell modules are mounted onto the spacer structure. This way, the spacer structure and the PV cell modules may be fabricated separately, i.e. before the spacer structure is bonded to the glass panes.
Fig. 5A and 5B depict part of a spacer structure comprising one or more sensor modules according to an embodiment of the invention. As shown in these figures, a spacer structure 502 may be comprise several parts, including first and second elongated tubular parts 506,508 and corner parts 510, forming a modular spacer structure. In particular, Fig. 5A depicts individual parts of a corner section, in this example a right corner section, of a modular spacer structure 502 in a disassembled state. The corner section may include first and second elongated tubular structures 506,508 each comprising a base part 509,2 and a mounting part 511+, configured to fixate modules, such as PV cell modules 51612 and/or sensor modules 522. Based on the modules that are used, different mounting parts may be used.
For example, in case of PV cells (as shown in the pictures), a mounting part 51112 may be used allowing PV cell modules 5164: to be arranged in a tilted position. In case only sensor modules are arranged on the spacer structure (not shown), a mounting part may be used that does not provide a tilted position of the module. Examples of such mounting parts are described above with reference to Fig. 1-4. Modules that are arranged next to each other on the mounting part of the spacer structure may include on a (planar) electrical wiring board, e.g. PCB, including wiring and electrical connectors for electrically connecting PV cell modules and/or sensor modules to a controller module and to wires that have electrical connection external to the IGU.
One side or both sides of the wiring board of a first module, such as PV cell module 5161, may include an electrical connector 518, (male or female), which is configured to engage with an associated electrical connector 5204 (male or female) of a second module that is arranged next to the first module on the spacer structure. For example, this way PV module 5161 may be electrically connected to a controller module 521 and/or a sensor module 522. The controller module may comprise electronics for centrally controlling the PV cells and/or sensors. The sensor module may include thermal sensors 5244, that are configured to be in contact with one of the window panes, once the spacer structure is used to form a IGU. In an embodiment, the controller module and the sensor module may be implemented as one module. In another embodiment, the modules may be separate modules which can be mounted onto the spacer structure and electrically connected to neighboring modules or wiring boards.
The corner connector 510 may include first and second legs for providing mechanical (sliding) connection with the first and second elongated hollow tubular structures
5094... It may further comprise electrical leads 51342 for providing an electrical connection between wiring of an electrical wiring board 512 (e.g. a (partly) flexible PCB) that is mounted on or integrated in corner connection and a power plug to mains.
The electrical wiring board of the corner connector may include electrical connectors 514,2, wherein each connector of the electrical wiring structure is configured to engage with a connector (male or female) of a module that is mounted on the mounting part of the spacer structure. For example, electrical connector 5144 (male or female) may engage with an electrical connector 5182 (male or female) of the controller module to connect the wiring board of the corner connector to the controller module and electrical connector 5142 (male or female) may engage with an electrical connector (male or female) of a further module 5182 mounted on the mounting part of side connector of a PV module.
In an embodiment, the corner connector may include at least one thermal sensor 524,. A spring structure, such as a spring member, may be used to pressed the sensor against a window pane when using the spacer structure to form an IGU. Thermal sensor 524; may be electrically connected via the electrical wiring of the wiring board of the corner connector and the electrical connectors to the sensor module, which is configured to process sensor signals produced by the thermal sensor. In a similar way, further spring members for one or more further mounting thermal sensors 5243 may be located along other parts of the spacer structure and an electrical connection between these thermal sensors and the sensor module may be established using electrical wiring of electrical wiring boards that are mounted on the spacer structure. The electrical connectors for electrically connecting modules to other modules, including a controller module and/or an electrical wiring board of a corner connection are not limited to the type of connectors depicted in the figures. It will be understood that any type of electrical connector that allows electrical connection of different modules may be used.
Fig. 5B depicts the individual parts of the right corner section 504 of a modular spacer structure in an assembled state. As shown in this figure, the design of the spacer structure is highly modular and can be assembled based on slidable mechanical and/or electrical connections into a spacer structure that holds sensor modules and, optionally, power-generating PV cell modules.
