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MX2013012263A - Metodo para controlar un proceso de corte por laser y sistema de corte por laser que lo implementa. - Google Patents

Metodo para controlar un proceso de corte por laser y sistema de corte por laser que lo implementa.

Info

Publication number
MX2013012263A
MX2013012263A MX2013012263A MX2013012263A MX2013012263A MX 2013012263 A MX2013012263 A MX 2013012263A MX 2013012263 A MX2013012263 A MX 2013012263A MX 2013012263 A MX2013012263 A MX 2013012263A MX 2013012263 A MX2013012263 A MX 2013012263A
Authority
MX
Mexico
Prior art keywords
laser
laser cutting
workpiece
gas
laser head
Prior art date
Application number
MX2013012263A
Other languages
English (en)
Other versions
MX338115B (es
Inventor
Maurizio Sbetti
Stefano Bertoldi
Daniele Colombo
Barbara Previtali
Giovanni Riva
Matteo Danesi
Tosatti Molinari
Diego Parazzoli
Original Assignee
Adige Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adige Spa filed Critical Adige Spa
Publication of MX2013012263A publication Critical patent/MX2013012263A/es
Publication of MX338115B publication Critical patent/MX338115B/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

De acuerdo con la invención, se controla un proceso de corte por láser utilizando como señal de referencia una o más líneas de emisión que son características de la radiación emitida por un gas (ya sea un gas adyuvante o un gas contaminante) o, de forma más general, mediante un elemento emisor presente en el volumen irradiado por el haz láser enfocado por un cabezal láser (12) y ajustando, en función de esta señal de referencia, al menos uno de los siguientes parámetros de control del proceso: la potencia del láser, la frecuencia y el ciclo de trabajo del pulso láser, la presión de un gas adyuvante emitido por una boquilla (16) que forma parte del cabezal láser (12), la velocidad relativa del cabezal láser (12) con respecto a la pieza (P), la distancia entre el cabezal láser (12) y la superficie (S) de la pieza (P), y la distancia entre el punto focal (F) del láser y la superficie (S) de la pieza (P).
MX2013012263A 2011-04-21 2012-04-20 Metodo para controlar un proceso de corte por laser y sistema de corte por laser que lo implementa. MX338115B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000352A ITTO20110352A1 (it) 2011-04-21 2011-04-21 Metodo per il controllo di un processo di taglio laser e sistema di taglio laser implementante tale metodo
PCT/IB2012/051992 WO2012143899A1 (en) 2011-04-21 2012-04-20 Method for controlling a laser cutting process and laser cutting system implementing the same

Publications (2)

Publication Number Publication Date
MX2013012263A true MX2013012263A (es) 2014-03-05
MX338115B MX338115B (es) 2016-04-01

Family

ID=44554116

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013012263A MX338115B (es) 2011-04-21 2012-04-20 Metodo para controlar un proceso de corte por laser y sistema de corte por laser que lo implementa.

Country Status (20)

