[go: up one dir, main page]

NL2019860B1 - Device comprising a sandwiched electronic unit comprising a heat sink - Google Patents

Device comprising a sandwiched electronic unit comprising a heat sink Download PDF

Info

Publication number
NL2019860B1
NL2019860B1 NL2019860A NL2019860A NL2019860B1 NL 2019860 B1 NL2019860 B1 NL 2019860B1 NL 2019860 A NL2019860 A NL 2019860A NL 2019860 A NL2019860 A NL 2019860A NL 2019860 B1 NL2019860 B1 NL 2019860B1
Authority
NL
Netherlands
Prior art keywords
components
hole
metal body
opposite
heat
Prior art date
Application number
NL2019860A
Other languages
Dutch (nl)
Inventor
Roelof Brink Dirk
Original Assignee
Aecorsis B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aecorsis B V filed Critical Aecorsis B V
Priority to NL2019860A priority Critical patent/NL2019860B1/en
Priority to PCT/EP2018/079948 priority patent/WO2019091856A1/en
Application granted granted Critical
Publication of NL2019860B1 publication Critical patent/NL2019860B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Computing device comprising a plurality of heat producing electronic components, said components being in contact with at least one heatsink arranged to discharge heat generated by 5 said components, wherein said at least one heatsink comprises a metal body which is sandwiched between at least two of said components, said metal body having six faces, comprising two mutually opposite heat transfer faces to which the components are attached, two mutually opposite first side faces substantially perpendicular thereto, and two mutually opposite second side faces substantially perpendicular to the heat transfer faces and the first side faces, wherein said metal 10 body comprises a central through hole which extends between the two first side faces, to allow fluid to flow from the interior of the computer device into an opening of said through hole at one first side face and out of an opening of said through hole at the opposite first side face into the interior of the computer device.