The assembled spacer structure mechanically and electrically tested and characterized before assembly into a IGU comprising a sensor module for in-situ measurement of thermal (insulating) properties, such as the R-value, of the IGU.
Fig. 6A and 6B depict part of a spacer structure comprising sensor modules according to another embodiment of the invention.
In particular, the figures include a 3D dimensional view (Fig. 6A) and a schematic front view (Fig. 6B) of a spacer structure 600 including vertical spacers 6022 and horizontal spacers 60342. As shown in the figure the spacer structure may include base part 604 and a mounting part 606 of a sensor module The sensor module may be any module as described with reference to the embodiments in this application.
For example, the sensor module may include one or more spring elements 610 on which thermal sensors are mounted.
The sensor module may further include electronics 608 for processing the signals of the sensor module.
The upper horizontal spacer may include a mounting part for a blind 612. The blinds may be controlled to move up and down by one or more actuators 61542, e.g. electromotors, which may be electrically connected via wiring 616 that runs via the spacer structure to a controller, which may e.g. also control the sensor module and a data communication module for bi-directional data communication between the controller and an external computer.
Based on this spacer structure an IGU may be realized that has integrated sensors and blinds.
The blinds may be controlled based on information determined by the sensor module, e.g. the heat flux through the window, and information determined by other sources external to the IGU, e.g. sensor information of sensor modules of other IGUs that are part of a fagade.
Instead of blinds other means for changing the transmission of the IGU.
For example, the IGU may be coated with an electrochromatic material.
Based on the sensor information, the light transmission characteristics of the electrochromatic coating may be controlled.
Fig. 7 depicts a system of IGUs 702.4, e.g. a facade of IGUs, wherein each IGU comprises a sensor module according to an embodiment of the invention.
As shown a plurality of IGUs 70244 may be communicatively connected to a central computer 714 for monitoring and collecting sensor data of the IGUs.
The sensor module may include one or a plurality of sensor to determine various parameters associated with the IGU or the structure (e.g. facade or building) the IGUs are mounted in (e.g. temperature, humidity, vibrations, pressure and movement, heat flux and light intensity). In an embodiment, the sensor data may be used to monitor the performance of the IGUs, for example the R-value of the IGUs and/or the humidity or pressure, over time.
Correlating these data over time may be used to determine drop in the quality of the IGU.
In an embodiment, the sensor data may be used to monitor the stability of the structure (the facade or building) in which the IGUs are mounted.
For example, vibration and movement data of one or more accelerometers (e.g. three accelerometers arranged to measure movements and accelerations along three orthogonal axis) may be used to monitor the structural integrity of tall buildings, e.g. skyscrapers. Additionally, in a further embodiment, the sensor data may be used to control (some of) the IGUs of the facade and/or a climate control system. For example, the heat flux, temperature and/or light intensity may be used to control blinds and/or the climate control.
As shown in the figure, each IGU 70214 may include a spacer structure 7041.4 and one or more sensor modules 7064.4 mounted onto the spacer structure. Additionally, in some embodiments, the IGU may include PV cells 7084.4, a blind controller 71044 for controlling blinds 71214 or further sensors (not shown) including but not limited to a pressure sensor for measuring the pressure in the inter-pane space of an IGU or a movement sensor, e.g. an accelerometer for measuring movements (vibrations) of the IGU. In an embodiment, such movement sensor may be configured to measure movements in three directions, e.g. an x,y and z-direction.
In an embodiment, each IGU may be connected via a powerline 71344 0f a local powerline grid. In an embodiment, the powerline grid may be a DC powerline grid, e.g.
a 24 V DC powerline grid, such as a 24 V DC nanogrid. Further, in an embodiment, a power line communication (PLC) scheme may be used to enable bidirectional data communication between the IGU controller and a local computer 715. A PLC gateway 714 may be used to enable data communication with the different sensors and/or actuators of each IGU. The gateway may be connected to a central computer 716 which is configured to process the sensor information and store the information in a data storage 716.
