MX2022008747A - Fuentes de energia electrica autonoma. - Google Patents
Fuentes de energia electrica autonoma.Info
- Publication number
- MX2022008747A MX2022008747A MX2022008747A MX2022008747A MX2022008747A MX 2022008747 A MX2022008747 A MX 2022008747A MX 2022008747 A MX2022008747 A MX 2022008747A MX 2022008747 A MX2022008747 A MX 2022008747A MX 2022008747 A MX2022008747 A MX 2022008747A
- Authority
- MX
- Mexico
- Prior art keywords
- power source
- electrical power
- conductor
- self
- contained electrical
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/378—Electrical supply
- A61N1/3785—Electrical supply generated by biological activity or substance, e.g. body movement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J45/00—Discharge tubes functioning as thermionic generators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/001—Energy harvesting or scavenging
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/34—Parallel operation in networks using both storage and other DC sources, e.g. providing buffering
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/008—Alleged electric or magnetic perpetua mobilia
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
- G01V1/16—Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
- H01L25/0652—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J2310/00—The network for supplying or distributing electric power characterised by its spatial reach or by the load
- H02J2310/10—The network having a local or delimited stationary reach
- H02J2310/20—The network being internal to a load
- H02J2310/23—The load being a medical device, a medical implant, or a life supporting device
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Biomedical Technology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Computer Networks & Wireless Communication (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Control Of Electric Motors In General (AREA)
- Heat-Pump Type And Storage Water Heaters (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Photovoltaic Devices (AREA)
Abstract
Se proporciona una fuente de energía eléctrica autónoma a escala de micras única y amigable con el ambiente para generar energía renovable o un complemento de energía renovable en sistemas electrónicos, dispositivos electrónicos y componentes de sistemas electrónicos. La fuente de energía eléctrica autónoma incluye un primer conductor con una superficie confrontada acondicionada para tener una baja función de trabajo, un segundo conductor con una superficie confrontada que tiene una función de trabajo comparativamente más alta y una capa dieléctrica de no más de 200 nm de espesor intercalada entre las superficies confrontadas respectivas del primer conductor y el segundo conductor. La fuente de energía eléctrica autónoma se configura para recolectar energía térmica mínima de cualquier fuente en un ambiente por encima del cero absoluto. También se proporciona un componente de fuente de energía eléctrica autónoma que incluye una pluralidad de elementos constituyentes de fuente de energía eléctrica autónoma conectados eléctricamente entre sí para aumentar una salida de energía de la fuente de energía eléctrica autónoma.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/484,054 US9893261B1 (en) | 2017-04-10 | 2017-04-10 | Structurally embedded and inhospitable environment systems and devices having autonomous electrical power sources |
| US15/484,033 US11605770B2 (en) | 2017-04-10 | 2017-04-10 | Autonomous electrical power sources |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2022008747A true MX2022008747A (es) | 2022-07-27 |
Family
ID=61148045
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2022014394A MX2022014394A (es) | 2017-04-10 | 2018-10-08 | Fuentes de energia electrica autonoma. |