Description

Device comprising a sandwiched electronic unit comprising a heat sink
The invention relates to a device comprising a plurality of heat producing electronic components, said components being in contact with at least one heatsink arranged to discharge heat generated by said components, wherein said at least one heatsink comprises a metal body which is sandwiched between at least two of said components, said metal body having six faces, comprising two mutually opposite heat transfer faces to which the processing units are attached, two mutually opposite first side faces substantially perpendicular thereto, and tw'o mutually opposite second side faces substantially perpendicular to the heat transfer faces and the first side faces. Such sandwiched processor unit are know'll, for instance the water cooled ZOTAC™ GeForce™ GTX 295 Infinity graphics card, wherein the metal body is provided with an internal conduit for cooling water and two external connectors for water hoses.
The current invention in particular, but not exclusively, relates to a computing device using submersion cooling wherein the flow of the cooling fluid is caused by convection. Submersion cooling of electronic components is a well known technology. Oil, or any other suitable dielectric fluid may be used as a cooling liquid. In order to efficiently cool the components the oil must flow along the components and along a cool heat exchanging surface for transferring the heat from the cooling liquid. Especially in datacentres an energy efficient system of cooling is required. The invention may also be applicable in non-submerged systems, for instance wherein the cooling fluid is air which is blown along the electronic components by a fan.
The invention aims at a compact, energy efficient, cost effective and/or reliable solution for an electronic device, suitable for use with convection cooling, in particular in a submerged electronic device.
To that end said metal body comprises a central through hole which extends between the two first side faces, to allow' fluid to flow from the interior of the computer device into an opening of said through hole at one first side face and out of an opening of said through hole at the opposite first side face into the interior of the computer device.
Preferably said central through hole having a cross section sufficiently large so that during use said fluid flowing through said through hole accounts for at least the largest part of the cooling capacity for the metal body of said heat sink and thereby said components.
Preferably said through hole has a substantially rectangular cross section, wherein the long edges of said rectangular cross section extend parallel to said heat transfer faces.
Preferably metal cooling fins extend from the walls of said through hole into the interior of said through hole, wherein said cooling fins extend parallel to the axis of the through hole, such that they do not obstruct the flow. Said cooling fins preferably divide said through hole in a plurality of substantially separated sub through holes. Preferably interruptions are formed in said cooling fins, in order to lower the Darcy friction of the flow.
For production technical reasons, said metal body is preferably comprised of tw'o separate halves, each halve comprising one of said heat transfer faces and one halve of the through flow opening, which are mounted together such that the halves of the through flow' opening face each other.
Preferably a PCB is mounted on each of said components, wherein said metal body is sandwiched between at least two of said PCBs extending parallel to each other. In preferred embodiments said components are graphics processing units, central processing units, chips or electronic components.
The invention is of particular advantage if said computing device is a submerged computing device wherein said fluid is a liquid, such as oil, and if said computing device comprises a plurality of sandwiched heat sink and components, wherein the axes of said through holes of said heat sinks are aligned, such that fluid is allowed to flow through said holes along their common axis.
Preferably the axis of said through hole extends vertically. Said metal is preferably copper or aluminum. The thickness of said heat sink between said components is preferably smaller than 4 cm.
The invention furthermore relates to a sandwiched electronic unit comprising at least two heat producing components being in contact wdth a heatsink arranged to discharge heat generated by said components, wherein said heatsink comprises a metal body which is sandwiched between said at least two components, said metal body having six faces, comprising two mutually opposite heat transfer faces to which the components are attached, two mutually opposite first side faces substantially perpendicular thereto, and two mutually opposite second side faces substantially perpendicular to the heat transfer faces and the first side faces, wherein said metal body comprises a central through hole which extends between the two first side faces, to allow fluid to flow from the interior of a computer device into an opening of said through hole at one first side face and out of an opening of said through hole at the opposite first side face into the interior of said computer device.
