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MY184645A - A testing and taping machine - Google Patents

A testing and taping machine

Info

Publication number
MY184645A
MY184645A MYPI2015700991A MYPI2015700991A MY184645A MY 184645 A MY184645 A MY 184645A MY PI2015700991 A MYPI2015700991 A MY PI2015700991A MY PI2015700991 A MYPI2015700991 A MY PI2015700991A MY 184645 A MY184645 A MY 184645A
Authority
MY
Malaysia
Prior art keywords
testing
taping
semiconductor devices
tables
taping machine
Prior art date
Application number
MYPI2015700991A
Inventor
Abdul Razak Bukhari
Original Assignee
Intotest Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intotest Sdn Bhd filed Critical Intotest Sdn Bhd
Priority to MYPI2015700991A priority Critical patent/MY184645A/en
Priority to PCT/MY2016/050017 priority patent/WO2016159756A1/en
Publication of MY184645A publication Critical patent/MY184645A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0475—Sockets for IC's or transistors for TAB IC's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention discloses an apparatus for testing and taping semiconductor devices comprises: at least two rotary testing tables (100, 200), each carrying at least one testing station (107, 207) for testing the semiconductor devices; a feeding means (101, 201) associated to each testing tables (100, 200) for feeding the semiconductor devices to its designated testing table (100, 200); a rotary taping table (300) carrying at least one taping device (304, 305, 306, 307, 308) for taping the semiconductor devices; means (400, 500) for transferring the semiconductor devices from the testing tables (100, 200) to the taping table (300); wherein the transfer of the semiconductor devices from the testing tables (100, 200) to the taping table (300) are synchronized in a way such that the semiconductor devices do not stack on the taping table (300). (Figure 1)
MYPI2015700991A 2015-03-27 2015-03-27 A testing and taping machine MY184645A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
MYPI2015700991A MY184645A (en) 2015-03-27 2015-03-27 A testing and taping machine
PCT/MY2016/050017 WO2016159756A1 (en) 2015-03-27 2016-03-24 A testing and taping machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2015700991A MY184645A (en) 2015-03-27 2015-03-27 A testing and taping machine

Publications (1)

Publication Number Publication Date
MY184645A true MY184645A (en) 2021-04-13

Family

ID=57005168

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015700991A MY184645A (en) 2015-03-27 2015-03-27 A testing and taping machine

Country Status (2)

Country Link
MY (1) MY184645A (en)
WO (1) WO2016159756A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107776942B (en) * 2017-11-24 2023-06-13 深圳市标谱半导体股份有限公司 Method for braiding by using double turntables at high speed and double turntables at high speed
CN114368504B (en) * 2022-01-18 2025-04-08 厦门海宏信自动化设备有限公司 Automatic taping packaging machine
CN118579307B (en) * 2024-08-07 2024-11-29 江苏海纳电子科技有限公司 Semiconductor chip taping machine

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3534590B2 (en) * 1997-11-05 2004-06-07 東洋製罐株式会社 Starwheel merging supply device
FR2794731B1 (en) * 1999-06-14 2001-08-03 Sidel Sa CONVEYING SYSTEM AND BLOW MOLDING INSTALLATION FOR CONTAINERS
JP2001228098A (en) * 2000-02-14 2001-08-24 Sony Corp Inspection and taping equipment
MY129418A (en) * 2001-06-29 2007-03-30 Canon Machinery Inc Composite processing method and composite processsing apparatus for leadless semiconductor devices
JP5500605B2 (en) * 2009-10-20 2014-05-21 上野精機株式会社 Classification transport apparatus, classification transport method, and program

Also Published As

Publication number Publication date
WO2016159756A1 (en) 2016-10-06

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