| MX2022008747A MX2022008747A (es) | 2017-04-10 | 2018-10-08 | Fuentes de energia electrica autonoma. |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2022014394A MX2022014394A (es) | 2017-04-10 | 2018-10-08 | Fuentes de energia electrica autonoma. |
Country Status (4)
| Country | Link |
|---|---|
| US (8) | US9893261B1 (es) |
| AU (1) | AU2023202987A1 (es) |
| MX (2) | MX2022014394A (es) |
| WO (1) | WO2018190905A1 (es) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10559864B2 (en) | 2014-02-13 | 2020-02-11 | Birmingham Technologies, Inc. | Nanofluid contact potential difference battery |
| US9893261B1 (en) * | 2017-04-10 | 2018-02-13 | Face International Corporation | Structurally embedded and inhospitable environment systems and devices having autonomous electrical power sources |
| US9793317B1 (en) | 2016-04-09 | 2017-10-17 | Face International Corporation | Devices and systems incorporating energy harvesting components/devices as autonomous energy sources and as energy supplementation, and methods for producing devices and systems incorporating energy harvesting components/devices |
| US12201021B2 (en) | 2016-04-09 | 2025-01-14 | Face International Corporation | Methods for fabrication, manufacture and production of energy harvesting components and devices |
| US11980102B2 (en) | 2016-04-09 | 2024-05-07 | Face International Corporation | Systems and devices powered by autonomous electrical power sources |
| US9786718B1 (en) | 2016-04-09 | 2017-10-10 | Face International Corporation | Integrated circuit components incorporating energy harvesting components/devices, and methods for fabrication, manufacture and production of integrated circuit components incorporating energy harvesting components/devices |
| US10109781B1 (en) | 2017-04-10 | 2018-10-23 | Face International Corporation | Methods for fabrication, manufacture and production of an autonomous electrical power source |
| US11957922B2 (en) | 2016-04-09 | 2024-04-16 | Face International Corporation | Structurally embedded and inhospitable environment systems having autonomous electrical power sources |
| EP3803991A4 (en) | 2018-05-30 | 2021-07-14 | Board of Trustees of the University of Arkansas | ENERGY GENERATING DEVICES AND SENSORS AND METHODS FOR MANUFACTURING AND USING THEREOF |
| US11244816B2 (en) | 2019-02-25 | 2022-02-08 | Birmingham Technologies, Inc. | Method of manufacturing and operating nano-scale energy conversion device |
| US11101421B2 (en) | 2019-02-25 | 2021-08-24 | Birmingham Technologies, Inc. | Nano-scale energy conversion device |
| US10950706B2 (en) | 2019-02-25 | 2021-03-16 | Birmingham Technologies, Inc. | Nano-scale energy conversion device |
| US11124864B2 (en) | 2019-05-20 | 2021-09-21 | Birmingham Technologies, Inc. | Method of fabricating nano-structures with engineered nano-scale electrospray depositions |
| US11046578B2 (en) | 2019-05-20 | 2021-06-29 | Birmingham Technologies, Inc. | Single-nozzle apparatus for engineered nano-scale electrospray depositions |
| MX2022013285A (es) | 2020-04-22 | 2023-03-22 | Univ Of Arkansas Technology Ventures | Dispositivo para recolectar energia termica y vibratoria ambiental. |
| US11649525B2 (en) | 2020-05-01 | 2023-05-16 | Birmingham Technologies, Inc. | Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method |
| US11417506B1 (en) | 2020-10-15 | 2022-08-16 | Birmingham Technologies, Inc. | Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods |
| US11616186B1 (en) | 2021-06-28 | 2023-03-28 | Birmingham Technologies, Inc. | Thermal-transfer apparatus including thermionic devices, and related methods |
| CN114152981B (zh) * | 2021-12-03 | 2023-08-08 | 成都信息工程大学 | 一种势能波函数域地震资料品质因子估计方法 |
| WO2025165795A1 (en) * | 2024-01-29 | 2025-08-07 | Onstation Corporation | System and method for training ai selectively-autonomous, selectively-collaborative low-cost attritable aircraft (sa-sc-lcaa) |
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| US5637946A (en) | 1993-10-28 | 1997-06-10 | Lockheed Corporation | Thermally energized electrical power source |