The invention furthermore relates to a heatsink arranged to discharge heat generated by heat producing components, wherein said heatsink comprises a metal body, said metal body having six faces, comprising two mutually opposite heat transfer faces to which the components can be attached, two mutually opposite first side faces substantially perpendicular thereto, and two mutually opposite second side faces substantially perpendicular to the heat transfer faces and the first side faces, wherein said metal body comprises a central through hole which extends between the two first side faces, to allow fluid to flow from the interior of a computer device into an opening of said through hole at one first side face and out of an opening of said through hole at the opposite first side face into the interior of said computer device.
The invention will now be illustrated by means of a preferred embodiment, with reference to the drawings, wherein:
Figure 1 is a perspective view of a sandwiched processor unit with a heat sink in accordance with the invention;
Figure 2 is a perspective view of the heat sink as used in the sandwiched processor unit of figure 1;
Figure 3 is a perspective view of the lower half of the heat sink of figure 2;
Figure 4 is a connecting part as used in the heat sink of figure 2;
Figure 5 is a frontal view' of the heat sink of figure 2; and
Figure 6 is a perspective view of a frame for a computer device comprising a plurality of sandwiched processor units of figure 1.
According to figure 1 a sandwiched processor unit, such as a graphics processing unit (GPU) comprises tw'o printed circuit boards (PCBs) 1, 2 extending parallel to each other, on each of which a processor (not shown) and other electronic components 3 and connectors 4 are mounted. A heat sink 5 extends between the boards 1,2, such that the processor of each board is in an optimised heat exchanging communication therewith.
According to figures 2, 3, 4 and 5 the heatsink 5 is comprised of two identical halves 51, 52, which are mounted together by means of a spacer 53. The halves 51, 52 of the heatsink have a generally rectangular or square box shape. A solid rectangular plate shaped part 511,521 of each of the halves 51, 52 is provided with mutually parallel cooling fins 512, 522 and mounting bushings 513, 523 extending the same distance from one side of said plate shaped part 511, 521 and being formed integral therewith. Preferably the halves 51, 52 are made of copper or aluminium.
Two arrays of interruptions 514, 524 are formed in said cooling fins 512, 522.
During assembly of the heat sink, the cylindrical spacers 53 are inserted in matching cylindrical holes of each pair of opposite bushings 513. In the centre of each spacer 53 a widened ring shaped part 531 is provided which causes a small gap to exist between the assembled two halves 51, 52.
As can be seen in figure 5 the cooling fins 512, 522 and the plate shaped parts 511, 521 form substantially enclosed (sub) through holes 54 extending in parallel between the two opposite side faces of the assembled heat sink 5 (the through holes 54 may together also be considered as one central through hole having a profile formed by said cooling fins 512, 522 so as to form sub-holes 54).
The interruptions 514, 524 form through holes 55 extending in parallel between the other two opposite side faces of the assembled heat sink 5.
As shown in figure 6, a frame 6 of a submerged computing device is provided with a plurality of sandwiched processing units 1, 2, 5 (in this example four). The frame 6 with the processing units is designed to be inserted vertically into a enclosed housing filled with a cooling liquid such as oil. The heat sinks 5 are oriented such that the through holes 54 of the heat sinks 5 all extend vertically. It may be advantageous if the heat sinks are orientated such that the through holes 54 of the lower units 1, 2, 5 are aligned with the through hole 54 of the adjacent units 1, 2, 5 extending above, such that an unobstructed convection flow of the cooling liquid from the bottom to the top is possible.
The invention has thus been described by means of preferred embodiments. It is to be understood, however, that this disclosure is merely illustrative. Various details of the structure and function were presented, but changes made therein, to the full extent extended by the general meaning of the terms in which the appended claims are expressed, are understood to be within the principle of the present invention. The description and drawings shall be used to interpret the claims. The claims should not be interpreted as meaning that the extent of the protection sought is to be understood as that defined by the strict, literal meaning of the wording used in the claims, the description and drawings being employed only for the purpose of resolving an ambiguity found in the claims. For the purpose of determining the extent of protection sought by the claims, due account shall be taken of any element which is equivalent to an element specified therein. An element is to be considered equivalent to an element specified in the claims at least if said element performs substantially the same function in substantially the same way to yield substantially the same result as the element specified in the claims.

