NL2003266A1 - Multi nozzle proximity sensor employing common sensing and nozzle shaping. - Google Patents
Multi nozzle proximity sensor employing common sensing and nozzle shaping. Download PDFInfo
- Publication number
- NL2003266A1 NL2003266A1 NL2003266A NL2003266A NL2003266A1 NL 2003266 A1 NL2003266 A1 NL 2003266A1 NL 2003266 A NL2003266 A NL 2003266A NL 2003266 A NL2003266 A NL 2003266A NL 2003266 A1 NL2003266 A1 NL 2003266A1
- Authority
- NL
- Netherlands
- Prior art keywords
- nozzle
- proximity sensor
- shaping
- sensor employing
- common sensing
- Prior art date
Links
- 238000007493 shaping process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8790208P | 2008-08-11 | 2008-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL2003266A1 true NL2003266A1 (nl) | 2010-02-15 |
Family
ID=41652613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2003266A NL2003266A1 (nl) | 2008-08-11 | 2009-07-23 | Multi nozzle proximity sensor employing common sensing and nozzle shaping. |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8390782B2 (nl) |
| JP (1) | JP4922363B2 (nl) |
| NL (1) | NL2003266A1 (nl) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014507810A (ja) * | 2011-03-11 | 2014-03-27 | エーエスエムエル ネザーランズ ビー.ブイ. | 静電クランプ装置およびリソグラフィ装置 |
| JP5915103B2 (ja) * | 2011-11-11 | 2016-05-11 | セイコーエプソン株式会社 | 物理量検出器 |
| NL2017595A (en) * | 2015-11-10 | 2017-05-26 | Asml Netherlands Bv | Proximity sensor, lithographic apparatus and device manufacturing method |
| NL2017846A (en) * | 2015-12-21 | 2017-06-27 | Asml Netherlands Bv | Height Measurement Apparatus |
| CN115138761A (zh) * | 2022-07-07 | 2022-10-04 | 江苏大学 | 一种脉冲式热空化射流微成形装置及成形方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56111998A (en) * | 1980-02-11 | 1981-09-04 | Tokyo Shibaura Electric Co | Pressure signal transmitter |
| US4550592A (en) | 1984-05-07 | 1985-11-05 | Dechape Michel L | Pneumatic gauging circuit |
| JPH0762729B2 (ja) * | 1986-03-31 | 1995-07-05 | 株式会社日立製作所 | 自動焦点調節装置 |
| JPS639805A (ja) * | 1986-06-30 | 1988-01-16 | Hitachi Electronics Eng Co Ltd | 流体噴射による位置決め装置 |
| JPH0297643A (ja) * | 1988-09-30 | 1990-04-10 | Kubota Ltd | クリープ抵抗の高い耐熱鋳造合金 |
| US4953388A (en) | 1989-01-25 | 1990-09-04 | The Perkin-Elmer Corporation | Air gauge sensor |
| EP0460357A3 (en) * | 1990-06-08 | 1992-07-29 | Landis & Gyr Betriebs Ag | Device for optical measurement of pressure differences |
| US5163326A (en) | 1991-03-08 | 1992-11-17 | Rosemount Inc. | Line pressure compensator for a pressure transducer |
| JPH07135135A (ja) * | 1993-06-21 | 1995-05-23 | Hitachi Ltd | 半導体製造装置 |
| JP3659529B2 (ja) * | 1996-06-06 | 2005-06-15 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
| US5825043A (en) * | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
| JP2002277384A (ja) * | 2001-03-19 | 2002-09-25 | Ishikawajima Inspection & Instrumentation Co | 欠陥検出方法及び装置 |
| EP1431710A3 (en) * | 2002-12-19 | 2004-09-15 | ASML Holding N.V. | Liquid flow proximity sensor for use in immersion lithography |
| US7010958B2 (en) * | 2002-12-19 | 2006-03-14 | Asml Holding N.V. | High-resolution gas gauge proximity sensor |
| US6945116B2 (en) * | 2003-03-19 | 2005-09-20 | California Institute Of Technology | Integrated capacitive microfluidic sensors method and apparatus |
| US7272976B2 (en) * | 2004-03-30 | 2007-09-25 | Asml Holdings N.V. | Pressure sensor |
| US7021120B2 (en) * | 2004-04-28 | 2006-04-04 | Asml Holding N.V. | High resolution gas gauge proximity sensor |
| US20070074579A1 (en) * | 2005-10-03 | 2007-04-05 | Honeywell International Inc. | Wireless pressure sensor and method of forming same |
| US20070151327A1 (en) | 2005-12-29 | 2007-07-05 | Asml Holding N.V. | Gas gauge proximity sensor with internal gas flow control |
-
2009
- 2009-07-23 NL NL2003266A patent/NL2003266A1/nl not_active Application Discontinuation
- 2009-08-04 JP JP2009181211A patent/JP4922363B2/ja not_active Expired - Fee Related
- 2009-08-11 US US12/539,190 patent/US8390782B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP4922363B2 (ja) | 2012-04-25 |
| US8390782B2 (en) | 2013-03-05 |
| JP2010050449A (ja) | 2010-03-04 |
| US20100033705A1 (en) | 2010-02-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AD1A | A request for search or an international type search has been filed | ||
| WDAP | Patent application withdrawn |
Effective date: 20100705 |