To enable both data collection by sensor information and, in some embodiments, control of actuators, a suitable communication protocol may be used. Known mater-slave protocols, such as the protocols described in US2019/0243207 may be used. Such master-slave protocols however do have some drawbacks. For example, the protocol requires the slave to listen to the lines, which consumes a lot of energy. Further, the slaves cannot send event messages based on a trigger, e.g. the temperature of the window is too high. It is always, the master that need to request the status of the window.
In an embodiment, a Time-division multiple access (TDMA) protocol may be used. The TDMA protocol is a channel-access method for shared-medium networks. It allows nodes, UGUs, to share the same frequency channel by dividing the signal into different time slots as defined by so-called (TDMA) frames 72213. An example of such frames is depicted in Fig. 7B. Such frame may include a synchronization timestamp 724, time slots 7264.3 reserved to control an actuator or a sensor, time slots 7284; to enable an event such as reading sensor data. The TDMA frames may be generated by a main nade, e.g. the gateway, and transmitted to each IGU. The gateway may function as a synchronization node, enabling all other nodes, the sensors and actuators of each IGUs, to synchronize to the TDMA frames. To that end, each frame may include at least a synchronization timestamp. Further, the gateway may also handle network addressing whereby each node is provided with a network address, e.g. a unique identifier, so that each node in the network can be addressed. The gateway may assign a time slot in a TDMA frame to each of the nodes.
During such time slot, a sensor or actuator may be asleep (idle) or awake (active). In its active state, a sensor or actuator may either transmit data to the gateway or listen, e.g. receive data from the gateway in rapid succession. Time slots in a frame may be processed by the nodes, one after the other. This way, multiple nodes in the network may share the same transmission medium, while using only a part of its channel capacity without the risk of collisions. To enable control message with high priority (latency <500ms) and sensor message with low priority on the same network timeslots may be reserved for each, so that responsiveness of the system can be guaranteed.
In order to minimize energy consumption, the TDMA protocol may allow nodes on the network to sleep and wake up based on a certain trigger. For example, a sensor in an IGU may collected data over time and periodically transmit the collected data to the gateway.
Hence, when sensor data need to be transmitted, the IGU may wake up, receive a TDMA timeframe, synchronized with the network based on a synchronization timestamp of the frame and use an assigned timeslot for data transmission. In another embodiment, a sensor signal may trigger the IGU to wake up. For example, the IGU may wake up because the measured heat flux is higher than a predetermined threshold value.
In an embodiment, the protocol may be a dynamic time-division multiple access (dynamic TDMA), wherein the scheduling algorithm may dynamically reserves a variable number of time slots in each frame. This way variable bit-rate data streams generated by sensors of IGUs may be managed, based on the traffic demand of each data stream. Dynamic TDMA also allows for the reservation of timeslots for high priority control messages. For example, activation of actuators to control the blinds of an IGU may not be interrupted by other activities, in particular low-priority activities, such as periodic transmission of sensor data. Further, dynamic TDMA also allows over-the-air (OTA) software updates, e.g. updates of the software that is executed by the control and sensor modules of each of the IGUs. Instead of powerline communication as depicted in Fig. 7 other types of data communication may also be used.
An example of such network of IGUs is depicted in Fig.8, illustrating a system of IGUs 80244, e.g. a facade of IGUs, wherein each IGU comprises a sensor module 8061.4 according to an embodiment of the invention. In this embodiment, the sensor modules may be powered using PV cells 8064.4. Further, the sensor modules comprise a wireless radio module configured to communicate with a base station or gate way 814, which may be connected to a central computer (e.g. a server system or the cloud). A wireless data protocol such as WiFi, Bluetooth or another wireless protocol may be used for transmitting control messages to IGUs and/or receive sensor data from IGUs. In an embodiment, the radio modules of the sensor modules may form wireless nodes of a long range wide area network (LoRaWan). These networks are particular suitable for low power data communication in machine to machine applications.