Claims (14)

1. Elektronische inrichting omvattende een aantal warmteproducerende componenten, waarbij de componenten in contact zijn met ten minste een heatsink die is ingericht om door die componenten gegenereerde warmte af te voeren, waarbij de ten minste ene heatsink een metalen lichaam omvat dat een sandwich vormt met ten minste twee van genoemde componenten, waarbij het metalen lichaam zes vlakken heeft, omvattende twee tegenover elkaar liggende warmteoverdrachtsoppervlakken waaraan de componenten zijn bevestigd, twee tegenover elkaar gelegen eerste zijvlakken in hoofdzaak loodrecht daarop, en twee tegenover elkaar gelegen tweede zijvlakken in hoofdzaak loodrecht op de warmteoverdrachtvlakken en de eerste zijvlakken, waarbij het metalen lichaam een centraal doorgaand gat omvat dat zich uitstrekt tussen de twee eerste zijvlakken om fluïdum te laten stromen vanuit het inwendige van de computerinrichting in een opening van het doorgaande gat in een eerste zijvlak en uit een opening van het doorgaande gat in het tegenovergestelde eerste zijvlak lot in het inwendige van het apparaat.An electronic device comprising a plurality of heat-producing components, the components being in contact with at least one heat sink adapted to dissipate heat generated by those components, the at least one heat sink comprising a metal body forming a sandwich with at least at least two of said components, wherein the metal body has six faces, comprising two opposite heat transfer surfaces to which the components are attached, two opposite first side faces substantially perpendicular thereto, and two opposite second side faces substantially perpendicular to the heat transfer faces and the first side faces, the metal body including a central through hole extending between the two first side faces for fluid to flow from the interior of the computer device into an opening of the through hole in a first side face and from an opening of the through hole in the opposite first side face into the interior of the device. 2. Inrichting volgens conclusie 1, waarbij het centrale doorgaande gat een dwarsdoorsnede heeft die voldoende groot is zodat tijdens gebruik het door het doorgaande gat stromende fluïdum verantwoordelijk is voor ten minste het grootste deel van het koelvermogen voor het metalen lichaam van de heatsink en daardoor van de componenten.Device as claimed in claim 1, wherein the central through-hole has a cross-section which is sufficiently large that during use the fluid flowing through the through-hole is responsible for at least the majority of the cooling capacity for the metal body of the heat sink and thereby of the components. 3. Inrichting volgens conclusie 1 of 2, waarbij het genoemde doorgaande gat een in hoofdzaak rechthoekige dwarsdoorsnede heeft, waarbij de lange randen van de genoemde rechthoekige dwarsdoorsnede zich evenwijdig aan de warmteoverdrachtvlakken uitstrekken.Device as claimed in claim 1 or 2, wherein said through hole has a substantially rectangular cross-section, wherein the long edges of said rectangular cross-section extend parallel to the heat transfer surfaces. 4. Inrichting volgens conclusie 1, 2 of 3, waarbij zich metalen koel vinnen uitstrekken van de wanden van het doorgaande gat tot in het inwendige van het doorgaande gat, waarbij de koelvinnen zich evenwijdig aan de as van hel doorgaande gat uitstrekken, zodat zij de doorstroom niet belemmeren.4. Device as claimed in claim 1, 2 or 3, wherein metal cooling fins extend from the walls of the through hole into the interior of the through hole, wherein the cooling fins extend parallel to the axis of the through hole, so that they do not impede flow. 5. Inrichting volgens conclusie 4, met het kenmerk, dat de koelvinnen het doorgaande gat in een veelheid in hoofdzaak gescheiden sub-gaten verdelen.Device according to claim 4, characterized in that the cooling fins divide the through hole into a plurality of substantially separate sub-holes. 6. Inrichting volgens een van de voorgaande conclusies, waarbij het metalen lichaam bestaat uit tw'ee afzonderlijke helften, waarbij elke helft een van de w'armleoverdrachtvlakken en een helft van de doorstroomopening omvat, die zodanig zijn gemonteerd dat de helften van de doorstroomopening tegenover elkaar staan.6. Device as claimed in any of the foregoing claims, wherein the metal body consists of two separate halves, each half comprising one of the heat transfer surfaces and one half of the flow opening mounted so that the halves of the flow opening opposite stand together. 7. Inrichting volgens conclusie 4, met het kenmerk, dat onderbrekingen in de koelvinnen zijn gevormd.Device according to claim 4, characterized in that interruptions are formed in the cooling fins. 8. Inrichting volgens een van de voorgaande conclusies, waarbij een PCB op elk van de componenten is gemonteerd, waarbij het metalen lichaam is gesandwicht tussen ten minste twee van de PCB's die zich evenwijdig aan elkaar uitstrekken.Device according to any of the preceding claims, wherein a PCB is mounted on each of the components, the metal body being balanced between at least two of the PCBs extending parallel to each other. 9. Inrichting volgens een van de voorgaande conclusies, waarbij de componenten grafische verwerkingseenheden, centrale verwerkingseenheden, chips of elektronische componenten zijn.Device according to any of the preceding claims, wherein the components are graphic processing units, central processing units, chips or electronic components. 