Country Link
US (1) US8981258B2 (es)
EP (1) EP2699380B9 (es)
JP (1) JP6063448B2 (es)
KR (1) KR102119190B1 (es)
CN (1) CN103501956B (es)
AU (1) AU2012245901B2 (es)
BR (1) BR112013027102B1 (es)
CA (1) CA2833835C (es)
ES (1) ES2609854T3 (es)
HU (1) HUE030593T2 (es)
IL (1) IL228866A (es)
IT (1) ITTO20110352A1 (es)
MX (1) MX338115B (es)
PL (1) PL2699380T3 (es)
PT (1) PT2699380T (es)
RU (1) RU2607502C2 (es)
SG (1) SG194548A1 (es)
UA (1) UA112079C2 (es)
WO (1) WO2012143899A1 (es)
ZA (1) ZA201307962B (es)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2409808A1 (de) * 2010-07-22 2012-01-25 Bystronic Laser AG Laserbearbeitungsmaschine
EP2883647B1 (de) 2013-12-12 2019-05-29 Bystronic Laser AG Verfahren zur Konfiguration einer Laserbearbeitungsvorrichtung
CN104162582A (zh) * 2014-07-21 2014-11-26 苏州璟瑜自动化科技有限公司 带激光切孔的冲孔装置
RU2578885C2 (ru) * 2014-08-21 2016-03-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева-КАИ" (КНИТУ-КАИ) Оптическая лазерная головка
JP5965454B2 (ja) * 2014-10-14 2016-08-03 株式会社アマダホールディングス ダイレクトダイオードレーザ加工装置及びこれを用いた板金の加工方法
CN105312781A (zh) * 2014-12-08 2016-02-10 牛得草 一种利用气体压力或流量变化检测材料穿透与否的方法
WO2016181359A1 (de) 2015-05-13 2016-11-17 Bystronic Laser Ag Laserbearbeitungsvorrichtung
GB201604097D0 (en) * 2016-03-09 2016-04-20 Spi Lasers Uk Ltd Apparatus and method for controlling laser processing of a material
DE102016208264A1 (de) 2016-05-13 2017-11-16 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zur Überwachung, insbesondere zur Regelung, eines Schneidprozesses
JP6682146B2 (ja) * 2016-12-12 2020-04-15 住友重機械工業株式会社 レーザパルス切出装置及びレーザ加工方法
ES2909148T3 (es) 2016-12-30 2022-05-05 Esab Group Inc Método y aparato de soldadura con provisión de un valor en tiempo real del ciclo de trabajo dinámico
RU180185U1 (ru) * 2017-06-07 2018-06-06 Федеральное государственное бюджетное образовательное учреждение высшего образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева-КАИ" (КНИТУ-КАИ) Лазерная оптическая головка
EP3466597A1 (en) * 2017-10-05 2019-04-10 Synova S.A. Apparatus for machining a workpiece with a laser beam
JP6816071B2 (ja) 2018-08-24 2021-01-20 ファナック株式会社 レーザ加工システム、噴流観測装置、レーザ加工方法、及び噴流観測方法
CN109530933B (zh) * 2018-11-15 2020-11-10 无锡洲翔激光设备有限公司 一种厚板快速穿孔切割小孔的工艺
DE102019103659B4 (de) * 2019-02-13 2023-11-30 Bystronic Laser Ag Gasführung, Laserschneidkopf und Laserschneidmaschine
DE102019106954B4 (de) * 2019-03-19 2025-05-08 Ii-Vi Delaware, Inc. Selbstnivellierender piercing-sensor in einer lichtleitkabelsteckverbindung
CN110014237B (zh) * 2019-04-10 2020-11-10 无锡洲翔激光设备有限公司 一种中厚不锈钢板快速穿孔工艺
CN110170749A (zh) * 2019-05-22 2019-08-27 奔腾激光(温州)有限公司 一种激光切割机超快切割工艺
CN110989334B (zh) * 2019-11-03 2023-07-14 武汉光谷航天三江激光产业技术研究院有限公司 一种激光切割晶圆控制参数动态调节装置
IT202000006880A1 (it) * 2020-04-01 2021-10-01 Adige Spa Sistema ottico combinato per misure dimensionali e termiche, e relativo procedimento di funzionamento
CN112077462A (zh) * 2020-09-17 2020-12-15 伯纳激光科技有限公司 一种应用于碳钢的激光穿孔方法
CN115319404A (zh) * 2021-09-22 2022-11-11 深圳市炜创达科技有限公司 一种绞肉机出料孔板加工工艺及装置
CN113828946B (zh) * 2021-11-08 2024-08-30 耀火智能科技唐山市有限公司 一种激光切割的固定系统
KR102640714B1 (ko) * 2021-12-22 2024-02-27 한국원자력연구원 수중 레이저 절단 장치 및 절단 방법
US20240091883A1 (en) * 2022-09-20 2024-03-21 Ii-Vi Delaware, Inc. Process Monitor for Laser Processing Head
KR20250072046A (ko) * 2023-11-16 2025-05-23 삼성에스디아이 주식회사 레이저 가공 장치 및 방법
CN117871607B (zh) * 2024-03-04 2024-10-01 华南理工大学 一种应用激光热源的热管传热性能测试方法及控制系统
CN118832323B (zh) * 2024-08-23 2025-03-21 江苏永鼎股份有限公司 一种基于光学检测的芯片表面精准打孔工艺及系统
CN119525771B (zh) * 2025-01-20 2025-05-02 湖南兵器光电科技有限公司 一种自适应高能激光模块、破拆装置及破拆方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5451097A (en) * 1977-09-30 1979-04-21 Hitachi Ltd Processing by laser
DE3926859A1 (de) * 1988-12-30 1990-07-05 Fraunhofer Ges Forschung Verfahren und vorrichtung zum bearbeiten von werkstuecken mit laserstrahlung
US5026979A (en) * 1990-03-05 1991-06-25 General Electric Company Method and apparatus for optically monitoring laser materials processing
DE69114399T2 (de) * 1990-08-07 1996-03-21 Amada Co Vorrichtung zum Ermitteln des Schneidzustands bei der Laserstrahlbearbeitung.
US5204517A (en) * 1991-12-24 1993-04-20 Maxwell Laboratories, Inc. Method and system for control of a material removal process using spectral emission discrimination
DE4331262C2 (de) * 1993-09-15 1996-05-15 Wissner Rolf Lasermaschine zur Bearbeitung eines Werkstücks und Verfahren zur Steuerung einer Lasermaschine
DE19607376C2 (de) * 1996-02-27 1998-02-19 Thyssen Laser Technik Gmbh Verfahren zum Laserstrahlschneiden von Werkstücken
JP2001138082A (ja) * 1999-11-05 2001-05-22 Amada Co Ltd レーザ切断加工制御方法および装置
NL1018403C1 (nl) * 2000-10-05 2002-04-08 Boschman Tech Bv Werkwijze voor het onder toepassing van een laser snijden van een composietstructuur met een of meer elektronische componenten.
DE10060407C2 (de) * 2000-12-05 2003-04-30 Lpkf Laser & Electronics Ag Vorrichtung zum Laserstrahlbohren
JP3792683B2 (ja) * 2003-07-16 2006-07-05 ファナック株式会社 レーザ溶接装置
JP4349075B2 (ja) * 2003-10-28 2009-10-21 パナソニック電工株式会社 レーザ加工方法及び加工状態判断方法
WO2007124765A1 (de) * 2006-04-28 2007-11-08 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laserbearbeitungsmaschine und laserbearbeitungsverfahren
CN100475414C (zh) * 2007-06-29 2009-04-08 华中科技大学 三维激光焊接和切割过程的实时监测装置
JP5011072B2 (ja) * 2007-11-21 2012-08-29 株式会社ディスコ レーザー加工装置
RU2375162C2 (ru) * 2007-11-30 2009-12-10 Игорь Владимирович Монаенков Способ автоматического регулирования процесса лазерной резки или прошивки отверстий и устройство для его осуществления
JP2009194176A (ja) * 2008-02-14 2009-08-27 Toshiba Corp 固体レーザ装置及びレーザ加工方法
US8199321B2 (en) * 2008-05-05 2012-06-12 Applied Spectra, Inc. Laser ablation apparatus and method
JP2010240689A (ja) * 2009-04-06 2010-10-28 Miyachi Technos Corp レーザ加工方法及びレーザ加工装置
JP2010274278A (ja) * 2009-05-27 2010-12-09 Nippon Sharyo Seizo Kaisha Ltd レーザ加工機
JP5466910B2 (ja) * 2009-09-29 2014-04-09 芝浦メカトロニクス株式会社 レーザ加工方法およびレーザ加工装置
WO2011056892A1 (en) * 2009-11-03 2011-05-12 Applied Spectra, Inc. Method for real-time optical diagnostics in laser ablation and laser processing of layered and structured materials
US8309883B2 (en) * 2010-05-20 2012-11-13 Ipg Photonics Corporation Methods and systems for laser processing of materials
RU98963U1 (ru) * 2010-06-03 2010-11-10 Общество с ограниченной ответственностью "Страж-Лазер" (ООО "Страж-Лазер") Устройство для лазерной резки малоразмерных отверстий произвольной формы в толстых листах высокоотражающих металлов
WO2012005816A2 (en) * 2010-06-30 2012-01-12 Resonetics Llc Precision laser ablation
US9120181B2 (en) * 2010-09-16 2015-09-01 Coherent, Inc. Singulation of layered materials using selectively variable laser output
JP6261844B2 (ja) * 2012-02-20 2018-01-17 株式会社ディスコ レーザー加工方法およびレーザー加工装置

