[go: up one dir, main page]

MX2014003844A - Materiales de fosforo y dispositivos relacionados. - Google Patents

Materiales de fosforo y dispositivos relacionados.

Info

Publication number
MX2014003844A
MX2014003844A MX2014003844A MX2014003844A MX2014003844A MX 2014003844 A MX2014003844 A MX 2014003844A MX 2014003844 A MX2014003844 A MX 2014003844A MX 2014003844 A MX2014003844 A MX 2014003844A MX 2014003844 A MX2014003844 A MX 2014003844A
Authority
MX
Mexico
Prior art keywords
phosphor
related devices
phosphor materials
nanometers
presented
Prior art date
Application number
MX2014003844A
Other languages
English (en)
Other versions
MX351531B (es
Inventor
Prasanth Kumar Nammalwar
Digamber Gurudas Porob
Anant Achyut Setlur
Satya Kishore Manepalli
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of MX2014003844A publication Critical patent/MX2014003844A/es
Publication of MX351531B publication Critical patent/MX351531B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D301/00—Preparation of oxiranes
    • C07D301/02—Synthesis of the oxirane ring
    • C07D301/03—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds
    • C07D301/19—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds with organic hydroperoxides
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C1/00—Preparation of hydrocarbons from one or more compounds, none of them being a hydrocarbon
    • C07C1/20—Preparation of hydrocarbons from one or more compounds, none of them being a hydrocarbon starting from organic compounds containing only oxygen atoms as heteroatoms
    • C07C1/24—Preparation of hydrocarbons from one or more compounds, none of them being a hydrocarbon starting from organic compounds containing only oxygen atoms as heteroatoms by elimination of water
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C29/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring
    • C07C29/132—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of an oxygen containing functional group
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C407/00—Preparation of peroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C5/00—Preparation of hydrocarbons from hydrocarbons containing the same number of carbon atoms
    • C07C5/02—Preparation of hydrocarbons from hydrocarbons containing the same number of carbon atoms by hydrogenation
    • C07C5/03—Preparation of hydrocarbons from hydrocarbons containing the same number of carbon atoms by hydrogenation of non-aromatic carbon-to-carbon double bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/617—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
    • C09K11/77214—Aluminosilicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/77742—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/77927—Silicon Nitrides or Silicon Oxynitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00—Gas-discharge or vapour-discharge lamps
    • H01J61/02—Details
    • H01J61/38—Devices for influencing the colour or wavelength of the light
    • H01J61/42—Devices for influencing the colour or wavelength of the light by transforming the wavelength of the light by luminescence
    • H01J61/44—Devices characterised by the luminescent material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2601/00—Systems containing only non-condensed rings
    • C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
    • C07C2601/14—The ring being saturated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)

Abstract

Se presenta un material de fósforo que incluye una combinación de un primer fósforo, un segundo fósforo y un tercer fósforo. El primer fósforo incluye una composición que tiene una fórmula general de RE2-y M1+y A2-y Scy Sin-w GewO12+d: Ce3+, en donde RE se selecciona de un ión de lantánido o Y3+ en donde M se selecciona de Mg, Ca, Sr o Ba, A se selecciona de Mg o Zn; y en donde 0=y=2, 2.5=n=3.5, 0=w=1, y -1.5=d=1.5. El segundo fósforo incluye un fluoruro de complejo dopado con manganeso (Mn4+), y un tercer fósforo incluye una composición de fósforo que tiene un pico de emisión dentro del rango de aproximadamente 520 nanómetros hasta aproximadamente 680 nanómetros. También se presenta un aparato de iluminación que incluye dicho material de fósforo. El aparato de luz incluye una fuente de luz además del material de fósforo.
MX2014003844A 2011-09-30 2012-09-20 Materiales de fosforo y dispositivos relacionados. MX351531B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IN3392CH2011 2011-09-30
PCT/US2012/056299 WO2013048865A1 (en) 2011-09-30 2012-09-20 Phosphor materials and related devices

Publications (2)

Publication Number Publication Date
MX2014003844A true MX2014003844A (es) 2014-04-30
MX351531B MX351531B (es) 2017-10-18

Family

ID=47003241

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014003844A MX351531B (es) 2011-09-30 2012-09-20 Materiales de fosforo y dispositivos relacionados.