10. Inrichting volgens een van de voorgaande conclusies, waarbij de computerinrichting een veelheid gesandwichte heatsink en componenten omvat, waarbij de assen van de doorgaande gaten van de heatsinks zijn uitgelijnd, zodat fluïdum door de gaten kan stromen langs hun gemeenschappelijke as.Device according to any of the preceding claims, wherein the computer device comprises a plurality of sand-weighted heat sink and components, the axes of the through holes of the heat sinks being aligned, so that fluid can flow through the holes along their common axis. 11. Inrichting volgens een van de voorgaande conclusies, waarbij de as van het doorgaande gat zich verticaal uilstrekt.Device as claimed in any of the foregoing claims, wherein the axis of the through hole extends vertically. 12. hui cluing volgens een van de voorgaande conclusies, waarbij de elektronische inrichting een ondergedompelde elektronische inrichting is, waarbij het fluïdum een vloeistof is, zoals olie.A housing as claimed in any one of the preceding claims, wherein the electronic device is a submerged electronic device, wherein the fluid is a liquid, such as oil. 13. Een gesandwichte elektronische eenheid omvattende ten minste twee warmteproducerende elektronische componenten die in contact zijn met een heatsink die is ingericht voor het afvoeren van warmte die wordt gegenereerd door de componenten, waarbij de heatsink een metalen lichaam omvat dat is gesandwicht tussen de ten minste twee componenten, waarbij hel metalen lichaam zes vlakken heeft, omvattende twee tegenover elkaar liggende warmteoverdrachtsoppervlakken waaraan de componenten zijn bevestigd, twee tegenover elkaar liggende eerste zijvlakken in hoofdzaak loodrecht daarop, en twee tegenover elkaar gelegen tweede zijvlakken in hoofdzaak loodrecht op de warniteoverdrachtvlakken en de eerste zijvlakken, waarbij het metalen lichaam een centraal doorgaand gat omvat dat zich uitstrekl tussen de twee eerste zijvlakken om fluïdum te laten stromen vanuit het inwendige van een computerinrichting naar een opening van het doorgaande gat in een eerste zijvlak en uit een opening van de doorgaande opening gat in het tegenoverliggende eerste zijvlak tot in het inwendige van de computerinrichting.A sand-weighted electronic unit comprising at least two heat-producing electronic components that are in contact with a heat sink that is adapted to dissipate heat generated by the components, the heat sink comprising a metal body that is balanced between the at least two components, wherein the metal body has six faces, comprising two opposed heat transfer surfaces to which the components are attached, two opposite first side faces substantially perpendicular thereto, and two opposite second side faces substantially perpendicular to the warnite transfer faces and the first side faces wherein the metal body includes a central through hole extending between the two first side faces for fluid to flow from the interior of a computer device to an opening of the through hole in a first side face and out of an opening of the through The opening hole in the opposite first side face into the interior of the computer device. 14. Een heatsink die is ingericht om warmte af te voeren die wordt gegenereerd door warmteproducerende componenten, waarbij de heatsink een metalen lichaam omvat, waarbij het metalen lichaam zes vlakken heeft, omvattende twee tegenover elkaar gelegen warmteoverdrachtsvlakken waaraan de componenten kunnen worden bevestigd, twee tegenover elkaar gelegen eerste zijvlakken in hoofdzaak loodrecht daarop en tw'ee tegenover elkaar gelegen tw'eede zijvlakken in hoofdzaak loodrecht op de warmteoverdrachtsvlakken en de eerste zijvlakken, waarbij het metalen lichaam een centraal doorgaand gat omvat dat zich uitstrekt tussen de twee eerste zijvlakken om fluïdum te laten stromen van het inwendige vanuit een computerinrichting naar een opening van het doorgaande gat in een eerste zijvlak en uit een opening van het doorgaande gat in de tegenoverliggende eerste zijvlak tot in het inwendige van de computerinrichting.14. A heat sink adapted to dissipate heat generated by heat-producing components, the heat sink comprising a metal body, the metal body having six planes, comprising two opposed heat transfer surfaces to which the components can be attached, two opposite first side surfaces substantially perpendicular thereto and two opposite side surfaces substantially perpendicular to the heat transfer surfaces and the first side surfaces, the metal body including a central through hole extending between the two first side surfaces to provide fluid flowing from the interior of a computer device to an opening of the through hole in a first side face and from an opening of the through hole in the opposite first side face into the interior of the computer device.
NL2019860A 2017-11-07 2017-11-07 Device comprising a sandwiched electronic unit comprising a heat sink NL2019860B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
NL2019860A NL2019860B1 (en) 2017-11-07 2017-11-07 Device comprising a sandwiched electronic unit comprising a heat sink
PCT/EP2018/079948 WO2019091856A1 (en) 2017-11-07 2018-11-01 Device comprising a sandwiched electronic unit comprising a heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2019860A NL2019860B1 (en) 2017-11-07 2017-11-07 Device comprising a sandwiched electronic unit comprising a heat sink

