[go: up one dir, main page]

MX343692B - Bomba de calor mecanica para un alojamiento electrico. - Google Patents

Bomba de calor mecanica para un alojamiento electrico.

Info

Publication number
MX343692B
MX343692B MX2014005981A MX2014005981A MX343692B MX 343692 B MX343692 B MX 343692B MX 2014005981 A MX2014005981 A MX 2014005981A MX 2014005981 A MX2014005981 A MX 2014005981A MX 343692 B MX343692 B MX 343692B
Authority
MX
Mexico
Prior art keywords
heat pump
electrical
electrical enclosure
electrical housing
mechanical heat
Prior art date
Application number
MX2014005981A
Other languages
English (en)
Other versions
MX2014005981A (es
Inventor
Kyle Steven Barna
Original Assignee
Cooper Technologies Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooper Technologies Co filed Critical Cooper Technologies Co
Publication of MX2014005981A publication Critical patent/MX2014005981A/es
Publication of MX343692B publication Critical patent/MX343692B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation
    • H02B1/565—Cooling; Ventilation for cabinets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)

Abstract

Se proporciona un sistema para transferir calor de un cierre eléctrico. Un cierre eléctrico defina un área de alojamiento en la cual uno o más dispositivos se almacenan. Una bomba de calor se extiende a través del cierre eléctrico, la bomba de calor que define un canal configurado para comunicar el fluido para transferir calor de uno o más dispositivos eléctricos. El cierre eléctrico se sella considerablemente del canal de la bomba de calor y de otras áreas fuera del cierre eléctrico.
MX2014005981A 2011-11-16 2012-11-15 Bomba de calor mecanica para un alojamiento electrico. MX343692B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/297,859 US8611088B2 (en) 2011-11-16 2011-11-16 Mechanical heat pump for an electrical housing
PCT/US2012/065303 WO2013074807A1 (en) 2011-11-16 2012-11-15 Mechanical heat pump for an electrical housing

Publications (2)

Publication Number Publication Date
MX2014005981A MX2014005981A (es) 2014-08-27
MX343692B true MX343692B (es) 2016-11-18

Family

ID=48280448

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014005981A MX343692B (es) 2011-11-16 2012-11-15 Bomba de calor mecanica para un alojamiento electrico.

Country Status (6)

Country Link
US (1) US8611088B2 (es)
CN (1) CN104094681B (es)
CA (1) CA2855833C (es)
DE (1) DE112012004788T5 (es)
MX (1) MX343692B (es)
WO (1) WO2013074807A1 (es)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9429151B2 (en) * 2011-05-17 2016-08-30 Carrier Corporation Variable frequency drive heat sink assembly
US11026347B2 (en) * 2012-12-21 2021-06-01 Smart Embedded Computing, Inc. Configurable cooling for rugged environments
TW201443383A (zh) * 2013-05-08 2014-11-16 Hon Hai Prec Ind Co Ltd 導風罩
GB201313742D0 (en) * 2013-07-31 2013-09-11 Sasie Ltd Energy system
JP6337547B2 (ja) * 2014-03-20 2018-06-06 富士通株式会社 電子機器筐体
US9578786B1 (en) * 2014-06-10 2017-02-21 Amazon Technologies, Inc. Computer system with bypass air plenum
CN104456763A (zh) * 2014-10-31 2015-03-25 华为技术有限公司 空调室外机风机驱动器的散热结构及空调室外机
ES2667195T3 (es) * 2014-11-04 2018-05-10 Abb Schweiz Ag Dispositivo eléctrico
WO2016094150A1 (en) 2014-12-10 2016-06-16 Graftech International Holdings Inc. Flexible graphite sheet support structure and thermal management arrangement
FR3030181B1 (fr) * 2014-12-11 2018-03-30 Thales Boitier d'equipement electronique embarque et calculateur avionique comprenant un tel boitier
US9585285B2 (en) * 2015-01-20 2017-02-28 Microsoft Technology Licensing, Llc Heat dissipation structure for an electronic device
CN106256176B (zh) * 2015-04-03 2017-12-05 三菱电机株式会社 电子设备
JP6651725B2 (ja) * 2015-07-24 2020-02-19 日本電気株式会社 筐体、及び電子機器
US10032693B2 (en) * 2015-10-20 2018-07-24 General Electric Company Heat transfer chassis and method for forming the same
FR3047870B1 (fr) * 2016-02-12 2018-03-16 Alstom Transport Technologies Dispositif de refroidissement d'un coffre comportant au moins un equipement electrique, chaine de traction et vehicule electrique de transports associes
WO2017218614A1 (en) * 2016-06-15 2017-12-21 Hunter Fan Company Ceiling fan system and electronics housing
JP6843560B2 (ja) * 2016-09-02 2021-03-17 池上通信機株式会社 ヒートホール式放熱機構
US10849252B2 (en) * 2018-04-18 2020-11-24 Delta Electronics, Inc. Converter
CN108598949A (zh) * 2018-04-25 2018-09-28 张宝泽 一种散热式电力设备箱
US10648744B2 (en) * 2018-08-09 2020-05-12 The Boeing Company Heat transfer devices and methods for facilitating convective heat transfer with a heat source or a cold source
EP3629688A1 (de) * 2018-09-27 2020-04-01 Siemens Aktiengesellschaft Stromrichter mit einem separaten innenraum
GB2584117A (en) * 2019-05-22 2020-11-25 Comet Ag Generator
CN110366357A (zh) * 2019-07-17 2019-10-22 中车株洲电力机车有限公司 一种用于车辆的电源散热装置及其控制方法
US11943893B2 (en) * 2019-10-26 2024-03-26 Vertiv Corporation Electronics equipment cabinets for housing electronic devices
CN214112314U (zh) * 2020-10-16 2021-09-03 阳光电源股份有限公司 一种箱体以及充电桩
GB202101678D0 (en) * 2021-02-07 2021-03-24 Octopus Energy Ltd Methods and systems and apparatus to support reduced energy and water usage
CN113133279B (zh) * 2021-03-26 2022-10-25 联想(北京)有限公司 电子设备
EP4124189A1 (en) * 2021-07-21 2023-01-25 HENSOLDT Sensors GmbH Closed housing for an electronic component
BE1029900B1 (de) * 2021-11-05 2023-06-05 Phoenix Contact Gmbh & Co Gehäuse zur Aufnahme einer elektrischen Wärmequelle
JP2024094771A (ja) * 2022-12-28 2024-07-10 株式会社明電舎 盤構造
US20250151225A1 (en) * 2023-11-02 2025-05-08 Channell Commercial Corporation Vented pedestal housing