Fig. 9 depicts an embodiment of a system of IGUs connected to a central processing unit. assessing and/or predicting the structural integrity of facade of a building and/or assessing and/or predicting the structural integrity of one or more IGUs in that facade. A facade 904, of a first building 902: may comprise a plurality of IGUs 9054, wherein at least part of the IGUs have one or more sensor modules 907: as described with reference to the embodiments in this application. Similarly, a further (second) building 9022 may comprise a facade 904: comprising IGUs, which may comprise one or more sensor module as described with reference to the embodiments of this application. IGUs of one building may be communicatively connected to a central data processing system 906, via a communication network 908, e.g. wireless network or a (low powerline DC) powerline communication network. Further, data of different buildings may be collected by a central data processing system 912, e.g. a server system in a network 910.
The central data processing system may be configured to compute and/or predict the structural integrity of the IGUs. In this method, one or more exterior walls of one or more buildings comprise a set of IGUs. An IGU may not only include one or more thermal sensors and flux sensor, but also other sensors including but not limited to a humidity sensor, a pressure sensor, light sensor, an accelerometer and/or a gyroscope. Each IGU is configured to repeatedly measure one or more thermal parameters, such as the temperature of the inner and outer window pane, the heat flux and the R-value. Additional parameters may include humidity, pressure, and movement. Time series of values for each of these variables may be determined, stored and processed. Based on these measured time series the performance and the structural integrity of individual IGUs as well as the collective performance of a facade of IGUs may be determined. For example, by monitoring the R- values of the IGUs it can be determined if the performance of an IGUs is still within certain predetermined boundaries. Based such data it may be decided to plan maintenance, renovation or even replacement of one or more IGUS.
The sensor module includes a power source and a power storage so that it is self-supporting and does not require an external power source. Hence, once an IGU is assembled, the sensor module may be activated to monitor certain parameters. For exemple, the sensor module may include a transport and/or installation mode. For example, the sensor module may be activated when the IGU is transported from storage to the building site and e.g. when the IGU is installed in a fagade. This way, the sensor module may monitor the quality and structural integrity of the IGU before or during installation.
Claims (14)
Priority Applications (2)
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| NL2027698A NL2027698B1 (en) | 2021-03-03 | 2021-03-03 | Sensor module for insulating glazing structures |
| PCT/NL2022/050118 WO2022186692A1 (en) | 2021-03-03 | 2022-03-03 | Sensor module for insulating glazing structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2027698A NL2027698B1 (en) | 2021-03-03 | 2021-03-03 | Sensor module for insulating glazing structures |
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| NL2027698B1 true NL2027698B1 (en) | 2022-09-22 |
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| NL2027698A NL2027698B1 (en) | 2021-03-03 | 2021-03-03 | Sensor module for insulating glazing structures |
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| IT201700044591A1 (en) * | 2017-04-24 | 2018-10-24 | Pellini Spa | Improved double-glazing |
| DE102023117248A1 (en) * | 2023-06-29 | 2025-01-02 | Glaston Germany GmbH | Insulating glass pane and method for its manufacture |
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| WO2016191406A1 (en) | 2015-05-26 | 2016-12-01 | Guardian Industries Corp. | Glazing with heat flux sensor and method of making the same |
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| EP1026790A1 (en) * | 1999-02-08 | 2000-08-09 | The Whitaker Corporation | Electrical connector and panel assembly |
| EP2341490A1 (en) | 2009-12-21 | 2011-07-06 | Glasfreunde GmbH | Device for detecting damage to insulating glass |
| US20190243207A1 (en) | 2009-12-22 | 2019-08-08 | View, Inc. | Self-contained ec igu |
| WO2016191406A1 (en) | 2015-05-26 | 2016-12-01 | Guardian Industries Corp. | Glazing with heat flux sensor and method of making the same |
| WO2019081784A1 (en) | 2017-10-27 | 2019-05-02 | Powerwindow B.V. | Glazing assemblies with integrated photovoltaic structure and spacer structures for such glazing assemblies |
| US20200321908A1 (en) * | 2017-10-27 | 2020-10-08 | Physee Group B.V | Glazing assemblies with integrated photovoltaic structure and spacer structures for such glazing assemblies |
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| Publication number | Publication date |
|---|---|
| WO2022186692A1 (en) | 2022-09-09 |
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