Country Status (8)

Country Link
US (1) US9611237B2 (es)
EP (1) EP2760970B1 (es)
JP (1) JP6200891B2 (es)
KR (1) KR101971752B1 (es)
CN (1) CN103827259B (es)
CA (1) CA2848917A1 (es)
MX (1) MX351531B (es)
WO (1) WO2013048865A1 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2014315049B2 (en) * 2013-09-09 2019-03-14 GE Lighting Solutions, LLC Enhanced color-preference light sources
US10381527B2 (en) 2014-02-10 2019-08-13 Consumer Lighting, Llc Enhanced color-preference LED light sources using yag, nitride, and PFS phosphors
DE102015103289A1 (de) * 2014-03-06 2015-09-10 Epistar Corporation Lichtemittierende Vorrichtung
US9929319B2 (en) * 2014-06-13 2018-03-27 General Electric Company LED package with red-emitting phosphors
EP3194530A1 (en) * 2014-09-09 2017-07-26 GE Lighting Solutions, LLC Enhanced color-preference led light sources using yag, nitride, and pfs phosphors
TWI709711B (zh) * 2014-09-16 2020-11-11 美商Ｇｅ照明解決方案公司 增強的色彩偏好光源
KR20160069724A (ko) * 2014-12-09 2016-06-17 엘지이노텍 주식회사 형광체 조성물, 이를 포함하는 발광 소자 패키지 및 조명 장치
KR102355081B1 (ko) 2014-12-26 2022-01-26 삼성전자주식회사 불화물 형광체 제조방법, 백색 발광장치, 디스플레이 장치 및 조명장치
DE102016121692A1 (de) 2016-08-12 2018-02-15 Osram Gmbh Leuchtstoff und Verfahren zur Herstellung eines Leuchtstoffs
US11851596B2 (en) 2016-08-12 2023-12-26 Osram Oled Gmbh Lighting device
US11114591B2 (en) 2016-08-17 2021-09-07 Current Lighting Solutions, Llc Core-shell materials with red-emitting phosphors
WO2019029849A1 (de) * 2016-11-11 2019-02-14 Osram Opto Semiconductors Gmbh Dimmbare lichtquelle
US11342311B2 (en) 2019-03-18 2022-05-24 Intematix Corporation LED-filaments and LED-filament lamps utilizing manganese-activated fluoride red photoluminescence material
CN113826225A (zh) 2019-03-18 2021-12-21 英特曼帝克司公司 包括光致发光层状结构的封装白色发光装置
US11781714B2 (en) 2019-03-18 2023-10-10 Bridgelux, Inc. LED-filaments and LED-filament lamps
CN119208311A (zh) 2019-03-18 2024-12-27 英特曼帝克司公司 Led灯丝
US10468564B1 (en) * 2019-03-18 2019-11-05 Intematix Corporation Packaged white light emitting device comprising photoluminescence layered structure

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2927279B2 (ja) 1996-07-29 1999-07-28 日亜化学工業株式会社 発光ダイオード
JP4032682B2 (ja) 2001-08-28 2008-01-16 三菱化学株式会社 蛍光体
US7026755B2 (en) 2003-08-07 2006-04-11 General Electric Company Deep red phosphor for general illumination applications
US7094362B2 (en) * 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US7573072B2 (en) 2004-03-10 2009-08-11 Lumination Llc Phosphor and blends thereof for use in LEDs
JP2006026283A (ja) 2004-07-21 2006-02-02 Konica Minolta Medical & Graphic Inc 放射線撮影システム
US7497973B2 (en) * 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
WO2006093298A1 (ja) 2005-03-04 2006-09-08 Dowa Electronics Materials Co., Ltd. 蛍光体およびその製造方法、並びに当該蛍光体を用いた発光装置
JP2007048864A (ja) * 2005-08-09 2007-02-22 Nippon Electric Glass Co Ltd 蛍光体複合材料
US8277687B2 (en) 2005-08-10 2012-10-02 Mitsubishi Chemical Corporation Phosphor and light-emitting device using same
US7501753B2 (en) 2005-08-31 2009-03-10 Lumination Llc Phosphor and blends thereof for use in LEDs
TWI422667B (zh) * 2006-05-19 2014-01-11 Mitsubishi Chem Corp 含有氮之合金及使用其之螢光體之製造方法
US8491816B2 (en) * 2008-02-07 2013-07-23 Mitsubishi Chemical Corporation Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
US8703016B2 (en) 2008-10-22 2014-04-22 General Electric Company Phosphor materials and related devices
US8329060B2 (en) * 2008-10-22 2012-12-11 General Electric Company Blue-green and green phosphors for lighting applications
JP2011159809A (ja) 2010-02-01 2011-08-18 Mitsubishi Chemicals Corp 白色発光装置
US20120019126A1 (en) 2010-07-22 2012-01-26 General Electric Company Oxynitride phosphors, method of preparation, and light emitting instrument