Also Published As

Publication number Publication date
BR112013027102A2 (pt) 2020-08-11
RU2607502C2 (ru) 2017-01-10
EP2699380B9 (en) 2016-11-23
ITTO20110352A1 (it) 2012-10-22
EP2699380B1 (en) 2016-07-27
MX338115B (es) 2016-04-01
JP6063448B2 (ja) 2017-01-18
SG194548A1 (en) 2013-12-30
CN103501956A (zh) 2014-01-08
CN103501956B (zh) 2015-11-25
RU2013151684A (ru) 2015-05-27
IL228866A (en) 2017-04-30
PL2699380T3 (pl) 2017-02-28
AU2012245901A1 (en) 2013-11-28
ES2609854T3 (es) 2017-04-24
IL228866A0 (en) 2013-12-31
CA2833835A1 (en) 2012-10-26
EP2699380A1 (en) 2014-02-26
UA112079C2 (uk) 2016-07-25
ZA201307962B (en) 2015-01-28
WO2012143899A1 (en) 2012-10-26
US20140034614A1 (en) 2014-02-06
JP2014512273A (ja) 2014-05-22
CA2833835C (en) 2019-03-12
BR112013027102B1 (pt) 2021-04-06
US8981258B2 (en) 2015-03-17
KR102119190B1 (ko) 2020-06-29
HUE030593T2 (en) 2017-05-29
PT2699380T (pt) 2016-09-23
AU2012245901B2 (en) 2015-05-14
KR20140021640A (ko) 2014-02-20

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