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MX2016011506A - Sistemas de resina epoxi fotocurable. - Google Patents

Sistemas de resina epoxi fotocurable.

Info

Publication number
MX2016011506A
MX2016011506A MX2016011506A MX2016011506A MX2016011506A MX 2016011506 A MX2016011506 A MX 2016011506A MX 2016011506 A MX2016011506 A MX 2016011506A MX 2016011506 A MX2016011506 A MX 2016011506A MX 2016011506 A MX2016011506 A MX 2016011506A
Authority
MX
Mexico
Prior art keywords
epoxy resin
weight
groups
resin systems
photocurable epoxy
Prior art date
Application number
MX2016011506A
Other languages
English (en)
Other versions
MX388803B (es
Inventor
Hornung Martin
HAGENBUCHER Melanie
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Publication of MX2016011506A publication Critical patent/MX2016011506A/es
Publication of MX388803B publication Critical patent/MX388803B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B05D3/067—Curing or cross-linking the coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F15/00—Other methods of preventing corrosion or incrustation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2504/00—Epoxy polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C08L2203/162—Applications used for films sealable films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)

Abstract

La invención está dirigida a una composición de resina epoxi fotocurable que es dura y más flexible y contiene 30 a 90% en peso de al menos una resina epoxi aromática; 2 a 30% en peso de al menos un caucho de núcleo-corteza (CSR); hasta 20% en peso de al menos un flexibilizador que comprende grupos funcionales reactivos seleccionados de entre grupos de epoxi, grupos de carboxilato, grupos de amino y/o grupos de hidroxilo; y 1 a 4% en peso de al menos un fotoiniciador catiónico. También se describe el uso de dicha composición para sellar y/o revestir materiales así como los correspondientes procesos de revestimiento/sellado.
MX2016011506A 2014-03-07 2015-03-06 Sistemas de resina epoxi fotocurable. MX388803B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014204265 2014-03-07
PCT/EP2015/054697 WO2015132372A1 (de) 2014-03-07 2015-03-06 Photohärtbare epoxidharzsysteme

Publications (2)

Publication Number Publication Date
MX2016011506A true MX2016011506A (es) 2016-11-29
MX388803B MX388803B (es) 2025-03-20

Family

ID=52684212

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016011506A MX388803B (es) 2014-03-07 2015-03-06 Sistemas de resina epoxi fotocurable.

Country Status (8)

Country Link
US (1) US10508199B2 (es)
EP (1) EP3114161B1 (es)
JP (1) JP6964981B2 (es)
KR (1) KR102334119B1 (es)
CN (1) CN106062057B (es)
CA (1) CA2941484A1 (es)
MX (1) MX388803B (es)
WO (1) WO2015132372A1 (es)

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KR102042190B1 (ko) * 2016-12-27 2019-11-07 삼성에스디아이 주식회사 감광성 수지 조성물, 그로부터 형성된 경화막, 및 경화막을 갖는 전자 소자
CN110997789B (zh) * 2017-05-25 2022-10-04 汉高股份有限及两合公司 可固化组合物
EP3421567B1 (de) * 2017-06-28 2024-09-18 Henkel AG & Co. KGaA Uv vorhärtbare epoxid-zusammensetzung für zweistufigen montageprozess
CZ308202B6 (cs) * 2017-09-11 2020-02-26 TESORO Spin off, s.r.o. Flexibilní kompozitní materiály a způsob jejich přípravy a využití
KR102244789B1 (ko) * 2017-12-15 2021-04-26 주식회사 엘지화학 편광판, 편광판-캐리어 필름 적층체, 편광판-캐리어 필름 적층체의 제조방법, 편광판의 제조방법 및 활성 에너지선 경화형 조성물
KR102244791B1 (ko) 2017-12-15 2021-04-26 주식회사 엘지화학 편광판, 편광판-캐리어 필름 적층체, 편광판-캐리어 필름 적층체의 제조방법, 편광판의 제조방법 및 활성 에너지선 경화형 조성물
US10858541B2 (en) * 2017-12-19 2020-12-08 Rohm And Haas Electronic Materials Llc Curable composition
CN107964333B (zh) * 2017-12-29 2020-01-17 中科院广州化学有限公司 一种端氨基反应性含氟聚合物改性水性环氧涂料及其制备与应用
WO2019153108A1 (zh) * 2018-02-06 2019-08-15 株式会社大赛璐 固化性环氧树脂组合物及其固化物
CN108623726B (zh) * 2018-05-15 2020-10-02 闽江学院 三维打印用腰果酚树脂及其制备方法
CN109553766B (zh) * 2018-09-28 2021-11-02 长兴材料工业（广东）有限公司 改性聚酯多元醇及其制备方法与应用
EP4010446B1 (en) * 2019-08-07 2024-12-11 3M Innovative Properties Company Uv curable adhesive composition and adhesive film, adhesive tape, and bonding component comprising thereof
KR102836682B1 (ko) * 2019-09-25 2025-07-18 주식회사 엘지화학 하드 코팅 조성물, 이를 포함하는 광학 적층체 및 플렉서블 디스플레이 장치
BR112022007500A2 (pt) * 2019-11-01 2022-07-12 Cytec Ind Inc Composição iniciadora para ligação adesiva e método de uso da mesma
WO2021112091A1 (ja) * 2019-12-03 2021-06-10 株式会社Adeka 樹脂組成物
CN112680159B (zh) * 2020-12-28 2023-04-07 上海仁速新材料有限公司 一种紫外光固化环氧胶黏剂及其制备方法和应用
CN112831302A (zh) * 2021-01-29 2021-05-25 安田信邦（厦门）电子科技有限公司 一种阳离子环保型半导体底部填充胶及其制备方法
CN118725209B (zh) * 2024-09-02 2024-12-13 上海品诚晶曜光伏科技有限公司 一种高耐候光伏增强预浸料环氧树脂及其制备方法和应用
CN119432283A (zh) * 2024-11-28 2025-02-14 杭州之江有机硅化工有限公司 一种折边胶及其制备方法和应用

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Also Published As

Publication number Publication date
KR102334119B1 (ko) 2021-12-01
WO2015132372A1 (de) 2015-09-11
EP3114161B1 (de) 2023-10-18
US20160376435A1 (en) 2016-12-29
JP6964981B2 (ja) 2021-11-10
MX388803B (es) 2025-03-20
CN106062057A (zh) 2016-10-26
EP3114161A1 (de) 2017-01-11
CN106062057B (zh) 2020-10-30
US10508199B2 (en) 2019-12-17
JP2017508858A (ja) 2017-03-30
KR20160132062A (ko) 2016-11-16
CA2941484A1 (en) 2015-09-11

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