Also Published As

Publication number Publication date
US20140231857A1 (en) 2014-08-21
KR20140081842A (ko) 2014-07-01
JP6200891B2 (ja) 2017-09-20
WO2013048865A1 (en) 2013-04-04
JP2015505327A (ja) 2015-02-19
CN103827259A (zh) 2014-05-28
MX351531B (es) 2017-10-18
EP2760970B1 (en) 2015-12-16
CA2848917A1 (en) 2013-04-04
EP2760970A1 (en) 2014-08-06
CN103827259B (zh) 2017-04-26
US9611237B2 (en) 2017-04-04
KR101971752B1 (ko) 2019-04-23

Similar Documents

Publication Publication Date Title
MX2014003844A (es) Materiales de fosforo y dispositivos relacionados.
ES2532265T3 (es) Mezcla aceleradora y método de uso
WO2011140353A3 (en) Remote phosphor tape for lighting units
WO2013072768A3 (en) Synthetic derivatives of mpl and uses thereof
WO2011089571A3 (en) A cosmetic composition including at least one fluorophore compound
WO2011161416A3 (en) Organic light -emitting composition comprising anthranthene derivates and device and method using the same
WO2012064071A3 (ko) 점착제 조성물
EP2361960A3 (en) Fluorescent material and light-emitting device employing the same
MX387093B (es) Composiciones de fosforo resistentes a la humedad y metodos asociados.
MX2007012960A (es) Nuevos materiales usados para emitir luz.
ATE544831T1 (de) Alpha-sialon-leuchtstoff
BRPI0912229A2 (pt) mistura para remoção de oxigênio, composição, artigo, mistura padrão, e, uso de uma mistura
EA201691044A1 (ru) Новый октагидро-циклобута[1,2-c;3,4-c']дипиррол-2-ил
EA201201119A1 (ru) Панель гипсокартона и способ изготовления панели гипсокартона
MY181109A (en) Phosphor compositions and lighting apparatus thereof
WO2010089393A3 (en) Complex salts for light emitting devices
MX385160B (es) Composiciones de fósforo de oxifluoruro y aparato de iluminación de las mismas.
WO2012125552A3 (en) Methods of electric field induced delivery of compounds, compositions used in delivery, and system of delivery
MY183107A (en) Phosphor compositions and lighting apparatus thereof
RU2011102388A (ru) Вяжущее
CY1114110T1 (el) Παραγωγα των διυδροβενζοξαθειαζεπινων, η μεθοδος παρασκευης τους και οι φαρμακευτικες συνθεσεις οι οποιες τα περιεχουν καθως και η χρηση τους ως ρυθμιστων των υποδοχεων αμρα
RU2011151143A (ru) Ароматические блок-сополиэфиркетоны
RU2011147626A (ru) Ароматические блок-сополиэфирсульфоны
WO2011149306A2 (ko) 전이금속 α형 사이알론계 형광체와 그 제조방법
MX353287B (es) Sistema de marcado mediante polvo quimioluminiscente y fluorescente combinado.

Legal Events

Date Code Title Description
FG Grant or registration