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1119273A (en) * 1965-11-10 1968-07-10 Gen Electric Co Ltd Improvements in or relating to electrical apparatus
US4102475A (en) 1977-09-27 1978-07-25 S & C Electric Company Tamper-resistant enclosure for electrical equipment
US4520425A (en) * 1982-08-12 1985-05-28 Mitsubishi Denki Kabushiki Kaisha Control apparatus with improved structure for cooling circuit elements
JPS59158389U (ja) * 1983-04-08 1984-10-24 三菱電機株式会社 制御装置
US4881822A (en) 1988-03-28 1989-11-21 Ridenour Ralph Gaylord Outdoor temperature sensing assembly
DE4015030C1 (es) * 1990-05-10 1991-11-21 Bicc-Vero Elektronics Gmbh, 2800 Bremen, De
JP2713819B2 (ja) * 1991-07-19 1998-02-16 株式会社テック ハンディバーコードリーダ
US5218516A (en) * 1991-10-31 1993-06-08 Northern Telecom Limited Electronic module
US5189256A (en) 1991-11-18 1993-02-23 Keptel, Inc. Apparatus for coiling and storing conductors in a circular shape
JPH05298999A (ja) * 1992-04-21 1993-11-12 Fuji Electric Co Ltd 回路遮断器の開閉機構
US5370551A (en) 1994-01-07 1994-12-06 Molex Incorporated Electrical receptacle assembly
SE504430C2 (sv) * 1995-06-20 1997-02-10 Ericsson Telefon Ab L M Magasin
US5823378A (en) 1997-03-27 1998-10-20 Gseg Llc Breather vent for electrical enclosure
US5832988A (en) * 1997-08-06 1998-11-10 Lucent Technologies, Inc. Heat exchanger for outdoor equipment enclosures
JPH11261265A (ja) * 1998-03-12 1999-09-24 Nec Corp 密閉型装置の放熱構造
JP2000125571A (ja) * 1998-10-12 2000-04-28 Nissin Electric Co Ltd 電力変換装置
JP2001148588A (ja) * 1999-11-24 2001-05-29 Olympus Optical Co Ltd 工作機械の放熱装置
US6365826B1 (en) 1999-12-22 2002-04-02 General Electric Company Waterproof enclosure for electrical devices
US6761211B2 (en) 2000-03-14 2004-07-13 Delphi Technologies, Inc. High-performance heat sink for electronics cooling
JP2001267771A (ja) * 2000-03-17 2001-09-28 Hitachi Ltd 電子装置
JP2001291982A (ja) * 2000-04-06 2001-10-19 Mitsubishi Electric Corp 自然空冷式密閉型電子機器筐体
US6653562B2 (en) 2001-10-18 2003-11-25 Pent Products, Inc. Portable electrical unit
CA2361970A1 (en) * 2001-11-14 2003-05-14 Catena Networks Canada Inc. A system and method for providing passive cooling of a cabinet
JP3609370B2 (ja) 2001-11-16 2005-01-12 本田技研工業株式会社 高圧電装ボックス構造
US6580608B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Method and apparatus for thermally controlling multiple electronic components
TW592029B (en) * 2003-04-11 2004-06-11 Delta Electronics Inc Electronic apparatus with natural convection structure
TW592031B (en) * 2003-06-18 2004-06-11 Delta Electronics Inc Electronic apparatus with natural convection structure
US7423871B2 (en) * 2003-11-14 2008-09-09 Det International Holding Limited Electric device with improved cooling and casing therefor
JP4176005B2 (ja) 2003-12-22 2008-11-05 矢崎総業株式会社 電気接続箱の防水構造
EP1817867A2 (en) 2004-01-12 2007-08-15 Ortronics, Inc. Wi-fi access point device and system
JP2005254345A (ja) * 2004-03-09 2005-09-22 Ngk Insulators Ltd ハニカム構造体成形用口金の製造方法
JPWO2006043325A1 (ja) 2004-10-21 2008-05-22 三菱電機株式会社 屋外設置機器
US7312990B2 (en) 2005-04-25 2007-12-25 Elma Electronic Inc. Electrical enclosure including accessible fan tray assembly
US7593229B2 (en) * 2006-03-31 2009-09-22 Hong Kong Applied Science & Technology Research Institute Co. Ltd Heat exchange enhancement
US7403392B2 (en) 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
US7554808B2 (en) 2006-06-22 2009-06-30 Intel Corporation Heat sink with thermoelectric module
EP2034387B1 (de) * 2007-09-07 2011-07-27 Kontron AG Passiv gekühlter Computer
EP2225923B1 (en) * 2007-11-28 2012-02-08 voltwerk electronics GmbH Inverter
DE102007058458B4 (de) 2007-12-04 2010-08-26 Adc Gmbh Doppelwandiges Gehäuse mit wärmeabführenden Funktionsraumwänden
US7724521B2 (en) 2008-06-11 2010-05-25 Adc Telecommunications, Inc. Systems and methods for Venturi fan-assisted cooling
US7795533B2 (en) 2008-07-03 2010-09-14 Panduit Corp. In-ceiling zone cabling enclosure
EP2332399B1 (en) 2008-08-29 2012-01-04 Heyco, Inc. Junction box for photovoltaic systems
US7872864B2 (en) * 2008-09-30 2011-01-18 Intel Corporation Dual chamber sealed portable computer
JP2012527767A (ja) 2009-05-22 2012-11-08 ソラレッジ テクノロジーズ リミテッド 電気絶縁された熱放散接続箱
US20110108250A1 (en) * 2009-11-09 2011-05-12 Alex Horng Heat Dissipating device