Publications (1)

Publication Number Publication Date
NL2019860B1 true NL2019860B1 (en) 2019-05-13

Family

ID=60766107

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2019860A NL2019860B1 (en) 2017-11-07 2017-11-07 Device comprising a sandwiched electronic unit comprising a heat sink

Country Status (2)

Country Link
NL (1) NL2019860B1 (en)
WO (1) WO2019091856A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021197968A1 (en) 2020-03-30 2021-10-07 Shell Internationale Research Maatschappij B.V. Thermal management system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2081606A1 (en) * 1991-10-31 1993-05-01 Hugh M. Collins Electronic unit
CA2081607A1 (en) * 1991-10-31 1993-05-01 Tristano F. Nicoletta Electronic devices
EP0862210A2 (en) * 1997-01-31 1998-09-02 Thermalloy Incorporated Heat dissipating assembly
WO2010019517A1 (en) * 2008-08-11 2010-02-18 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
WO2016008509A1 (en) * 2014-07-15 2016-01-21 Abb Technology Ltd Electric module for improved thermal management in electrical equipments

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2081606A1 (en) * 1991-10-31 1993-05-01 Hugh M. Collins Electronic unit
CA2081607A1 (en) * 1991-10-31 1993-05-01 Tristano F. Nicoletta Electronic devices
EP0862210A2 (en) * 1997-01-31 1998-09-02 Thermalloy Incorporated Heat dissipating assembly
WO2010019517A1 (en) * 2008-08-11 2010-02-18 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
WO2016008509A1 (en) * 2014-07-15 2016-01-21 Abb Technology Ltd Electric module for improved thermal management in electrical equipments

Also Published As

Publication number Publication date
WO2019091856A1 (en) 2019-05-16

Similar Documents

Publication Publication Date Title
US7400505B2 (en) Hybrid cooling system and method for a multi-component electronics system
US7764494B2 (en) Liquid cooled module
JP7346736B2 (en) heat sink for liquid cooling
US8270166B2 (en) Heat dissipation device for electronic apparatus
EP2626899A2 (en) Heat dissipating module
US10785864B2 (en) Printed circuit board with heat sink
US20190215988A1 (en) Vapor chamber and heat dissipation device
US20120318481A1 (en) Heat dissipation device
NL2019860B1 (en) Device comprising a sandwiched electronic unit comprising a heat sink
US20060203451A1 (en) Heat dissipation apparatus with second degree curve shape heat pipe
US9320176B2 (en) Heat dissipation system and rack-mount server using the same
EP3739285B1 (en) Heat dissipation device and board card
US9111910B2 (en) Heat dissipation device with fin set
CN103616789B (en) Be applicable to the casing of thermoelectric cooling type InGaAs short-wave infrared camera
US10672683B2 (en) Heat transfer adapter plate
US20120312509A1 (en) Heat dissipation device
JP7156706B2 (en) Cooling system, electronics
US11452234B2 (en) Device for cooling high-performance computers or high-performance circuits, with temperature control
US12080626B1 (en) System and method for providing direct silicon footprint microfluidic cooling for electronics
RU2604097C2 (en) Heat-conducting base of a radioelectronic unit
US20160334167A1 (en) Heat sink and method for manufacturing the same
US8934249B2 (en) Electronic device with heat dissipation assembly
US10345055B2 (en) Heat-dissipating cooling pad
US20110299252A1 (en) Expansion card assembly and heat sink thereof
EP3446555B1 (en) A cooling system