| US6238812B1 (en) * | 1998-04-06 | 2001-05-29 | Paul M. Brown | Isotopic semiconductor batteries |
| US6120857A (en) | 1998-05-18 | 2000-09-19 | The Regents Of The University Of California | Low work function surface layers produced by laser ablation using short-wavelength photons |
| US6946596B2 (en) | 2002-09-13 | 2005-09-20 | Kucherov Yan R | Tunneling-effect energy converters |
| EP2057659A4 (en) * | 2006-08-30 | 2010-11-24 | Tempronics Inc | GREEN ELECTRODES SEPARATED BY A UNIFORM SPACE |
| WO2008089244A2 (en) | 2007-01-17 | 2008-07-24 | University Of Rochester | Frequency-addressable apparatus and methods for actuation of liquids |
| CN102272957A (zh) * | 2009-01-02 | 2011-12-07 | 坦普罗尼克斯公司 | 用于能量转换、电气开关和热控开关的设备 |
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| KR101774301B1 (ko) | 2011-12-16 | 2017-09-20 | 한국전자통신연구원 | 에너지 하베스팅 소자 및 그의 제조방법 |
| US9362565B2 (en) | 2012-04-04 | 2016-06-07 | Nokia Technologies Oy | Apparatus and associated methods |
| KR101402988B1 (ko) | 2012-06-13 | 2014-06-11 | 한국과학기술연구원 | 압전 복합체를 이용한 플렉서블 압전 에너지 하베스팅 소자의 제조 방법 및 이로부터 제조된 플렉서블 압전 에너지 하베스팅 소자 |
| US9865789B2 (en) | 2012-07-30 | 2018-01-09 | Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E. V. | Device and method for thermoelectronic energy conversion |
| WO2014116794A1 (en) | 2013-01-23 | 2014-07-31 | The Regents Of The University Of Michigan | Piezoelectric vibrational energy harvester |
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| SG10201408210UA (en) | 2013-11-22 | 2015-06-29 | Agency Science Tech & Res | Energy harvesting device and method for forming the same |
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| WO2015129442A1 (ja) | 2014-02-27 | 2015-09-03 | 国立大学法人 東京大学 | 振動発電素子 |
| TWI560916B (en) | 2014-07-31 | 2016-12-01 | Univ Nat Tsing Hua | Manufacturing process of the thermoelectric conversion element |
| US20160043260A1 (en) | 2014-08-11 | 2016-02-11 | Robert J. Nemanich | Solar Energy Conversion Apparatus, and Methods of Making and Using the Same |
| KR101670131B1 (ko) * | 2014-09-23 | 2016-10-28 | 한국과학기술원 | 코팅 대전층을 포함하는 접촉 대전 발전기 및 그 생성 방법 |
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| US9893261B1 (en) * | 2017-04-10 | 2018-02-13 | Face International Corporation | Structurally embedded and inhospitable environment systems and devices having autonomous electrical power sources |
-
2017
- 2017-04-10 US US15/484,054 patent/US9893261B1/en active Active
- 2017-10-09 WO PCT/US2017/055808 patent/WO2018190905A1/en not_active Ceased
-
2018
- 2018-02-12 US US15/894,902 patent/US10014461B1/en active Active
- 2018-07-01 US US16/024,905 patent/US10249810B2/en active Active
- 2018-10-08 MX MX2022014394A patent/MX2022014394A/es unknown
- 2018-10-08 MX MX2022008747A patent/MX2022008747A/es unknown
-
2019
- 2019-04-01 US US16/372,388 patent/US10600950B2/en active Active
-
2020
- 2020-03-23 US US16/827,658 patent/US10756249B2/en active Active
- 2020-08-24 US US17/001,558 patent/US11571583B2/en active Active
-
2023
- 2023-03-13 US US18/120,977 patent/US12048850B2/en active Active
- 2023-05-12 AU AU2023202987A patent/AU2023202987A1/en not_active Abandoned
-
2024
- 2024-07-26 US US18/785,118 patent/US20240382774A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018190905A1 (en) | 2018-10-18 |
| US10249810B2 (en) | 2019-04-02 |
| US20190229253A1 (en) | 2019-07-25 |
| US11571583B2 (en) | 2023-02-07 |
| US20200388744A1 (en) | 2020-12-10 |
| US20180323363A1 (en) | 2018-11-08 |
| US20240382774A1 (en) | 2024-11-21 |
| AU2023202987A1 (en) | 2023-06-01 |
| MX2022014394A (es) | 2022-12-02 |
| US10756249B2 (en) | 2020-08-25 |
| US20230215713A1 (en) | 2023-07-06 |
| US10014461B1 (en) | 2018-07-03 |
| US20200227615A1 (en) | 2020-07-16 |
| US12048850B2 (en) | 2024-07-30 |
| US10600950B2 (en) | 2020-03-24 |
| US9893261B1 (en) | 2018-02-13 |
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