Also Published As

Publication number Publication date
DE112012004788T5 (de) 2014-08-07
MX2014005981A (es) 2014-08-27
US8611088B2 (en) 2013-12-17
US20130120934A1 (en) 2013-05-16
CN104094681B (zh) 2015-09-30
CA2855833C (en) 2014-12-02
CN104094681A (zh) 2014-10-08
CA2855833A1 (en) 2013-05-23
WO2013074807A1 (en) 2013-05-23

Similar Documents

Publication Publication Date Title
MX343692B (es) Bomba de calor mecanica para un alojamiento electrico.
TR201901104T4 (tr) İndirgenmiş basınçlı bir sargı ile arayüz oluşturmaya yönelik sistem.
IN2012DN06714A (es)
EP4318001A3 (en) Bypass mechanism
NZ583544A (en) Fibre-optic connection system and housing.
WO2012024471A3 (en) Systems and methods for power connection
HUE037199T2 (hu) LED modul tömítési technológia
EP3051226A4 (en) Cooling system for power electronic device, and distributed power generation system
EP2971764A4 (en) Submersible well fluid system
PL2941798T3 (pl) Obudowa złącza wtykowego szczelna względem otoczenia
EP3033504A4 (en) Turbine housing
EP3054515A4 (en) Fluid exchange membrane module
EP3012495A4 (en) Hermetic seal device
MX358905B (es) Fluido dielectrico con oligomero a base de farneseno.
IL230648A0 (en) Electric power source for an intravenous fluid heating system
EP3076467A4 (en) Cell stack device, module, and module housing device
EP2821439A4 (en) PROTECTION SWITCH CASE AND PROTECTION SWITCHES THEREOF
EP3042422A4 (en) High speed connector with sealed housing
GB2519242B (en) Seal assembly for an electric submersible pump housing
GB2530437B (en) Multi power launch system for pressure differential device
EP3021358A4 (en) Power semiconductor module
MX2015009456A (es) Celda de enfriamiento de gas.
IN2014DN10554A (es)
MX337430B (es) Carcasa de sensor para un medidor de fluido.
MX343789B (es) Dispositivos indicadores y metodos asociados.

Legal Events

Date Code Title Description
FG Grant or registration