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MY158508A - Bonding capillary - Google Patents

Bonding capillary

Info

Publication number
MY158508A
MY158508A MYPI2013003417A MYPI2013003417A MY158508A MY 158508 A MY158508 A MY 158508A MY PI2013003417 A MYPI2013003417 A MY PI2013003417A MY PI2013003417 A MYPI2013003417 A MY PI2013003417A MY 158508 A MY158508 A MY 158508A
Authority
MY
Malaysia
Prior art keywords
bonding capillary
bonding
asperities
tip surface
capillary
Prior art date
Application number
MYPI2013003417A
Inventor
Jumpei Onishi
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of MY158508A publication Critical patent/MY158508A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

TO PROVIDE A BONDING CAPILLARY (110) THAT CAN MAINTAIN A SUFFICIENT BONDING STRENGTH FOR A LONG TIME. PROVIDED IS A BONDING CAPILLARY (110) INCLUDING A BODY (10) HAVING A TIP SURFACE (50) THAT PERFORMS WIRE BONDING. THE TIP SURFACE (50) HAS MICROSCOPIC ASPERITIES. PEAKS OF THE ASPERITIES ARE LESS SHARP THAN VALLEYS OF THE ASPERITIES. IN THE BONDING CAPILLARY (110), WHEN SEEN IN A DIRECTION PERPENDICULAR TO THE TIP SURFACE (50), THE AREA OF THE PEAKS IS GREATER THAN THE AREA OF THE VALLEYS. (FIG. 1)
MYPI2013003417A 2012-09-26 2013-09-20 Bonding capillary MY158508A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012212184 2012-09-26
JP2013126818A JP5510691B2 (en) 2012-09-26 2013-06-17 Bonding capillary

Publications (1)

Publication Number Publication Date
MY158508A true MY158508A (en) 2016-10-14

Family

ID=50786341

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013003417A MY158508A (en) 2012-09-26 2013-09-20 Bonding capillary

Country Status (4)

Country Link
JP (1) JP5510691B2 (en)
MY (1) MY158508A (en)
PH (1) PH12013000287A1 (en)
TW (1) TWI466750B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6126144B2 (en) * 2014-06-30 2017-05-10 Toto株式会社 Bonding capillary
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
JP6064308B2 (en) * 2015-07-03 2017-01-25 Toto株式会社 Bonding capillary
WO2017006880A1 (en) * 2015-07-03 2017-01-12 Toto株式会社 Bonding capillary
KR20220026611A (en) 2016-08-08 2022-03-04 에이에스엠엘 네델란즈 비.브이. Electron emitter and method of fabricating same
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
JP7407751B2 (en) * 2021-01-27 2024-01-04 三菱電機株式会社 Wire bonding equipment and semiconductor device manufacturing method
CN114309920A (en) * 2021-12-23 2022-04-12 潮州三环（集团）股份有限公司 Ceramic cleaver and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7389905B2 (en) * 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US6910612B2 (en) * 2001-07-17 2005-06-28 Kulicke & Soffa Investments, Inc. Capillary with contained inner chamfer
TWI229021B (en) * 2002-06-12 2005-03-11 Shi-Tong Yang Welding head of spot welding machine
JP5595731B2 (en) * 2006-07-03 2014-09-24 クリック アンド ソッファ インダストリーズ、インク． Bonding tool with improved finish

Also Published As

Publication number Publication date
JP2014082450A (en) 2014-05-08
JP5510691B2 (en) 2014-06-04
TW201412448A (en) 2014-04-01
PH12013000287B1 (en) 2015-04-06
TWI466750B (en) 2015-01-01
PH12013000287A1 (en) 2015-04-06

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